Abstract: An opto-electric hybrid board for an optical communication module in which an electric circuit part E including a pad for mounting an optical element, a pad for an optical element driving device, and an electrical interconnect line Y including an interconnect line portion A connecting the pads is provided on a first surface side of an insulative layer, and in which an optical waveguide W is on a second surface side of the insulative layer. A portion of a coverlay covering the electric circuit part E which overlaps the interconnect line portion A is removed to form an opening. The interconnect line portion A exposed through the opening is used as a terminal for a burn-in test of an optical element.

Abstract: In an opto-electric hybrid board, an electric circuit part E is provided on a first surface side of an insulative layer, and includes pads for mounting an optical element, pads for a driving device for the optical element, and electrical interconnect lines Y including interconnect line portions A connecting the pads. A metal reinforcement layer and an optical waveguide W partially overlapping the metal reinforcement layer are provided on a second surface side of the insulative layer. A portion of the metal reinforcement layer which faces the interconnect line portions A on the opposite side of the insulative layer therefrom is removed to form an opening. This opto-electric hybrid board is capable of transmitting higher-frequency electric signals because the influence of the metal reinforcement layer on electrical properties is suppressed.

Abstract: An optical communication module substrate includes a wiring board and an opto-electronic hybrid substrate, the wiring board and the opto-electronic hybrid substrate being connected to each other, in which a connection terminal of the wiring board and a connection terminal of the opto-electronic hybrid substrate are electrical connection points, and a frame-shaped removal portion is formed by removing a portion of the metal reinforcing layer of the opto-electronic hybrid substrate that faces the connection terminal with the insulating layer interposed between the metal reinforcing layer and the connection terminal, so as to surround each terminal. According to this configuration, the connection strength at the connection point between the wiring board and the opto-electronic hybrid substrate is sufficiently ensured, and the optical communication module substrate has excellent electrical properties that are compatible with high-speed signal transmission.

Abstract: In a step of forming a conductive pattern, a photoresist is exposed a plurality of times while a fourth mask including a fourth light shielding mark and a fifth mask including a sixth light shielding mark are sequentially arranged in a longitudinal direction, and the photoresist is developed to form a plating resist, and the plating is carried out using this. In a step of exposing the plating resist, in the photoresist, an opposing portion of the fourth mask at the time of the first exposure is overlapped with the fifth mask at the time of the second exposure. A first conductive mark is formed by the first exposure of the photoresist through the fourth light shielding mark and by plating using the plating resist. A third conductive mark is formed by the second exposure of the photoresist through the fifth mask and by plating using the plating resist.