Patents by Inventor Masatami Iwaki

Masatami Iwaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for chamfering wafer
    Patent number: 6431961
    Abstract: A grindstone and a wafer are rotated at high speeds in the same direction. The rotating wafer is slowly moved toward the rotating grindstone to thereby gradually chamfer the periphery of the wafer.
    Type: Grant
    Filed: February 23, 2000
    Date of Patent: August 13, 2002
    Assignee: Tokyo Seimitsu Co., Ltd.
    Inventors: Ichiro Katayama, Masatami Iwaki, Kazumi Ikeda
  • Apparatus and method for chamfering wafer
    Patent number: 6267648
    Abstract: A grindstone and a wafer are rotated at high speeds in the same direction. The rotating wafer is slowly moved toward the rotating grindstone to thereby gradually chamfer the periphery of the wafer.
    Type: Grant
    Filed: May 14, 1999
    Date of Patent: July 31, 2001
    Assignee: Tokyo Seimitsu Co. Ltd.
    Inventors: Ichiro Katayama, Masatami Iwaki, Kazumi Ikeda