Patents by Inventor Masato Arita

Masato Arita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Grain-oriented electrical steel sheet having excellent insulation coating adhesion without forsterite coating
    Patent number: 11952646
    Abstract: Provided is a grain-oriented electrical steel sheet including a base steel sheet, an intermediate layer which is disposed in contact with the base steel sheet and mainly includes silicon oxide, and an insulation coating which is disposed in contact with the intermediate layer and mainly includes phosphate and colloidal silica, in which the base steel sheet contains predetermined chemical composition, BN having an average particle size of 50 to 300 nm is present, when an emission intensity of B is measured using glow discharge emission analysis, predetermined conditions are satisfied, and a ratio of a major axis to a minor axis of BN is 1.5 or less.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: April 9, 2024
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Masato Yasuda, Yoshihiro Arita, Masaru Takahashi, Yoshiyuki Ushigami, Shohji Nagano
  • Soldering apparatus and method
    Patent number: 8047418
    Abstract: A soldering apparatus including a vessel containing a molten solder, a casing defining therewithin a soldering chamber in which a flat overflowing wave of the molten solder is formed, a conveyor physically integrated with the casing for movement therewith and operable for transferring a printed circuit board through the soldering chamber, actuators and for vertically moving the casing, inert gas feeders for feeding an inert gas to the soldering chamber, and a controller for controlling the operation of the actuators and, so that the printed circuit board is contacted with the surface of the flat overflowing wave in an atmosphere of the inert gas during its passage through the soldering chamber.
    Type: Grant
    Filed: December 8, 2006
    Date of Patent: November 1, 2011
    Assignees: Fujitsu Ten Limited, Sensbey Co., Ltd.
    Inventors: Nobuyuki Aoyama, Kenshi Ikedo, Akira Okuno, Masato Arita
  • APPARATUS AND METHOD FOR SOLDERING FLAT WORK PIECE
    Publication number: 20100264197
    Abstract: A soldering apparatus including a vessel containing a molten solder, a casing defining therewithin a soldering chamber in which a flat overflowing wave of the molten solder is formed, a conveyor physically integrated with the casing for movement therewith and operable for transferring a printed circuit board through the soldering chamber, actuators and for vertically moving the casing, inert gas feeders for feeding an inert gas to the soldering chamber, and a controller for controlling the operation of the actuators and, so that the printed circuit board is contacted with the surface of the flat overflowing wave in an atmosphere of the inert gas during its passage through the soldering chamber.
    Type: Application
    Filed: December 8, 2006
    Publication date: October 21, 2010
    Inventors: Nobuyuki Aoyama, Kenshi Ikedo, Akira Okuno, Masato Arita