Abstract: The purpose of the present invention is to provide an electrolytic Sn or Sn alloy plating solution capable of lowering Pb concentration. An electrolytic Sn or Sn alloy plating solution for forming a plated article for solder bonding, at least comprising: a sulfur-based compound; an Sn salt; one or more types of acids or water-soluble salts thereof selected from inorganic acid, organic acid or water-soluble salt thereof; and a surfactant, wherein the sulfur-based compound is a thiol compound represented by following general formula (Formula. A), a salt of the thiol compound (Formula A), or a disulfide compound (Formula B).

Abstract: An electrolytic tin alloy plating solution contains a compound serving as a source of supply of tin ions, a compound serving as a source of supply of silver ions, an oxide of a nitrogen-containing heterocyclic compound, and a flavonoid compound.

Abstract: To realize a roundness measuring instrument of which the measurement precision when there is eccentricity has been improved.

Abstract: The roughness measuring method and roughness measuring apparatus enable accurate measurement of the surface roughness of a work with no cutoff values specified. An auxiliary storage device storing therein a plurality of cutoff values is included in a data processing apparatus of the roughness measuring apparatus. These cutoff values are read by a CPU. Then, the CPU uses a filter having a plurality of cutoff values to calculate a plurality of temporary evaluation values for each evaluation length corresponding to a plurality of cutoff values from measurement data, and obtains a maximum value out of these temporary evaluation values. Then, the CPU controls an evaluation value outputting device to have this maximum value outputted to a monitor as an effective evaluation value of the roughness of the measurement area in the cutoff value with the calculated maximum value falling within its roughness range.

Abstract: The roughness measuring method and roughness measuring apparatus enable accurate measurement of the surface roughness of a work with no cutoff values specified. An auxiliary storage device storing therein a plurality of cutoff values is included in a data processing apparatus of the roughness measuring apparatus. These cutoff values are read by a CPU. Then, the CPU uses a filter having a plurality of cutoff values to calculate a plurality of temporary evaluation values for each evaluation length corresponding to a plurality of cutoff values from measurement data, and obtains a maximum value out of these temporary evaluation values. Then, the CPU controls an evaluation value outputting device to have this maximum value outputted to a monitor as an effective evaluation value of the roughness of the measurement area in the cutoff value with the calculated maximum value falling within its roughness range.

Abstract: The machine control gage system measures the size of a workpiece through a measuring head while a machining tool machines the workpiece. When the measured size of the workpiece reaches a preset size, the machine control gage system commands the machining tool to stop machining the workpiece. The machine control gage system also performs roundness and surface roughness measurement of the workpiece as well as in-process control functions. On completion of the machining, the machine control gage system obtains and samples shape data on the workpiece through the measuring head and performs a predetermined processing for the sampled data, so that the roundness and surface roughness measurement can be performed automatically.