Patents by Inventor Masato Fujitomo
Masato Fujitomo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220158061Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.Type: ApplicationFiled: January 31, 2022Publication date: May 19, 2022Applicant: NICHIA CORPORATIONInventors: Masato FUJITOMO, Hiroto TAMAKI, Shinji NISHIJIMA, Yuichiro TANDA, Tomohide MIKI
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Patent number: 11271144Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.Type: GrantFiled: December 17, 2018Date of Patent: March 8, 2022Assignee: Nichia CorporationInventors: Masato Fujitomo, Hiroto Tamaki, Shinji Nishijima, Yuichiro Tanda, Tomohide Miki
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Publication number: 20190123253Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.Type: ApplicationFiled: December 17, 2018Publication date: April 25, 2019Applicant: NICHIA CORPORATIONInventors: Masato FUJITOMO, Hiroto TAMAKI, Shinji NISHIJIMA, Yuichiro TANDA, Tomohide MIKI
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Patent number: 10164163Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.Type: GrantFiled: August 31, 2017Date of Patent: December 25, 2018Assignee: Nichia CorporationInventors: Masato Fujitomo, Hiroto Tamaki, Shinji Nishijima, Yuichiro Tanda, Tomohide Miki
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Publication number: 20180006205Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.Type: ApplicationFiled: August 31, 2017Publication date: January 4, 2018Applicant: NICHIA CORPORATIONInventors: Masato FUJITOMO, Hiroto TAMAKI, Shinji NISHIJIMA, Yuichiro TANDA, Tomohide MIKI
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Patent number: 9773959Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.Type: GrantFiled: January 22, 2015Date of Patent: September 26, 2017Assignee: NICHIA CORPORATIONInventors: Masato Fujitomo, Hiroto Tamaki, Shinji Nishijima, Yuichiro Tanda, Tomohide Miki
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Patent number: 9631797Abstract: A light emitting device has a plurality of light emitting elements, a heat spreading member on which the plurality of light emitting elements are mounted, and having a bottom face, an insulating member having a recess that includes side walls and a bottom wall, a top face of the bottom wall being in contact with the bottom face of the heat spreading member, and a circuit board having a circuit that is provided on the heat spreading member and supplies power to the plurality of light emitting elements.Type: GrantFiled: November 18, 2014Date of Patent: April 25, 2017Assignee: NICHIA CORPORATIONInventors: Hiroshi Miyairi, Takayuki Igarashi, Masato Fujitomo, Satoshi Shirahama
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Publication number: 20150153034Abstract: A light emitting device has a plurality of light emitting elements, a heat spreading member on which the plurality of light emitting elements are mounted, and having a bottom face, an insulating member having a recess that includes side walls and a bottom wall, a top face of the bottom wall being in contact with the bottom face of the heat spreading member, and a circuit board having a circuit that is provided on the heat spreading member and supplies power to the plurality of light emitting elements.Type: ApplicationFiled: November 18, 2014Publication date: June 4, 2015Inventors: Hiroshi MIYAIRI, Takayuki IGARASHI, Masato FUJITOMO, Satoshi SHIRAHAMA
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Publication number: 20150129923Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.Type: ApplicationFiled: January 22, 2015Publication date: May 14, 2015Applicant: NICHIA CORPORATIONInventors: Masato FUJITOMO, Hiroto TAMAKI, Shinji NISHIJIMA, Yuichiro TANDA, Tomohide MIKI
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Patent number: 8975100Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.Type: GrantFiled: October 21, 2013Date of Patent: March 10, 2015Assignee: Nichia CorporationInventors: Masato Fujitomo, Hiroto Tamaki, Shinji Nishijima, Yuichiro Tanda, Tomohide Miki
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Publication number: 20140042488Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.Type: ApplicationFiled: October 21, 2013Publication date: February 13, 2014Applicant: NICHIA CORPORATIONInventors: Masato FUJITOMO, Hiroto TAMAKI, Shinji NISHIJIMA, Yuichiro TANDA, Tomohide MIKI
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Patent number: 8604507Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.Type: GrantFiled: September 22, 2011Date of Patent: December 10, 2013Assignee: Nichia CorporationInventors: Masato Fujitomo, Hiroto Tamaki, Shinji Nishijima, Yuichiro Tanda, Tomohide Miki
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Patent number: 8377725Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.Type: GrantFiled: September 8, 2009Date of Patent: February 19, 2013Assignee: Nichia CorporationInventors: Masato Fujitomo, Hiroto Tamaki, Shinji Nishijima, Yuichiro Tanda, Tomohide Miki