Abstract: An electronic control apparatus includes a circuit board with a circuit element mounted thereon, a heatsink for dissipating heat from the circuit board placed thereon, an external terminal having a first end electrically connected to the circuit board and a second end connectable to an external device, a molding resin for covering the circuit board and the first end of the external terminal. The second end of the external terminal is exposed outside the molding resin. The heatsink is at least partially covered with the molding resin. At least one of covered surfaces of the circuit board and the heatsink is at least partially roughened to have a predetermined surface roughness, which allows the circuit board and the heatsink to be tightly attached to the molding resin.

Abstract: A circuit board is disposed on a support plate, with electronic components mounted on this circuit board being accommodated in recessed portions of the support plate. Thermal adhesive members intervene between rear surfaces of the electronic components and bottom surfaces of the recessed portions of the support plate. The support plate has degassing grooves. Furthermore, the support plate has raised portions provided on its upper surface for supporting the circuit board in a floated condition with a gap between them.

Abstract: A circuit board is disposed on a support plate, with electronic components mounted on this circuit board being accommodated in recessed portions of the support plate. Thermal adhesive members intervene between rear surfaces of the electronic components and bottom surfaces of the recessed portions of the support plate. The support plate has degassing grooves. Furthermore, the support plate has raised portions provided on its upper surface for supporting the circuit board in a floated condition with a gap between them.

Abstract: The present invention has an object to enhance the reliability of the electrical connection of a silver-based conductor film on the surface of a glass ceramic board. In order to achieve the object, according to the present invention, by the use of a conductor paste containing a silver particle having a specific surface area of 0.3 m2/g to 3.0 m2/g and no glass, printing is carried out on a glass ceramic board and the conductor paste is fired at a firing temperature having a difference of ±50° C. from a softening temperature of amorphous borosilicate glass contained in the glass ceramic. Consequently, a silver-based conductor film having high reliability of the electrical connection is formed on the ceramic board.

Abstract: An electronic control device includes first and second ceramic substrates housed in a case. The first ceramic substrate has electronic components including a semiconductor component mounted on its surface. The second ceramic substrate is fixed to the top face of the semiconductor component. The second ceramic substrate has electronic components mounted on its bottom surface. A connecting member having wiring members is arranged between the first and the second ceramic substrates. The first ceramic substrate is electrically connected with the second ceramic substrate via the wiring members.

Abstract: The present invention has an object to enhance the reliability of the electrical connection of a silver-based conductor film on the surface of a glass ceramic board. In order to achieve the object, according to the present invention, by the use of a conductor paste containing a silver particle having a specific surface area of 0.3 m2/g to 3.0 m2/g and no glass, printing is carried out on a glass ceramic board and the conductor paste is fired at a firing temperature having a difference of ±50° C. from a softening temperature of amorphous borosilicate glass contained in the glass ceramic. Consequently, a silver-based conductor film having high reliability of the electrical connection is formed on the ceramic board.