Abstract: A cable connection substrate includes: a first substrate that is provided with, on a front surface of the first substrate, a first connection electrode to be connected to a sensor electrode of an imaging element, and provided with a second connection electrode on a back surface side of the first substrate; and a second substrate that is provided with, on a front surface of the second substrate, a third connection electrode to be connected to the second connection electrode, and provided with, on a top surface side of the second substrate, the top surface being a side surface perpendicular to the front surface of the second substrate, a plurality of cable connection electrodes to be connected to a plurality of cables. A sum of effective conductor areas of the plurality of cable connection electrodes is greater than a sum of effective conductor areas of the third connection electrode.

Abstract: A cable connection structure includes: a substrate including a first core wire connection electrode, a second core wire connection electrode, and a shield connection electrode; a single-wire cable including a first core wire, and an insulant; at least two coaxial cables each including a second core wire, an inner insulant, a shield, and an outer insulant, wherein the second core wire, the inner insulant, and the shield are exposed in a step-by-step manner at a distal end portion, and the second core wire and the shield are respectively connected to the second core wire connection electrode and the shield connection electrode; and a conductive member connecting exposed portions of the shields. The conductive member is disposed directly on an upper surface of the insulant, and connects the shields on the shield connection electrode and/or a position closer to a proximal end side than the shield connection electrode.

Abstract: A cable structure includes: a plurality of cables each including a conductor part and an electrically-insulative covering part, each conductor part being exposed in a part where the covering part at one end thereof is removed; and a cable fixing part formed by resin molding and configured to hold the plurality of cables while the ends of the plurality of cables exposing the conductor parts are aligned, wherein the cable fixing part includes a bottom face opening formed on a bottom face side facing a member to which the cables are connected and a top face opening formed on a top face side opposing the bottom face, the bottom face side and the top face side exposing the conductor parts.

Abstract: Provided is a powdered paint containing powdered particles and inorganic particles, the powdered paint having an attenuation factor AF[30-300] (%) represented by an absolute value of [(Q30?Q300)/Q30] is 30% or more and 60% or less, wherein Q30 represents electric charge amount in an adherent layer including 100 g/m2 of the powdered paint adhered to a substrate 30 seconds after forming the adherent layer, and Q300 represents electric charge amount in the adherent layer 300 seconds after forming the adherent layer.

Abstract: A cable connection structure includes: a cable having a core and a jacket made of an insulating material to cover the core; and a substrate connected with the cable. The substrate includes: a base material made of an insulating material; an external connection electrode formed on a surface of the base material and connected with the core; and a via provided in the base material and having an end exposed from a mounting surface of the substrate on which the cable is mounted, the via being connected with the external connection electrode. The via is provided at least at one of both ends of a surface of the external connection electrode perpendicular to an axial direction of the cable, on a proximal end side of the cable.

Abstract: A semiconductor device includes: a semiconductor chip that has a first connection terminal for wiring connection; a substrate that has a second connection terminal for wiring connection, the second connection terminal being electrically connected to the first connection terminal; and a reflective surface that reflects light from the first connection terminal and the second connection terminal in a thickness direction of the substrate or the semiconductor chip.

Abstract: A cable structure includes: a plurality of cables each including a conductor part and an electrically-insulative covering part, each conductor part being exposed in a part where the covering part at one end thereof is removed; and a cable fixing part formed by resin molding and configured to hold the plurality of cables while the ends of the plurality of cables exposing the conductor parts are aligned, wherein the cable fixing part includes a bottom face opening formed on a bottom face side facing a member to which the cables are connected and a top face opening formed on a top face side opposing the bottom face, the bottom face side and the top face side exposing the conductor parts.

Abstract: An imaging device includes: a group of lenses configured to collect incident light; a lens supporting member including a fitting portion into which the group of lenses is fitted; a prism configured to reflect light collected by the group of lenses; and an image sensor having a light receiving unit configured to receive the light reflected by the prism and to perform a photoelectric conversion on the received light to generate an electric signal. The lens supporting member has a cutout or an opening portion into which the prism is fitted. The lens supporting member is connected to a surface of the image sensor where the prism is mounted.

Abstract: A cable connection substrate includes: a first substrate that is provided with, on a front surface of the first substrate, a first connection electrode to be connected to a sensor electrode of an imaging element, and provided with a second connection electrode on a back surface side of the first substrate; and a second substrate that is provided with, on a front surface of the second substrate, a third connection electrode to be connected to the second connection electrode, and provided with, on a top surface side of the second substrate, the top surface being a side surface perpendicular to the front surface of the second substrate, a plurality of cable connection electrodes to be connected to a plurality of cables. A sum of effective conductor areas of the plurality of cable connection electrodes is greater than a sum of effective conductor areas of the third connection electrode.

Abstract: A powder coating material includes powder particles that include a binder resin, have an average circularity of 0.97 or greater, and have a coloring pigment provided on a surface of the powder particles.

Abstract: Provided is a powdered paint containing powdered particles and inorganic particles, the powdered paint having an attenuation factor AF[30-300] (%) represented by an absolute value of [(Q30?Q300)/Q30] is 30% or more and 60% or less, wherein Q30 represents electric charge amount in an adherent layer including 100 g/m2 of the powdered paint adhered to a substrate 30 seconds after forming the adherent layer, and Q300 represents electric charge amount in the adherent layer 300 seconds after forming the adherent layer.

Abstract: A cable connection structure includes: a substrate including a first core wire connection electrode, a second core wire connection electrode, and a shield connection electrode; a single-wire cable including a first core wire, and an insulant; at least two coaxial cables each including a second core wire, an inner insulant, a shield, and an outer insulant, wherein the second core wire, the inner insulant, and the shield are exposed in a step-by-step manner at a distal end portion, and the second core wire and the shield are respectively connected to the second core wire connection electrode and the shield connection electrode; and a conductive member connecting exposed portions of the shields. The conductive member is disposed directly on an upper surface of the insulant, and connects the shields on the shield connection electrode and/or a position closer to a proximal end side than the shield connection electrode.

Abstract: A semiconductor device includes: a semiconductor chip that has a first connection terminal for wiring connection; a substrate that has a second connection terminal for wiring connection, the second connection terminal being electrically connected to the first connection terminal; and a reflective surface that reflects light from the first connection terminal and the second connection terminal in a thickness direction of the substrate or the semiconductor chip.

Abstract: A powder coating apparatus includes: a transport device that transports an object to be coated; an applying unit disposed to be opposed to a surface to be coated of the transported object to be coated and applying a charged thermosetting powder coating material onto the surface to be coated of the object to be coated, that includes an applying section including a cylindrical or columnar applying member that is disposed to be separated from the surface to be coated of the object to be coated, and a supplying section including a cylindrical or columnar supplying member that supplies the powder coating material onto the surface of the applying member; a voltage applying device; and a heating device.

Abstract: A thermosetting powder coating material includes a powder particle containing a thermosetting resin and a thermosetting agent and has a volume particle size distribution index GSDv of less than 1.20 and an average circularity of not less than 0.96.

Abstract: An imaging device includes: an optical system configured to concentrate incident light; an image sensor configured to receive the light entering from the optical system and perform photoelectric conversion to generate an electrical signal; a flexible printed board on which a signal cable and an electronic component are mounted, the flexible printed board being connected to an electronic pad of the image sensor; and a light-shielding member arranged between the optical system and the image sensor, a part of the light-shielding member being folded or bent to be in contact with a side surface of the optical system, and the light-shielding member being configured to shield the light entering from a direction of the side surface of the optical system and/or from between the optical system and the image sensor. The light-shielding member is a board including a circuit layer and electrically conducting with the flexible printed board.

Abstract: A multi-chip semiconductor device includes a plate-shaped first semiconductor chip having a first connection portion in which a first semiconductor chip electrode is formed on a first main surface of the first semiconductor chip or on a first side surface vertical to the first main surface, and a plate-shaped second semiconductor chip having a second connection portion in which a second semiconductor chip electrode is formed on a second side surface vertical to a second main surface of the second semiconductor chip. Each of the first and second connection portions includes at least an inclined surface that is inclined with respect to each of the first and second main surfaces. The first connection portion and the second connection portion are connected to each other such that the first main surface of the first semiconductor chip and the second main surface of the second semiconductor chip are vertical to each other.

Abstract: An image forming apparatus includes a body having a port, an image forming section positioned further than the center of the body toward a first side while including an image forming unit that forms an image on a medium by a developer including an additive and a fixing unit that heats and fixes the image onto the medium, a duct extending from the vicinity of the fixing unit to a position further than the center of the body toward a second side, a connecting portion connected to a portion of the duct, which is farthest from the fixing unit, and the port on the second side while being wider than the duct such that a flow velocity of a gas inside the connecting portion is less than that inside the duct, and a moving unit that moves the gas from the fixing unit to the connecting portion through the duct.

Abstract: An image forming apparatus includes a body having a port, an image forming section positioned further than the center of the body toward a first side while including an image forming unit that forms an image on a medium by a developer including an additive and a fixing unit that heats and fixes the image onto the medium, a duct extending from the vicinity of the fixing unit to a position further than the center of the body toward a second side, a connecting portion connected to a portion of the duct, which is farthest from the fixing unit, and the port on the second side while being wider than the duct such that a flow velocity of a gas inside the connecting portion is less than that inside the duct, and a moving unit that moves the gas from the fixing unit to the connecting portion through the duct.

Abstract: An electrostatic powder coating method includes spraying a charged powder coating material that includes powder particles which contain a thermosetting resin and a thermosetting agent, and which have an average circularity of 0.940 to 0.950 to electrostatically attach the powder coating material to an object to be coated; and heating the powder coating material that is electrostatically attached to the object to be coated to thereby form a coating film, wherein an average circularity Sc of the powder particles in the powder coating material that is electrostatically attached to the object to be coated and an average circularity So of the powder particles in the powder coating material before being sprayed satisfy a relationship of Expression: So×0.90?Sc?So×1.05.