Abstract: There is provided an inspection method that includes determining, as a reference blur component, the magnitude of the blur component of a range, the range being a range where a number of first inspection images among the plurality of inspection images falling within the range is the largest among a plurality of ranges. The inspection method includes correcting, based on the reference blur component, a second inspection image among the plurality of inspection images having the magnitude of the blur component falling outside the range. The inspection method includes comparing the first inspection image and the corrected second inspection image with a reference image, the first inspection image having the magnitude of the blur component falling within the predetermined range, the reference image being generated in advance for the measurement object.

Abstract: According to one embodiment, there is provided an inspection method that includes determining, as a reference blur component, the magnitude of the blur component of a predetermined range, the predetermined range being a range where a number of first inspection images among the plurality of inspection images falling within the predetermined range is the largest among a plurality of ranges. The inspection method includes correcting, based on the reference blur component, a second inspection image among the plurality of inspection images having the magnitude of the blur component falling outside the predetermined range. The inspection method includes comparing the first inspection image and the corrected second inspection image with a reference image, the first inspection image having the magnitude of the blur component falling within the predetermined range, the reference image being generated in advance for the measurement object.

Abstract: An original plate manufacturing method includes preparing first design data and second design data from a predetermined pattern to be formed on a target object. The first design data corresponds to a first design pattern, and the second design data corresponds to a second design pattern. The first and second design patterns are complementary portions of the predetermined pattern. The first design pattern is then formed on the target object based on the first design data. An inspection is performed on the target object on which the first design pattern has been formed. Third design data is generated based on a result of the inspection. The second design data is then adjusted based on the third design data to generate corrected second design data. The target object is then patterned again based on the corrected second design data.

Abstract: A method for detecting coordinates includes detecting a first position in an inspection target placed on a placement surface of an inspection stage and a second position in the inspection target separated from the first position. A coordinate shift from the first position to the second position includes a first shift component in a first direction taken along the placement surface, and a second shift component in a second direction taken along the placement surface and crossing the first direction. The method further includes calculating a coordinate in the first direction of the second position using a first function, the first function including the first shift component and the second shift component as variables; and calculating a coordinate in the second direction of the second position using a second function, the second function including the first shift component and the second shift component as variables.

Abstract: A substrate cleaning method includes: steps (a) to (d). In step (a), a liquid is supplied onto a nanoimprint template substrate that has a patterned surface with foreign particles to form a liquid film on the patterned surface. In step (b), the liquid film is solidified to form a solidified film including the foreign particles. In step (c), the substrate is reversed. In step (d), the solidified film is melted to remove the foreign particles.

Abstract: An inspection device according to an embodiment includes a microscope, a storage section, an image processing section and an inspection section. The microscope is configured to obtain a primary image by capturing an inspection target. The storage section stores a function defining a relationship between a low-resolution image and a high-resolution image of a calibration sample. The high-resolution image has smaller pixel size than the low-resolution image. The image processing section is configured to generate a secondary image based on the primary image by using the function. The secondary image has smaller pixel size than the primary image. The inspection section is configured to inspect the inspection target using the secondary image.

Abstract: A method for detecting coordinates includes detecting a first position in an inspection target placed on a placement surface of an inspection stage and a second position in the inspection target separated from the first position. A coordinate shift from the first position to the second position includes a first shift component in a first direction taken along the placement surface, and a second shift component in a second direction taken along the placement surface and crossing the first direction. The method further includes calculating a coordinate in the first direction of the second position using a first function, the first function including the first shift component and the second shift component as variables; and calculating a coordinate in the second direction of the second position using a second function, the second function including the first shift component and the second shift component as variables.

Abstract: A substrate cleaning method includes: steps (a) to (d). In step (a), a liquid is supplied onto a nanoimprint template substrate that has a patterned surface with foreign particles to form a liquid film on the patterned surface. In step (b), the liquid film is solidified to form a solidified film including the foreign particles. In step (c), the substrate is reversed. In step (d), the solidified film is melted to remove the foreign particles.

Abstract: An inspection apparatus includes beam generation means, a primary optical system, a secondary optical system and an image processing system. Irradiation energy of the beam is set in an energy region where mirror electrons are emitted from the inspection object as the secondary charged particles due to the beam irradiation. The secondary optical system includes a camera for detecting the secondary charged particles, a numerical aperture whose position is adjustable along an optical axis direction and a lens that forms an image of the secondary charged particles that have passed through the numerical aperture on an image surface of the camera. In the image processing system, the image is formed under an aperture imaging condition where the position of the numerical aperture is located on an object surface to acquire an image.

Abstract: An inspection device according to an embodiment includes a microscope, a storage section, an image processing section and an inspection section. The microscope is configured to obtain a primary image by capturing an inspection target. The storage section stores a function defining a relationship between a low-resolution image and a high-resolution image of a calibration sample. The high-resolution image has smaller pixel size than the low-resolution image. The image processing section is configured to generate a secondary image based on the primary image by using the function. The secondary image has smaller pixel size than the primary image. The inspection section is configured to inspect the inspection target using the secondary image.

Abstract: An inspection apparatus includes beam generation means, a primary optical system, a secondary optical system and an image processing system. Irradiation energy of the beam is set in an energy region where mirror electrons are emitted from the inspection object as the secondary charged particles due to the beam irradiation. The secondary optical system includes a camera for detecting the secondary charged particles, a numerical aperture whose position is adjustable along an optical axis direction and a lens that forms an image of the secondary charged particles that have passed through the numerical aperture on an image surface of the camera. In the image processing system, the image is formed under an aperture imaging condition where the position of the numerical aperture is located on an object surface to acquire an image.

Abstract: According to an embodiment, a reflective photomask includes a substrate, a first layer on the substrate and a second layer on the first layer. The first layer is capable of receiving a first light, and emitting electrons. The second layer has an opening of a predetermined pattern, and is capable of reflecting a second light.

Abstract: An inspection apparatus includes beam generation means, a primary optical system, a secondary optical system and an image processing system. Irradiation energy of the beam is set in an energy region where mirror electrons are emitted from the inspection object as the secondary charged particles due to the beam irradiation. The secondary optical system includes a camera for detecting the secondary charged particles, a numerical aperture whose position is adjustable along an optical axis direction and a lens that forms an image of the secondary charged particles that have passed through the numerical aperture on an image surface of the camera. In the image processing system, the image is formed under an aperture imaging condition where the position of the numerical aperture is located on an object surface to acquire an image.

Abstract: An inspection apparatus includes beam generation means, a primary optical system, a secondary optical system and an image processing system. Irradiation energy of the beam is set in an energy region where mirror electrons are emitted from the inspection object as the secondary charged particles due to the beam irradiation. The secondary optical system includes a camera for detecting the secondary charged particles, a numerical aperture whose position is adjustable along an optical axis direction and a lens that forms an image of the secondary charged particles that have passed through the numerical aperture on an image surface of the camera. In the image processing system, the image is formed under an aperture imaging condition where the position of the numerical aperture is located on an object surface to acquire an image.

Abstract: According to one embodiment, a mask inspection apparatus includes a decompression chamber, a holder, a light irradiation unit, a detection unit, an electrode, and a control unit. The holder is provided in the decompression chamber and holds a mask. The light irradiation unit irradiates a major surface of the mask held by the holder with a light. The detection unit is provided in the decompression chamber to detect electrons generated when the major surface of the mask is irradiated with the light. The electrode is provided between the holder and the detection unit and guides the electrons in a direction from the holder toward the detection unit. The control unit compares a detection result of the electrons detected by the detection unit with a reference value.

Abstract: According to one embodiment, a mask inspection apparatus includes a decompression chamber, a holder, a light irradiation unit, a detection unit, an electrode, and a control unit. The holder is provided in the decompression chamber and holds a mask. The light irradiation unit irradiates a major surface of the mask held by the holder with a light. The detection unit is provided in the decompression chamber to detect electrons generated when the major surface of the mask is irradiated with the light. The electrode is provided between the holder and the detection unit and guides the electrons in a direction from the holder toward the detection unit. The control unit compares a detection result of the electrons detected by the detection unit with a reference value.