Patents by Inventor Masato Nakanishi

Masato Nakanishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050078450
    Abstract: A water-cooling device for cooling a heat-generating element within an electronic apparatus. The water-cooling device includes a water-cooling jacket which is thermally connectable with the heat-generating element, a heat-radiation pipe, a tank, and a liquid driver which forms a circulation flow passage through which a cooling liquid flows. At least one of the water-cooling jacket, the heat-radiation pipe, the tank and the liquid driver is attached on a plate, and the water-cooling device is detachable with respect to the heat-generating element by the plate.
    Type: Application
    Filed: October 20, 2004
    Publication date: April 14, 2005
    Inventors: Shigeo Ohashi, Yoshihiro Kondo, Rintaro Minamitani, Takashi Naganawa, Yuuji Yoshitomi, Masato Nakanishi, Hajime Katou, Tsuyoshi Nakagawa
  • Publication number: 20050047083
    Abstract: An electronic module which is detachably mounted on electronic equipment. The electronic module includes a board having a heat generator mounted on a surface thereof, and a cooling jacket which is integrally attached to the electronic module. The cooling jacket is thermally coupled to the heat generator and has a passage of a cooling fluid therewithin.
    Type: Application
    Filed: October 13, 2004
    Publication date: March 3, 2005
    Inventors: Yoshihiro Kondo, Shigeo Ohashi, Rintaro Minamitani, Takashi Naganawa, Yuji Yoshitomi, Masato Nakanishi, Yasuhiko Sasaki, Tsuyoshi Nakagawa, Osamu Suzuki, Shinji Matsushita, Yasunori Yamada
  • Patent number: 6847113
    Abstract: An electronic apparatus, including a plate-like member, enclosing a heat-accumulating material of latent heat type within an inside thereof; a semiconductor element, being connected with the member, thermally; and a housing covering the semiconductor element and the member. A surface of the member, in contact with the semiconductor element, is provided with recess-portions in plural numbers thereof, each being recessed in a direction of the heat-accumulating material of latent heat type, so as to enclose the heat-accumulating material of latent heat type into the recess portions. The plate-like member and the housing are connected with each other, thermally, thereby providing a cooling device, being able to cool the electronic circuit component(s) building up the electronic apparatus, as well as being superior in operability.
    Type: Grant
    Filed: April 22, 2003
    Date of Patent: January 25, 2005
    Assignee: Hitachi, Ltd.
    Inventors: Masato Nakanishi, Shigeo Ohashi, Shigeki Hirasawa
  • Publication number: 20050007730
    Abstract: In the structure of an electronic apparatus, in which cooling of an heat-generating element is achieved through circulation of a liquid, in particular, for providing the structure of being high in cooling performance and reliability, wherein a heat-radiation pipe 9 is connected to a heat-radiation plate 10 disposed in a rear surface of a display 2, while thermally connecting a water-cooling jacket 8 with the heat-generating element 7, thereby circulating a coolant liquid between the water-cooling jacket 8 and the heat-radiation pipe 9 by means of a liquid driving device 11. The water-cooling jacket 8 can be formed in one body of a jacket base and a flow passage therein through the die-cast forming thereof, or can be constructed in one body with the water-cooling jacket and the flow passage of piping, through connection between the jacket base and the metal pipe.
    Type: Application
    Filed: July 10, 2002
    Publication date: January 13, 2005
    Inventors: Shigeo Ohashi, Yoshihiro Kondo, Rintaro Minamitani, Takashi Naganawa, Yuuji Yoshitomi, Masato Nakanishi, Yasuhiko Sasaki, Tsuyoshi Nakagawa
  • Publication number: 20040228092
    Abstract: An electronic apparatus includes a case mounting a semiconductor element within an inside thereof, a heat-receiving member thermally connected with the semiconductor element, a heat-radiation member disposed on an inner side surface of the casing, and a liquid driver for driving a liquid coolant between the heat-radiation member and the heat-receiving member. The apparatus further includes a tank accumulating the liquid coolant therein with at least a predetermined volume of the coolant to delimit a coolant surface within the tank, wherein the tank, the heat-radiation member and the heat-receiving member are connected with tubes, and a suction end portion of a suction pipe connected into the tank is located at a position which is always below the coolant surface irrespective of change of position of the tank.
    Type: Application
    Filed: June 24, 2004
    Publication date: November 18, 2004
    Inventors: Yoshihiro Kondo, Shinji Matsushita, Shigeo Ohashi, Takashi Naganawa, Rintaro Minamitani, Tsuyoshi Nakagawa, Yuuji Yoshitomi, Masato Nakanishi, Hajime Katou
  • Patent number: 6808014
    Abstract: A cooling device for an electronic apparatus, comprising: a heat generating element attached within a first housing; a heat receiving jacket, being connected with said heat generating element, and being attached within said first housing; a second housing being rotatably supported on said first housing; a first heat exchanger attached within said second housing, for exchanging heat between an outside; and a liquid driving means for supplying a cooling liquid to said heat receiving jacket, wherein a portion of a pipe for connecting between said heat receiving means, said first heat exchanger, and said liquid driving means is made of a flexible tube made of a resin, and further wherein, a second heat exchanger and an ion exchanger are provided in a part of said pipe, said second housing is received within said second housing, and said ion exchanger is received within said second housing.
    Type: Grant
    Filed: May 1, 2003
    Date of Patent: October 26, 2004
    Assignee: Hitachi, Ltd
    Inventors: Rintaro Minamitani, Shigeo Ohashi, Yoshihiro Kondo, Yuji Yoshitomi, Takashi Naganawa, Masato Nakanishi, Tsuyoshi Nakagawa
  • Patent number: 6809927
    Abstract: In the structure of an electronic apparatus, in which cooling of an heat-generating element is conducted through circulation of a liquid, in particular, for providing a liquid-cooling structure of being high in reliability, while also considering safety and assembling property into the consideration, wherein a water-cooling jacket 8 is thermally connected with a heat-generating element 7, while thermally connecting a heat-radiation pipe 9 with a heat-radiation plate 10 provided on a rear surface of a display 2, wherein a coolant liquid is circulated between the water-cooling jacket 8 and the heat-radiation pipe 9, by means of a liquid driving device 11. The heat-radiation pipe 9 is connected onto a whole area of the heat-radiation plate, like crawling thereupon. A tank 14 is provided in an upper portion of the heat-radiation plate 10, and is connected with the heat-radiation pipe 9.
    Type: Grant
    Filed: May 9, 2003
    Date of Patent: October 26, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Shigeo Ohashi, Yoshihiro Kondo, Rintaro Minamitani, Takashi Naganawa, Yuuji Yoshitomi, Masato Nakanishi, Hajime Katou, Tsuyoshi Nakagawa
  • Patent number: 6807056
    Abstract: A plurality of electronic apparatuses, each apparatus having a closed loop cooling system, are installed in a cabinet having another closed loop fluid cooling system. Each of the closed loop fluid cooling systems includes a heat receiver and a pump. A projection is mounted on the electronic apparatus and a switching valve is arranged on the cabinet to stop or start circulation of a cooling fluid.
    Type: Grant
    Filed: July 18, 2003
    Date of Patent: October 19, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Yoshihiro Kondo, Shigeo Ohashi, Rintaro Minamitani, Takashi Naganawa, Yuji Yoshitomi, Masato Nakanishi, Yasuhiko Sasaki, Tsuyoshi Nakagawa, Osamu Suzuki, Shinji Matsushita, Yasunori Yamada
  • Patent number: 6757169
    Abstract: In an electronic equipment or apparatus, having water-cooling structure able to circulate/supply a cooling liquid with stability, for dealing with an increase of heat-generation of a heat-generating element, accompanying with an increase of processing performances, a pipe, which is located at a side where the cooling water flows out from a tank building up the water-cooling system, is extended up to the position of a center of the tank and disposed therein. Also, two (2) pieces of plates are provided for dividing the vicinity of an inlet portion of a pipe, through which the cooling water flows out, within the tank, and further, when injecting the cooling water into the tank, an injection jig for the cooling water is used, which has a connector portion with the tank.
    Type: Grant
    Filed: May 6, 2003
    Date of Patent: June 29, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Yoshihiro Kondo, Shinji Matsushita, Shigeo Ohashi, Takashi Naganawa, Rintaro Minamitani, Tsuyoshi Nakagawa, Yuuji Yoshitomi, Masato Nakanishi, Hajime Katou
  • Publication number: 20040056348
    Abstract: An electronic apparatus, comprising: a plate-like container, enclosing a heat-accumulating material of latent heat type within an inside thereof; a semiconductor element, being connected with said container, thermally; and a housing covering said semiconductor element and said container, wherein a surface of said container, in contact with said semiconductor element, is provided with recess portions in plural numbers thereof, each being recessed in a direction of said heat-accumulating material of latent heat type, so as to enclose said heat-accumulating material of latent heat type into said recess portions, and said plate-like container and said housing are connected with each other, thermally, thereby providing a cooling device, being able to cool the electronic circuit component(s) building up the electronic apparatus, as well as being superior in operability.
    Type: Application
    Filed: April 22, 2003
    Publication date: March 25, 2004
    Inventors: Masato Nakanishi, Shigeo Ohashi, Shigeki Hirasawa
  • Publication number: 20040057211
    Abstract: A plurality of electronic apparatuses, each apparatus having a closed loop cooling system, are installed in a cabinet having another closed loop fluid cooling system. Each of the closed loop fluid cooling systems includes a heat receiver and a pump. A projection is mounted on the electronic apparatus and a switching valve is arranged on the cabinet to stop or start circulation of a cooling fluid.
    Type: Application
    Filed: July 18, 2003
    Publication date: March 25, 2004
    Inventors: Yoshihiro Kondo, Shigeo Ohashi, Rintaro Minamitani, Takashi Naganawa, Yuji Yoshitomi, Masato Nakanishi, Yasuhiko Sasaki, Tsuyoshi Nakagawa, Osamu Suzuki, Shinji Matsushita, Yasunori Yamada
  • Publication number: 20040035557
    Abstract: A cooling device for an electronic apparatus, comprising: a heat generating element attached within a first housing; a heat receiving jacket, being connected with said heat generating element, and being attached within said first housing; a second housing being rotatably supported on said first housing; a first heat exchanger attached within said second housing, for exchanging heat between an outside; and a liquid driving means for supplying a cooling liquid to said heat receiving jacket, wherein a portion of a pipe for connecting between said heat receiving means, said first heat exchanger, and said liquid driving means is made of a flexible tube made of a resin, and further wherein, a second heat exchanger and an ion exchanger are provided in a part of said pipe, said second housing is received within said second housing, and said ion exchanger is received within said second housing.
    Type: Application
    Filed: May 1, 2003
    Publication date: February 26, 2004
    Inventors: Rintaro Minamitani, Shigeo Ohashi, Yoshihiro Kondo, Yuji Yoshitomi, Takashi Naganawa, Masato Nakanishi, Tsuyoshi Nakagawa
  • Publication number: 20040008489
    Abstract: An electronic equipment or apparatus, small-sized and thinned in the thickness thereof, having a system for cooling an semiconductor element generating high temperature, comprising: a case mounting the semiconductor element within an inside thereof; a heat-receiving member being thermally connected with the semiconductor element; a heat-radiation member being disposed on an interior surface side of the case; a liquid driving means for driving a liquid coolant between the heat-radiation member and the heat-receiving member; a tank for accumulating the liquid coolant therein; and tubes for connecting between the tank, the heat-radiation member, and the heat-receiving member, wherein the tube is made of either one of butyl rubber, nitrobutadien rubber, fluororubber, ethylene-propylene rubber, hydrinrubber, or polysulfide rubber, so that a permeation amount “q” of the coolant is determined to be equal to or less than a containing amount “Q” of the coolant.
    Type: Application
    Filed: May 8, 2003
    Publication date: January 15, 2004
    Inventors: Rintaro Minamitani, Takashi Naganawa, Makoto Kitano, Yuuji Yoshitomi, Yoshihiro Kondo, Shigeo Ohashi, Hajime Katou, Masato Nakanishi, Tsuyoshi Nakagawa
  • Publication number: 20040008475
    Abstract: In the structure of an electronic apparatus, in which cooling of an heat-generating element is conducted through circulation of a liquid, in particular, for providing a liquid-cooling structure of being high in reliability, while also considering safety and assembling property into the consideration, wherein a water-cooling jacket 8 is thermally connected with a heat-generating element 7, while thermally connecting a heat-radiation pipe 9 with a heat-radiation plate 10 provided on a rear surface of a display 2, wherein a coolant liquid is circulated between the water-cooling jacket 8 and the heat-radiation pipe 9, by means of a liquid driving device 11. The heat-radiation pipe 9 is connected onto a whole area of the heat-radiation plate, like crawling thereupon. A tank 14 is provided in an upper portion of the heat-radiation plate 10, and is connected with the heat-radiation pipe 9.
    Type: Application
    Filed: May 9, 2003
    Publication date: January 15, 2004
    Inventors: Shigeo Ohashi, Yoshihiro Kondo, Rintaro Minamitani, Takashi Naganawa, Yuuji Yoshitomi, Masato Nakanishi, Hajime Katou, Tsuyoshi Nakagawa
  • Publication number: 20030161100
    Abstract: In an electronic equipment or apparatus, having water-cooling structure able to circulate/supply a cooling liquid with stability, for dealing with an increase of heat-generation of a heat-generating element, accompanying with an increase of processing performances, a pipe, which is located at a side where the cooling water flows out from a tank building up the water-cooling system, is extended up to the position of a center of the tank and disposed therein. Also, two (2) pieces of plates are provided for dividing the vicinity of an inlet portion of a pipe, through which the cooling water flows out, within the tank, and further, when injecting the cooling water into the tank, an injection jig for the cooling water is used, which has a connector portion with the tank.
    Type: Application
    Filed: May 6, 2003
    Publication date: August 28, 2003
    Inventors: Yoshihiro Kondo, Shinji Matsushita, Shigeo Ohashi, Takashi Naganawa, Rintaro Minamitani, Tsuyoshi Nakagawa, Yuuji Yoshitomi, Masato Nakanishi, Hajime Katou
  • Patent number: 6581972
    Abstract: The present invention provides a tubular label with pre-printed fixed information adapted to be wrapped around a container body of a container with an inwardly facing surface of the tubular label contacting the container body and the pre-printed fixed information being visible from the outside of the container. The tubular label includes printed arbitrary information such as lottery indicia provided on the inwardly facing surface by a non-impact printer in such a manner as to be invisible through the outwardly facing surface of the tubular label. An elongated tubular member and method of manufacturing the same, as well as a labeled container are also provided.
    Type: Grant
    Filed: December 11, 2000
    Date of Patent: June 24, 2003
    Assignee: Fuji Seal, Inc.
    Inventors: Michihiro Nojima, Masato Nakanishi, Toshinori Mimatsu
  • Publication number: 20010038204
    Abstract: The present invention provides a tubular label with pre-printed fixed information adapted to be wrapped around a container body of a container with an inwardly facing surface of the tubular label contacting the container body and the pre-printed fixed information being visible from the outside of the container. The tubular label includes printed arbitrary information such as lottery indicia provided on the inwardly facing surface by a non-impact printer in such a manner as to be invisible through the outwardly facing surface of the tubular label. An elongated tubular member and method of manufacturing the same, as well as a labeled container are also provided.
    Type: Application
    Filed: December 11, 2000
    Publication date: November 8, 2001
    Inventors: Michihiro Nojima, Masato Nakanishi, Toshinori Mimatsu
  • Patent number: 5891537
    Abstract: A stretch label adapted to be fitted to a container includes a stretch film, having a self-shrinking property, and a printing layer. The stretch film, in turn, includes a substrate made from an ethylene-vinyl acetate copolymer or a mixture of a low density polyethylene and an ethylene-vinyl acetate copolymer, and a surface layer made of a polyolefin resin. The surface layer is harder than the substrate and is provided on at least one surface of the substrate. The surface layer is the outer surface layer of the stretch label when the stretch label is fitted to the container.
    Type: Grant
    Filed: November 3, 1997
    Date of Patent: April 6, 1999
    Assignee: Fuji Seal, Inc.
    Inventors: Toshiya Yoshii, Chihiro Wakatsuki, Hiroshi Harada, Tetsuo Hata, Masato Nakanishi