Abstract: A semiconductor device that includes a substrate; a first electrode layer on the substrate; a dielectric film on the first electrode layer; a second electrode layer on the dielectric film; a protective layer covering the first electrode layer and the second electrode layer; and an outer electrode penetrating the protective layer. The dielectric film includes silicon nitride, and an atomic concentration ratio of Si to a total amount of Si and N contained in the dielectric film is 43 atom % to 70 atom %.

Abstract: A semiconductor device that includes: a substrate having a first main surface and a second main surface opposite to each other in a thickness direction; a circuit layer on the first main surface of the substrate, the circuit layer having a first electrode layer, a second electrode layer, a dielectric layer between the first electrode layer and the second electrode layer, a first outer electrode and a second outer electrode each extending to a surface of the circuit layer opposite to the substrate; and a first resin body at each of four corners of the substrate in a plan view in the thickness direction, and wherein, in the thickness direction, a top end of the first resin body on the side opposite to the substrate is positioned higher than top ends of the first outer electrode and the second outer electrode on the side opposite to the substrate.

Abstract: A cutting tip having a three-layer laminated structure is provided. The tip is made from a disc-shaped three-layer laminate wherein a second layer consisting of a hard sintered compact of CBN or diamond is sandwiched by a first layer and a third layer consisting of a tool material such as cemented carbide. Prismatic blanks of rectangular cross-section are cut out by cutting the three-layer laminate in strips. Semi-completed tips of a desired shape are obtained by cutting up the prismatic blanks. Desired cutting edges are formed on the semi-completed tips to produce completed tips. Because prismatic blanks are obtained from a three-layer laminate and semi-completed tips are cut out from the prismatic blanks like this, the semi-completed tips can be obtained in large numbers, yield is high, and the manufacturing cost of the tip can be reduced.

Abstract: A cutting tip having a three-layer laminated structure is provided. The tip is made from a disc-shaped three-layer laminate wherein a second layer consisting of a hard sintered compact of CBN or diamond is sandwiched by a first layer and a third layer consisting of a tool material such as cemented carbide. Prismatic blanks of rectangular cross-section are cut out by cutting the three-layer laminate in strips. Semi-completed tips of a desired shape are obtained by cutting up the prismatic blanks. Desired cutting edges are formed on the semi-completed tips to produce completed tips. Because prismatic blanks are obtained from a three-layer laminate and semi-completed tips are cut out from the prismatic blanks like this, the semi-completed tips can be obtained in large numbers, yield is high, and the manufacturing cost of the tip can be reduced.

Abstract: A cutting tip having a three-layer laminated structure is provided. The tip is made from a disc-shaped three-layer laminate wherein a second layer consisting of a hard sintered compact of CBN or diamond is sandwiched by a first layer and a third layer consisting of a tool material such as cemented carbide. Prismatic blanks of rectangular cross-section are cut out by cutting the three-layer laminate in strips. Semi-completed tips of a desired shape are obtained by cutting up the prismatic blanks. Desired cutting edges are formed on the semi-completed tips to produce completed tips. Because prismatic blanks are obtained from a three-layer laminate and semi-completed tips are cut out from the prismatic blanks like this, the semi-completed tips can be obtained in large numbers, yield is high, and the manufacturing cost of the tip can be reduced.