Abstract: Provided is a tire provided with a mark capable of reducing the air resistance during tire rotation while maintaining good visibility. A tire is provided with a mark on a tire side portion. The mark includes a first mark located on an outer side in a tire radial direction, and a second mark located inward of the first mark in the tire radial direction. Each of the first mark and the second mark includes a recess that is recessed from a side profile surface of the tire side portion. A depth of the recess of the first mark from the side profile surface is smaller than a depth of the recess of the second mark from the side profile surface.

Abstract: A tire and rim assembly includes a rim having a pair of flanges, and a pneumatic tire being mounted onto the rim, the pneumatic tire including a pair of bead portions and a rim guard being provided on at least one of the pair of bead portions. In a cross-sectional view of the assembly under a standard state, the rim guard protrudes outwardly in a tire axial direction from a sidewall reference outer surface of the tire so as to cover over one of the pair of flanges. An angle ? of an imaginary rim guard straight line with respect to a tire radial direction is equal to or less than 40 degrees, and a maximum gap (A) in the tire radial direction between the one of the pair of flanges and the rim guard is equal to or less than 2.0 mm.

Abstract: Provided is a tire provided with a mark capable of reducing the air resistance during tire rotation while maintaining good visibility. A tire is provided with a mark on a tire side portion. The mark includes a first mark located on an outer side in a tire radial direction, and a second mark located inward of the first mark in the tire radial direction. Each of the first mark and the second mark includes a recess that is recessed from a side profile surface of the tire side portion. A depth of the recess of the first mark from the side profile surface is smaller than a depth of the recess of the second mark from the side profile surface.

Abstract: A tire capable of reducing air resistance without sacrificing ride comfort is provided. A tire 1 includes a tread portion 2 and sidewall portions 3 extending from both ends of the tread portion 2 through buttress regions 31 and maximum width positions 32 to bead portions 4. A projection portion 33 extending in a tire circumferential direction and a recess portion 34 extending in the tire circumferential direction are formed in each of the buttress regions 31. The projection portion 33 has a projection height of 0.1 to 0.3 mm from a reference surface of the buttress region 31 toward an outer side in a tire radial direction. The recess portion 34 has a recess depth of 0.1 to 0.3 mm from the reference surface toward an inner side in the tire radial direction.

Abstract: A base film for sheets for semiconductor wafer processing, comprising a resin layer (A) and a resin layer (B) laminated on one surface of the resin layer (A), wherein one surface of the base film for sheets for semiconductor wafer processing comprises a surface of the resin layer (B), the resin layer (A) contains a thermoplastic elastomer having a Vicat softening point of 50° C. or higher and 87° C. or lower, the resin layer (B) contains a thermoplastic elastomer having a Vicat softening point of 91° C. or higher and 220° C. or lower, and a thickness t of the base film for sheets for semiconductor wafer processing and a thickness tA of the resin layer (A) satisfy the Formulae (1) t?150 ?m and (2) tA/t?78%.

Abstract: A base film for sheets for semiconductor wafer processing, comprising a resin layer (A) and a resin layer (B) laminated on one surface of the resin layer (A), wherein one surface of the base film for sheets for semiconductor wafer processing comprises a surface of the resin layer (B), the resin layer (A) contains a thermoplastic elastomer having a Vicat softening point of 50° C. or higher and 87° C. or lower, the resin layer (B) contains a thermoplastic elastomer having a Vicat softening point of 91° C. or higher and 220° C. or lower, and a thickness t of the base film for sheets for semiconductor wafer processing and a thickness tA of the resin layer (A) satisfy the Formulae (1) t?150 ?m and (2) tA/t?78% below.

Abstract: An adhesive sheet is provided enabling to efficiently produce the very small size semiconductor chip by a stealth dicing method. An adhesive sheet for a stealth dicing includes a substrate and an adhesive layer formed on one side of the substrate, wherein a Young's modulus of the adhesive sheet at 23° C. is 200 to 600 MPa, and a storage elastic modulus of the adhesive layer at 23° C. is 0.10 to 50 MPa.

Abstract: An adhesive sheet is provided enabling to efficiently produce the very small size semiconductor chip by a stealth dicing method. An adhesive sheet for a stealth dicing includes a substrate and an adhesive layer formed on one side of the substrate, wherein a Young's modulus of the adhesive sheet at 23° C. is 200 to 600 MPa, and a storage elastic modulus of the adhesive layer at 23° C. is 0.10 to 50 MPa.