Abstract: In a semiconductor device manufacturing method, at least a semiconductor element is arranged in a cavity of a resin molding die. A resin is supplied to a resin reservoir in direct contact with the cavity and is then injected in order to substantially fill the cavity. The resin filled in the cavity forms a resin seal for encapsulating the semiconductor element. The resin seal has a recess or a protrusion as a remainder of the resin reservoir.

Abstract: In a semiconductor device having a multilayer interconnection structure, the contact resistance of a conductive plug that connects a wiring layer and an adjacent upper wiring layer is minimized by providing an enlarged portion at the lower end of the conductive plug.

Abstract: A semiconductor package has (a) a package base, (b) package terminals formed on the package base and used to connect the semiconductor package to another device, (c) a wiring layer formed on the package base and electrically connected to the package terminals, (d) a semiconductor chip mounted on the package base and electrically connected to the wiring layer, (e) a low-elasticity resin layer formed between a resin mold and the wiring layer and between the package base and the resin mold, and (f) the resin mold sealing the package base, the wiring layer, the semiconductor chip, and the low-elasticity resin layer.

Abstract: A semiconductor package includes (a) an interposer, (b) a wiring layer containing conductors formed adjacent to each other at intervals that cause no short circuit among the conductors, the wiring layer covering a given area of the interposer, to block light from passing through the given area, (c) a light blocking layer covering a no-wiring area of the interposer not covered by the wiring layer, to block light fiom passing through the no-wiring area, (d) a semiconductor chip electrically connected to the wiring layer, and (e) a resin mold sealing the wiring layer, the light blocking layer, and the semiconductor chip.

Abstract: The semiconductor device comprises a capacitor including a storage electrode 76, a capacitor dielectric film formed on the storage electrode 76, and a plate electrode formed on the capacitor dielectric film 78, the storage electrode 76 having an upper end rounded and having a larger thickness at the upper end than a thickness in the rest region. Whereby electric field concentration on the upper end of the storage electrode can be mitigated, and leakage current increase and dielectric breakdown of the capacitor dielectric film can be precluded.

Abstract: A stent manufactured for treating internal tubular organs, typically for treating a blood vessel, in which the stent has a sufficient diametral shrinkage ability and an ability for returning back to the original diameter thereof.

Abstract: Insulation films 45, 56 having a contact hole 58 are formed on a substrate. A dummy plug 62 is formed in the contact hole 58. Insulation films 64, 66 are formed on the insulation film 56. An opening 70 for exposing at least a part of the dummy plug 62 is formed in the insulation films 64, 66. The dummy plug 62 is selectively removed through the opening 70. A storage electrode 72 is formed in the contact hole 58 and the opening 70. The insulation film 66 is selectively removed. A dielectric film 74 and a plate electrode are formed on the storage electrode 72. Whereby, without an extra support for supporting the storage electrode 72, the storage electrode 72 is prevented form falling down or peeling off, and defective contact and breakage of the lower structure due to disalignment can be precluded.

Abstract: Making a stent in accordance with information regarding tubular living-body tissue of each individual for treating such as aneurysm.

Abstract: A semiconductor device with a thickness of 1 mm or less is disclosed, that comprises a frame plate main body with a thickness in the range from 0.1 mm to 0.25 mm, a semiconductor pellet disposed on a first surface of the frame plate main body and with a thickness in the range from 0.2 mm to 0.3 mm, an external connection lead, one end thereof being connected to a peripheral portion of the first surface of the frame plate main body, the other end thereof extending to the outside of the frame plate main body, a bonding wire for electrically connecting an electrode of the semiconductor pellet and a connection portion of the end of the external connection lead, and a sealing resin layer for covering and sealing at least a region including the semiconductor pellet, the bonding wire, and a connection portion.

Abstract: A needle holder for guiding a surgical needle having a suture attached to the needle, in which the surgical needle is transferred from a first shaft to a second shaft, comprising a needle stand formed on the first shaft and a needle receiver formed on the second shaft, receiving the needle made upright at the needle stand. Further, the needle holder comprises a guide passage formed on the first shaft for guiding the suture attached to the needle from the needle stand in a prescribed direction to at least the vicinity of the needle stand, the guide passage having a surface that has no edge damaging the suture in a cross direction with respect to the direction of the tension exerted to the suture.

Abstract: The present invention relates to a suturing needle for medical use comprising a needle tip portion for piercing a body tissue, a distal end portion for coupling a suture and a body portion formed between the needle tip portion and the distal end portion The body portion is constituted of a pair of flat surfaces opposing to each other and a pair of grooves opposing to each other in a direction intersecting with the opposing direction of the flat surfaces.

Abstract: In a semiconductor device manufacturing method, at least a semiconductor element is arranged in a cavity of a resin molding die. A resin is supplied to a resin reservoir in direct contact with the cavity and is then injected in order to substantially fill the cavity. The resin filled in the cavity forms a resin seal for encapsulating the semiconductor element. The resin seal has a recess or a protrusion as a remainder of the resin reservoir.

Abstract: In the substrate for a semiconductor device of the present invention, a second substrate having an opening portion is adhered on a first flat substrate. The opening portion makes the surface of the first substrate exposed and contains a semiconductor chip. Chip connection terminals to be connected to the semiconductor chip are provided on the second substrate. External connection terminals are provided on the back surface of the first substrate. The chip connection terminals and the external connection terminals are connected with each other by a wiring pattern passing through through-holes formed and penetrating both the first and second substrate.

Abstract: A semiconductor device with a thickness of 1 mm or less is disclosed, that comprises a frame plate main body with a thickness in the range from 0.1 mm to 0.25 mm, a semiconductor pellet disposed on a first surface of the frame plate main body and with a thickness in the range from 0.2 mm to 0.3 mm, an external connection lead, one end thereof being connected to a peripheral portion of the first surface of the frame plate main body, the other end thereof extending to the outside of the frame plate main body, a bonding wire for electrically connecting an electrode of the semiconductor pellet and a connection portion of the end of the external connection lead, and a sealing resin layer for covering and sealing at least a region including the semiconductor pellet, the bonding wire, and a connection portion.

Abstract: A drive for an electric vehicle includes by forming a drive unit 8 having a transmission by combining a single propelling motor 7 with the transmission, respectively interconnecting the drive unit 8 with propelling wheels to be a drive wheel, and separately controlling the drive units 8. Besides, traveling speed detecting means are provided on the respective drive units 8, 8, and the respective drive units are simultaneously controlled according to a revolution signal from one of the traveling speed detecting means. A method for controlling an electric vehicle by separately controlling the drive units 8, 8, making the output torque of the motor zero or minimum during the gear change, and producing again the output torque of the motor after completing the gear change.

Abstract: A semiconductor device is provided that includes a substrate having a first side, a second side, and a through-hole. An external connection terminal is located on the first side of the substrate, and a chip connection terminal is located on the second side of the substrate. The chip connection terminal is electrically connected to the external connection terminal via the through-hole. In one preferred embodiment, the external connection terminal, the inner portion of the through hole, and a first portion of the chip connection terminal have a hard gold plating, and a second portion of the chip connection terminal has a soft gold plating. In another preferred embodiment, the chip connection terminal, the inner portion of the through hole, and a first portion of the external connection terminal have a soft plating, and a second portion of the external connection terminal has a hard gold plating.

Abstract: The present invention provides a surgical needle having a needle tip end and a clamping portion to be clamped by a needle holder for applying a current, whereinthe needle tip end is made from a conductive material which is electrically connected to a conductive material of the clamping portion,an insulating layer is provided over the clamping portion and a tip surrounding portion of the surgical needle, whereas at least the needle tip end is electrically exposed, andwhen the insulating material over the clamping portion is clamped by the needle holder, the conductive material of the clamping portion is electrically connected to the needle holder.

Abstract: In an electric vehicle provided with an electric motor (M), a motor drive circuit (17) and a control circuit section (15) for outputting an operation command to the motor drive circuit, a variable speed drive unit for electric vehicles has a transmission apparatus (20) which engages or disengages a drive shaft (7a) which receives the drive force from a propelling motor and a driven shaft (5a) which is interconnected with propelling wheels by an electromagnetic engagement clutch (30), the transmission apparatus has the electromagnetic clutch comprised of a first clutch (22) interconnected with the drive shaft, a second clutch (25) having a rotational speed different from the first clutch, and an output side clutch (21) interconnected with the driven shaft; and the output side clutch and the first clutch or the second clutch are alternatively connected to selectively change the motor output.

Abstract: A guide instrument for passing a medical needle with thread through or between body tissues has first and second shafts mounted to be pivotally movable to each other and is formed with, on the first shaft, a needle stand for making the needle with thread stand up and holding the needle with thread, a hole for guiding the thread, and a slit and with, on the second shaft, a needle receiver for receiving the needle when the shafts are made close while the needle with thread stands up at the needle stand. When the shafts 1, 2 are made close while the needle with thread stands up at the needle stand, the needle with thread passes through and between the body tissues and is engaged with the needle receiver. When the shafts are made open, the needle with thread while keeping the engagement with the needle receiver separates from the needle stand, and therefore, the needle with thread can be guided from the first shaft to the second shaft.

Abstract: A resistor bank consisting of a group of resistors formed on the surface of die, all electrically connected together in parallel. All of the resistors have identical individual resistances, but each has a unique energy dissipating capacity. When an event subjects the resistor bank to a surge of current, some of the resistors blow out, thereby changing the resistance of the bank. By measuring the resistance of the bank before and after an event the energy of the surge can be determined.