Patents by Inventor Masatoshi Izaki

Masatoshi Izaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110068889
    Abstract: A thermal fuse includes a first insulating film to which a pair of metal terminals are attached, a fusible alloy located above the first insulating film and connected between the leading end portions of the pair of metal terminals, and a second insulating film located above the fusible alloy and attached to the first insulating film so as to define a space with the first insulating film. The fusible alloy includes an Sn—Bi—In—Zn alloy containing 0.5 to 15 weight % of Bi, 45 to 55 weight % of In and 0.5 to 5 weight % of Zn with the balance being Sn.
    Type: Application
    Filed: November 24, 2010
    Publication date: March 24, 2011
    Inventors: KENJI SENDA, Takahiro Mukai, Masatoshi Izaki
  • Publication number: 20070024407
    Abstract: A thermal fuse comprises: a first insulating film to which a pair of metal terminals are attached; a fusible alloy located above the first insulating film and connected between the leading end portions of the pair of metal terminals; and a second insulating film located above the fusible alloy and attached to the first insulating film so as to define a space with the first insulating film. The fusible alloy includes an Sn—Bi—In—Zn alloy containing 0.5 to 15 weight % of Bi, 45 to 55 weight % of In and 0.5 to 5 weight % of Zn with the balance being Sn.
    Type: Application
    Filed: May 27, 2004
    Publication date: February 1, 2007
    Inventors: Kenji Senda, Takahiro Mukai, Masatoshi Izaki
  • Patent number: 7106165
    Abstract: A fuse has a pair of lead terminals disposed on a substrate, an intermediate layers for welding formed on the surface of at least one of the lead terminals, and a fuse element. The fuse element is welded to the pair of lead terminals through the intermediate layer so as to span the same. Further, the intermediate layer is formed on at least one of the lead terminals except a face thereof opposing each other. Owing to this configuration, after the fuse has melted down, the melted fuse element is prevented from being spread out into the space between the opposing faces of the lead terminals and insulation therebetween is secured.
    Type: Grant
    Filed: June 29, 2004
    Date of Patent: September 12, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takahiro Mukai, Masatoshi Izaki, Yoshio Sakamoto, Kenji Senda
  • Publication number: 20050083166
    Abstract: A thermal fuse includes a first insulation film having a pair of metal terminals mounted thereto, a fusible alloy located over the first insulation film and connected between respective ends of the metal terminals, a second insulation film provided over the fusible alloy and bonded to the first insulation film as to provide a space between the first and second insulation films. The fusible alloy includes an Sn—Bi—In alloy containing 20 to 39.5 wt. % of tin, 11.5 to 31 wt. % of bismuth, and 49 to 68.5 wt. % of indium. The fusible alloy does not release lead or cadmium even after being disposed of since it contains no lead and no cadmium.
    Type: Application
    Filed: October 6, 2003
    Publication date: April 21, 2005
    Inventors: Kenji Senda, Takahiro Mukai, Masatoshi Izaki
  • Publication number: 20050007234
    Abstract: The thermal fuse of the present invention contains a fuse element 1 that is formed of a fusible alloy having a composition of 43.5-50 wt % Sn, 0.1-5 wt % In, and balance being Bi and inevitable impurities, or a fusible alloy having a composition of 5-33 wt % In, 4.7-15.5 wt % Zn, and balance being Sn and inevitable impurities; a pair of electric terminals 2, 3 connected to the fuse element; and case 8 for accommodating at least the fuse element 1. The opening end of case 8 has a predetermined shape. By employing the structure above, a thermal fuse having an operating temperature as high as 130-190° C. can be easily obtained.
    Type: Application
    Filed: June 22, 2004
    Publication date: January 13, 2005
    Inventors: Tatsuya Wada, Shinichi Otsuka, Takahiro Mukai, Masatoshi Izaki
  • Publication number: 20050001710
    Abstract: A fuse has a pair of lead terminals disposed on a substrate, an intermediate layers for welding formed on the surface of at least one of the lead terminals, and a fuse element. The fuse element is welded to the pair of lead terminals through the intermediate layer so as to span the same. Further, the intermediate layer is formed on at least one of the lead terminals except a face thereof opposing each other. Owing to this configuration, after the fuse has melted down, the melted fuse element is prevented from being spread out into the space between the opposing faces of the lead terminals and insulation therebetween is secured.
    Type: Application
    Filed: June 29, 2004
    Publication date: January 6, 2005
    Inventors: Takahiro Mukai, Masatoshi Izaki, Yoshio Sakamoto, Kenji Senda
  • Patent number: 6556122
    Abstract: A thermal fuse reduced in size and thickness can be obtained. Further, the thermal fuse will not be degraded in characteristics, productivity, reliability, quality, etc. even after reduction in size and thickness. The thermal fuse includes a fuse main body including a substrate, a fusible metal and a cover, and paired terminals disposed protruding from the fuse main body. The other end of the first terminal has a first fusible metal connection, and the other end of the second terminal has a second fusible metal connection. The fusible metal is disposed between the first terminal and the second terminal, and one end of the fusible metal is connected to the first fusible metal connection, and the other end of the fusible metal is connected to the second fusible metal connection. The cover is disposed so as to cover the fusible metal, the first fusible metal connection, and the second fusible metal connection.
    Type: Grant
    Filed: July 20, 2001
    Date of Patent: April 29, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masatoshi Izaki, Takahiro Mukai, Shinichi Ohtsuka, Kenzo Isozaki
  • Publication number: 20020113685
    Abstract: A thermal fuse reduced in size and thickness can be obtained. Further, the thermal fuse will not be degraded in characteristics, productivity, reliability, quality, etc. even after reduction in size and thickness. The thermal fuse includes a fuse main body including a substrate, a fusible metal and a cover, and paired terminals disposed protruding from the fuse main body. The other end of the first terminal has a first fusible metal connection, and the other end of the second terminal has a second fusible metal connection. The fusible metal is disposed between the first terminal and the second terminal, and one end of the fusible metal is connected to the first fusible metal connection, and the other end of the fusible metal is connected to the second fusible metal connection. The cover is disposed so as to cover the fusible metal, the first fusible metal connection, and the second fusible metal connection.
    Type: Application
    Filed: July 20, 2001
    Publication date: August 22, 2002
    Inventors: Masatoshi Izaki, Takahiro Mukai, Shinichi Ohtsuka, Kenzo Isozaki
  • Patent number: D502688
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: March 8, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Katsumi Kozu, Takeshi Ishimaru, Masatoshi Izaki, Kenji Senda
  • Patent number: D479827
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: September 23, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Katsumi Kozu, Takeshi Ishimaru, Masatoshi Izaki, Kenji Senda
  • Patent number: D482004
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: November 11, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masatoshi Izaki, Takahiro Mukai, Shinichi Ohtsuka, Kenzo Isozaki
  • Patent number: D484464
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: December 30, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Katsumi Kozu, Takeshi Ishimaru, Masatoshi Izaki, Kenji Senda
  • Patent number: D489689
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: May 11, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Katsumi Kozu, Takeshi Ishimaru, Masatoshi Izaki, Kenji Senda
  • Patent number: D492261
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: June 29, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masatoshi Izaki, Takahiro Mukai, Shinichi Ohtsuka, Kenzo Isozaki
  • Patent number: D493774
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: August 3, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Katsumi Kozu, Takeshi Ishimaru, Masatoshi Izaki, Kenji Senda