Abstract: A wire bonding apparatus according to an embodiment bonds a wire to a bonding portion by generating an ultrasonic vibration in a state of pressing the wire onto the bonding portion. The wire bonding apparatus includes a bonding tool that causes the wire to contact the bonding portion and applies a load, an ultrasonic horn that generates the ultrasonic vibration, a load sensor that continuously detects the load applied from the bonding tool to the bonding portion, and a controller that controls the operation of the bonding tool and the ultrasonic horn. The controller analyzes data of the load output from the load sensor between when the wire contacts the bonding portion and when the ultrasonic vibration is generated, and controls the operation of the bonding tool and the ultrasonic horn based on an analysis result.

Abstract: An environmental testing device includes a heat insulation chamber that includes a test chamber and is formed using a heat insulation panel that is electrically conductible. The heat insulation chamber includes a chamber body having an entrance and a door that opens and closes the entrance. A heat insulation panel forming the chamber body includes an outer panel and an inner panel. A radiation-absorbent material is disposed between the outer panel and the inner panel. The heat insulation panel forming the chamber body and a heat insulation panel forming the door are connected to each other in an electrically conductible manner.

Abstract: According to an embodiment, a battery includes an exterior container, a lid member, a plurality of electrode groups, a first lead, a second lead, and an electrode terminal. The lid member closes an opening of an inner cavity of the exterior container, and the plurality of electrode groups are stored in the inner cavity. A first current collecting tab protruding toward the lid member in a first electrode is joined with the first lead, and a second current collecting tab protruding toward the lid member in the second electrode different from the first electrode is joined with the second lead separate from the first lead. The first and second leads are together connected to the electrode terminal exposed on an outer surface of the lid member.

Abstract: An ultrasonic bonding apparatus includes a sensor that detects vibration along a height direction in a bonding target member which vibrates by ultrasonic vibration. The ultrasonic bonding apparatus includes a control device that changes control parameters associated with the driving of a bonding tool based on information related to the vibration along the height direction detected by the sensor.

Abstract: A side bracket includes at least one body fastening portion to be fastened to a body of a vehicle, an inner fastening portion, an outer fastening portion, an inner joining part, and an outer joining part. The inner joining part is provided in a rim surrounding a through hole in the inner fastening portion, and in a position closer to a central side in a vehicle-width direction than at least one body fastening portion, the inner joining part is joined to an outer circumferential surface of the steering member penetrating the through hole. The outer joining part is provided in the outer fastening portion, and in a position closer to an end side in the vehicle-width direction than at least one body fastening portion, the outer joining part is joined to a front portion of the outer circumferential surface of the steering member.

Abstract: An ultrasonic bonding apparatus includes a sensor that detects vibration along a height direction in a bonding target member which vibrates by ultrasonic vibration. The ultrasonic bonding apparatus includes a control device that changes control parameters associated with the driving of a bonding tool based on information related to the vibration along the height direction detected by the sensor.

Abstract: An ultrasonic bonding apparatus includes a temperature sensor that detects a temperature of a bonding target member arranged on an upper side of a stage. The ultrasonic bonding apparatus includes a control device that changes a control parameter associated with the driving of a bonding tool based on information related to the temperature detected by the temperature sensor.

Abstract: An ultrasonic bonding apparatus includes a temperature sensor that detects a temperature of a bonding target member arranged on an upper side of a stage. The ultrasonic bonding apparatus includes a control device that changes a control parameter associated with the driving of a bonding tool based on information related to the temperature detected by the temperature sensor.

Abstract: An electrode group includes a positive electrode, a negative electrode, and a current collecting tab. The current collecting tab is provided in one of the positive electrode and the negative electrode, and protrudes relative to the other of the positive electrode and the negative electrode. The current collecting tab is formed with one or more slit parts penetrating the current collecting tab in a thickness direction intersecting a protruding direction of the current collecting tab. Each of the one or more slit parts extends along a width direction intersecting both the protruding direction and the thickness direction. At each of the one or more slit parts, a circular portion is formed at at least one of the two ends in the width direction.

Abstract: According to an embodiment, a bundling method and a bundling apparatus of a plurality of band-shaped parts of a current collecting tab in an electrode group, in which the current collecting tab projects, are provided. In the bundling method and apparatus, the current collecting tab is deformed by moving a bundling tool, with the bundling tool being abutted to the current collecting tab from an outer side in a lamination direction of a plurality of band-shaped parts. At this time, the bundling tool is moved so that a moving direction of the bundling tool is inclined with respect to the lamination direction of the plurality of band-shaped parts, toward a side opposite to a side where the current collecting tab projects.

Abstract: A nut is caulked and fixed to a plate material and a protrusion at an end of a collar is press-fitted into a recessed groove generated on the opposite surface of the plate material at the time of the caulking fixation, thereby fixing the nut and the collar to both surfaces of the plate material, respectively. The plate material is, for example, a metal panel, and the nut is, for example, a pierce nut. Since the collar is caulked and fixed, thermal strain is not generated.

Abstract: A wire bonding apparatus according to an embodiment bonds a wire to a bonding portion by generating an ultrasonic vibration in a state of pressing the wire onto the bonding portion. The wire bonding apparatus includes a bonding tool that causes the wire to contact the bonding portion and applies a load, an ultrasonic horn that generates the ultrasonic vibration, a load sensor that continuously detects the load applied from the bonding tool to the bonding portion, and a controller that controls the operation of the bonding tool and the ultrasonic horn. The controller analyzes data of the load output from the load sensor between when the wire contacts the bonding portion and when the ultrasonic vibration is generated, and controls the operation of the bonding tool and the ultrasonic horn based on an analysis result.

Abstract: A semiconductor device includes a base, a first semiconductor chip mounted on the base, and a second semiconductor chip provided above the first semiconductor chip. The second semiconductor chip includes a first portion, a second portion including a region directly above a center of the first semiconductor chip, and a third portion including part of a portion of the second semiconductor chip other than a region directly above the first semiconductor chip. The second portion is thicker than the first portion. The third portion is thicker than the second portion and is disposed at a position sandwiching the first semiconductor chip.

Abstract: A side bracket includes at least one body fastening portion to be fastened to a body of a vehicle, an inner fastening portion, an outer fastening portion, an inner joining part, and an outer joining part. The inner joining part is provided in a rim surrounding a through hole in the inner fastening portion, and in a position closer to a central side in a vehicle-width direction than at least one body fastening portion, the inner joining part is joined to an outer circumferential surface of the steering member penetrating the through hole. The outer joining part is provided in the outer fastening portion, and in a position closer to an end side in the vehicle-width direction than at least one body fastening portion, the outer joining part is joined to a front portion of the outer circumferential surface of the steering member.

Abstract: According to one embodiment, the first end part of the first semiconductor chip in a lower stage protrudes to a larger extent in a first direction than the first end part of the first semiconductor chip in an upper stage. The second end part of the second semiconductor chip in a lower stage protrudes to a larger extent in a second direction opposite from the first direction than the second end part of the second semiconductor chip in an upper stage. The first interlayer semiconductor chip includes a first portion, a second portion, and a third electrode pad. The first portion overlaps the first chip group. The second portion protrudes in the second direction beyond the first chip group and the second chip group and is thicker than the first portion. The third electrode pad is provided on the second portion and bonded with the third metal wire.

Abstract: A semiconductor device includes a base, a first semiconductor chip mounted on the base, and a second semiconductor chip provided above the first semiconductor chip. The second semiconductor chip includes a first portion, a second portion including a region directly above a center of the first semiconductor chip, and a third portion including part of a portion of the second semiconductor chip other than a region directly above the first semiconductor chip. The second portion is thicker than the first portion. The third portion is thicker than the second portion and is disposed at a position sandwiching the first semiconductor chip.

Abstract: According to one embodiment, the first end part of the first semiconductor chip in a lower stage protrudes to a larger extent in a first direction than the first end part of the first semiconductor chip in an upper stage. The second end part of the second semiconductor chip in a lower stage protrudes to a larger extent in a second direction opposite from the first direction than the second end part of the second semiconductor chip in an upper stage. The first interlayer semiconductor chip includes a first portion, a second portion, and a third electrode pad. The first portion overlaps the first chip group. The second portion protrudes in the second direction beyond the first chip group and the second chip group and is thicker than the first portion. The third electrode pad is provided on the second portion and bonded with the third metal wire.

Abstract: A nut is caulked and fixed to a plate material and a protrusion at an end of a collar is press-fitted into a recessed groove generated on the opposite surface of the plate material at the time of the caulking fixation, thereby fixing the nut and the collar to both surfaces of the plate material, respectively. The plate material is, for example, a metal panel, and the nut is, for example, a pierce nut. Since the collar is caulked and fixed, thermal strain is not generated.

Abstract: An RFID tag formed on an original includes a storage unit which stores data representing, e.g., the number of times of scan of the original and the generation from a parent original, and a transmitter/receiver which transmits and receives the data by radio. A read/write circuit receives data from an RFID tag of an original by radio. On the basis of the received data, read of the original is controlled. While the original is being read, the received data is edited in accordance with the control. The read/write circuit transmits and writes the edited data in the RFID tag.

Abstract: In an image forming apparatus which requires the user to manually input sheet medium information, (when a bundle of sheets which include a plurality of types of print media are to be printed, the user must manually input setups of the image forming apparatus for each individual print medium. In manual setups by the user, some setups require user's knowledge about print media. When the user has made wrong setups, a print result cannot be obtained under an appropriate control condition Furthermore, when information about a print medium is sensed by the sensor without manual setups, the information cannot be often precisely detect depending on the type and thickness of the print medium, an environment, and the like, and it is consequently difficult to attain optimal image formation. It is an object of this invention to attain optimal image formation, saving user labor and shortening the print time by using a radio tag attached to the sheet medium.