Patents by Inventor Masatoshi Tsuchiya

Masatoshi Tsuchiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240245994
    Abstract: A non-transitory computer readable storage medium according to the present invention stores a computer program causing a control unit of a game device to function as the following devices, the game device providing a soccer game that causes a player on the defense side to execute a charge action under automatic control when a continuous pressing operation is executed on an L2 button of a controller. Namely, the computer program causes the control unit to function as a device that, when an operation is inputted after the hand of the player on the defense side reaches a player on the offense side during the charge action, acquires the result of the operation, and if the operation is an operation on an L stick, causes the player on the defense side to execute an opponent moving action that moves the player on the offense side in the operation direction of the operation, so that the operation is reflected in the charge action.
    Type: Application
    Filed: April 4, 2024
    Publication date: July 25, 2024
    Applicant: KONAMI DIGITAL ENTERTAINMENT CO., LTD.
    Inventors: Masaki NAKAMURA, Shin TSUCHIYA, Masatoshi OJIMA, Shintaro KUMAKAWA, Shota KOBAYASHI, Akira YAMASHITA
  • Patent number: 11637406
    Abstract: Provided is an electric connector, which is to be arranged between a connection terminal of a first device and a connection terminal of a second device, and is configured to electrically connect the connection terminal of the first device and the connection terminal of the second device to each other, the electric connector including a composite, the composite including: an elastic body having a plurality of through holes that penetrate therethrough in a thickness direction; and a conductive member, which is joined to an inner wall of each of the through holes, and is configured to electrically connect the connection terminal of the first device and the connection terminal of the second device to each other, wherein at least a part of a vicinity of at least one of distal ends of the conductive member is hollow.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: April 25, 2023
    Assignee: SHIN-ETSU POLYMER CO., LTD.
    Inventor: Masatoshi Tsuchiya
  • Patent number: 11482801
    Abstract: An electric connector is disposed between a connection terminal of a first device and a connection terminal of a second device, and electrically connects these connection terminals. The electric connector includes a resin layer, and a plurality of metal wires extending through the resin layer in a thickness direction, and having a rectangular shape on surfaces to be connected to the connection terminals. At least first sides of the rectangular shapes of the metal wires are arranged at equal intervals along the same direction. The length of short sides of the rectangular shapes are less than 5 ?m.
    Type: Grant
    Filed: October 18, 2018
    Date of Patent: October 25, 2022
    Assignee: SHIN-ETSU POLYMER CO., LTD.
    Inventors: Masatoshi Tsuchiya, Atsuya Shimizu
  • Publication number: 20210104854
    Abstract: Provided is an electric connector, which is to be arranged between a connection terminal of a first device and a connection terminal of a second device, and is configured to electrically connect the connection terminal of the first device and the connection terminal of the second device to each other, the electric connector including a composite, the composite including: an elastic body having a plurality of through holes that penetrate therethrough in a thickness direction; and a conductive member, which is joined to an inner wall of each of the through holes, and is configured to electrically connect the connection terminal of the first device and the connection terminal of the second device to each other, wherein at least a part of a vicinity of at least one of distal ends of the conductive member is hollow.
    Type: Application
    Filed: May 17, 2018
    Publication date: April 8, 2021
    Inventor: Masatoshi TSUCHIYA
  • Patent number: 10916521
    Abstract: Provided is an electric connector, which is to be arranged between a connection terminal of a first device and a connection terminal of a second device, and is configured to electrically connect the connection terminal of the first device and the connection terminal of the second device to each other, the electric connector including: an elastic body having a plurality of through holes each being opened on a first surface and a second surface; and one or more carbon nanotube yarns joined to each of the through holes.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: February 9, 2021
    Assignee: SHIN-ETSU POLYMER CO., LTD.
    Inventors: Shinji Hotta, Masatoshi Tsuchiya
  • Publication number: 20200321144
    Abstract: An electric connector is disposed between a connection terminal of a first device and a connection terminal of a second device, and electrically connects these connection terminals. The electric connector includes a resin layer, and a plurality of metal wires extending through the resin layer in a thickness direction, and having a rectangular shape on surfaces to be connected to the connection terminals. At least first sides of the rectangular shapes of the metal wires are arranged at equal intervals along the same direction. The length of short sides of the rectangular shapes are less than 5 ?m.
    Type: Application
    Filed: October 18, 2018
    Publication date: October 8, 2020
    Applicant: Shin-Etsu Polymer Co., Ltd.
    Inventors: Masatoshi TSUCHIYA, Atsuya SHIMIZU
  • Publication number: 20200075532
    Abstract: Provided is an electric connector, which is to be arranged between a connection terminal of a first device and a connection terminal of a second device, and is configured to electrically connect the connection terminal of the first device and the connection terminal of the second device to each other, the electric connector including: an elastic body having a plurality of through holes each being opened on a first surface and a second surface; and one or more carbon nanotube yarns joined to each of the through holes.
    Type: Application
    Filed: October 4, 2018
    Publication date: March 5, 2020
    Inventors: Shinji HOTTA, Masatoshi TSUCHIYA
  • Patent number: 7371990
    Abstract: A cable monitoring system, which monitors failure of a plurality of cables connecting a power supply and a welding gun, has voltage detection lines connected to arbitrary two points of each of the cables, an insulating transformer a primary side of which is connected to the voltage detection lines of each cable, and a failure detector connected to a secondary side of the insulating transformer and detecting failure of each cable based on voltage on the secondary side of the insulating transformer for each cable.
    Type: Grant
    Filed: June 27, 2006
    Date of Patent: May 13, 2008
    Assignees: Nissan Motor Co., Ltd., Dengensha Manufacturing Company Limited
    Inventors: Seiji Nomizu, Masao Furuichi, Shigeru Ohkubo, Masatoshi Tsuchiya
  • Publication number: 20060289395
    Abstract: A cable monitoring system, which monitors failure of a plurality of cables connecting a power supply and a welding gun, has voltage detection lines connected to arbitrary two points of each of the cables, an insulating transformer a primary side of which is connected to the voltage detection lines of each cable, and a failure detector connected to a secondary side of the insulating transformer and detecting failure of each cable based on voltage on the secondary side of the insulating transformer for each cable.
    Type: Application
    Filed: June 27, 2006
    Publication date: December 28, 2006
    Inventors: Seiji Nomizu, Masao Furuichi, Shigeru Ohkubo, Masatoshi Tsuchiya
  • Patent number: 6206671
    Abstract: A pressure molding apparatus comprises a furnace defining a heating space for accommodating a mold assembly including a mold body charged with a raw material to be molded, and a pressure piston for pressurizing the raw material; heating means for heating the heating space; and load imposing means for imposing a load on the pressure piston to mold the raw material. The load imposing means includes at least one weight means and weight supporting means. The weight supporting means is selectively set in a load-free state in which the weight supporting means supports the weight means so that the weight of the weight means is not imposed on the pressure piston, and a load imposed state in which the weight supporting means releases the support of the weight means so that the weight of the weight means is imposed on the pressure piston.
    Type: Grant
    Filed: February 3, 1999
    Date of Patent: March 27, 2001
    Assignees: Tokuyama Corporation, Yamato Scientific Co, LTD
    Inventors: Masatoshi Tsuchiya, Atsushi Mogami, Yutaka Kobayashi, Hideki Ohno, Masato Sekino
  • Patent number: 5296979
    Abstract: A magnetic disc apparatus includes a magnetic disc for recording information; a thin film magnetic head including a magnetic pole structure having an upper magnetic pole tip and a lower magnetic pole tip arranged to provide a magnetic gap at respective end portions thereof for writing and reading information in and from the magnetic disc; a device for rotating the magnetic disc; and a device for positioning the thin film magnetic head; the upper and lower magnetic pole tips having different contours at the respective end portions as viewed from a side confronting the magnetic disc wherein the difference (.DELTA.CW in .mu.m) in the width, along the magnetic gap, of the upper magnetic pole tip and the width, along the magnetic gap, of the lower magnetic pole tip satisfies the relation0<.DELTA.CW.ltoreq.5000/Trfor the magnetic disc having a track density Tr of 1800 or more tracks per inch.
    Type: Grant
    Filed: October 19, 1992
    Date of Patent: March 22, 1994
    Assignee: Hitachi, Ltd.
    Inventors: Takashi Kawabe, Moriaki Fuyama, Shinji Narishige, Masatoshi Tsuchiya, Eiji Ashida, Makoto Morijiri, Hideki Yamazaki, Yutaka Sugita, Hiroshi Fukui, Tadayuki Iwakura, Makoto Aihara, Makoto Saito, Shunichiro Kuwatsuka, Hiroshi Ikeda, Yokuo Saitoh
  • Patent number: 4971896
    Abstract: A method of forming a thin film pattern on a base having a step portion. This method comprises a first step of forming a thin film of given material on the base, a second step of forming a predetermined pattern of a first photoresist film on said thin film at one of a first portion including a lower part of the step portion and a second portion including an upper part of the step portion, a third step of forming a predetermined pattern of a second photoresist film on said thin film at the other of the first and second portions and a fourth step of applying ion-milling to said thin film of given material using masks said first and second photoresist film patterns formed on said thin film at the first and second portions.
    Type: Grant
    Filed: December 7, 1988
    Date of Patent: November 20, 1990
    Assignee: Hitachi, Ltd.
    Inventors: Takashi Kawabe, Ataru Kobayashi, Moriaki Fuyama, Makoto Morijiri, Eiji Ashida, Masatoshi Tsuchiya, Tetsuya Okai, Masanobu Hanazono, Shinichi Hara, Shinji Narishige, Hiroshi Ikeda
  • Patent number: 4729010
    Abstract: An integrated circuit package in which semiconductor elements mounted on an insulating substrate, ends of lead pieces introduced from the outside and wires that electrically connect them, are accommodated in a cell that is air-tightly defined by the substrate, a cap and a sealing glass. The lead pieces are composed of an alloy having a coefficient of thermal expansion nearly equal to, or smaller than, the coefficient of thermal expansion of the substrate. The alloy is an iron alloy which contains nickel and cobalt, and having a martensite transformation temperture of lower than -55.degree. C.
    Type: Grant
    Filed: July 30, 1986
    Date of Patent: March 1, 1988
    Assignee: Hitachi, Ltd.
    Inventors: Masatoshi Tsuchiya, Satoru Ogihara, Hiromi Kagohara, Kanji Otsuka, Tomoji Oishi
  • Patent number: 4499774
    Abstract: A semiconductor pressure transducer comprising a piezoresistive semiconductor diaphragm, a cylindrical stem made of a glass having a thermal expansion coefficient approximating that of the diaphragm and hermetically bonded by anodic bonding to the latter, and a cylindrical holder hermetically bonded by anodic bonding to the cylindrical stem is disclosed. The holder is made of a ferromagnetic alloy material containing Fe, Co and Ni and having a mean thermal expansion coefficient of 35.times.10.sup.-7 /.degree.C. or less within the temperature range between 30.degree. C. and 350.degree. C.
    Type: Grant
    Filed: July 17, 1981
    Date of Patent: February 19, 1985
    Assignee: Hitachi, Ltd.
    Inventors: Masatoshi Tsuchiya, Ko Soeno, Tomomasa Yoshida
  • Patent number: 4319397
    Abstract: A strain gauge is formed on one main surface of a semiconductor single crystal substrate while an insulating oxide film is formed on the other main surface of the substrate. A metal junction layer including several layers inclusive of eutectic alloy layers is formed on the surface of the insulating oxide film and the thus prepared structure is mounted on a metal strain generator. By heating this assembly to temperatures approximating to the eutectic point of the eutectic alloy layer, the semiconductor substrate and the metal strain generator are joined together.
    Type: Grant
    Filed: July 7, 1980
    Date of Patent: March 16, 1982
    Assignee: Hitachi, Ltd.
    Inventors: Masanori Tanabe, Satoshi Shimada, Akio Yasukawa, Hideyuki Nemoto, Motohisa Nishihara, Masatoshi Tsuchiya, Ko Soeno
  • Patent number: 4303903
    Abstract: A pressure transducer comprising a silicon diaphragm on which a semiconductor strain gauge is formed and which has a diaphragm portion deformable in response to a pressure, an insulating support which is made of borosilicate glass having the silicon diaphragm rigidly mounted thereon and which is provided with a pressure introducing hole in its central part, a metallic support which is cylindrical, which is made of an iron-nickel alloy similar in the thermal expansion coefficient to the borosilicate glass and on which the glass insulating support is rigidly mounted, and a metallic housing within which the integrated structure consisting of the silicon diaphragm, the glass insulating support and the metallic support is arranged; the silicon diaphragm, the insulating support and the metallic support being joined by the anodic bonding, the metallic support being rigidly welded to the metallic housing at its lower end part.
    Type: Grant
    Filed: September 21, 1979
    Date of Patent: December 1, 1981
    Assignee: Hitachi, Ltd.
    Inventors: Yoshitaka Matsuoka, Michitaka Shimazoe, Yoshimi Yamamoto, Mitsuo Ai, Keiji Miyauchi, Hideyuki Nemoto, Masatoshi Tsuchiya, Masanori Tanabe
  • Patent number: 4236925
    Abstract: A method of producing a sintered material having a high wearing resistance and damping capacity by mixing 5-30 wt. % of a powdery metal selected from the group consisting of lead, magnesium and graphite with the remainder of a powdery metal selected from the group consisting of iron, copper, aluminum, cast iron and alloys thereof, compression-molding the mixture, subjecting the same to plastic treatment and sintering the same by heating to a temperature above a recrystallization point of the matrix metal, and the sintered material thus produced.
    Type: Grant
    Filed: August 10, 1978
    Date of Patent: December 2, 1980
    Assignee: Hitachi, Ltd.
    Inventors: Jin Onuke, Masateru Suwa, Ko Soeno, Akio Okayama, Masatoshi Tsuchiya, Hisakiti Onodera
  • Patent number: 4166384
    Abstract: A semiconductor transducer comprising an improved strain-yielding body yielding a strain in response to the impartation of a force or displacement, and a semiconductor strain gauge bonded to the strain-yielding body. The improved strain-yielding body is made of an iron-nickel-cobalt alloy containing 28.2 to 31.0% by weight of nickel and 15.0 to 19.5% by weight of cobalt. This iron-nickel-cobalt alloy is initially heated up to a temperature above 600.degree. C. for the purpose of standard heat treatment for removing its internal strain. After the standard heat treatment, the iron-nickel-cobalt alloy is subjected to cold working at a working rate of more than and including 60%, and is then subjected to heat treatment at a temperature between 350.degree. C. and 600.degree. C. The heat-treated iron-nickel-cobalt alloy is shaped into the predetermined form of the strain-yielding body.
    Type: Grant
    Filed: September 6, 1978
    Date of Patent: September 4, 1979
    Assignee: Hitachi, Ltd.
    Inventors: Yasumasa Matsuda, Kazuji Yamada, Satoshi Shimada, Motohisa Nishihara, Tomio Yasuda, Masatoshi Tsuchiya, Ko Soeno, Mitsuo Ai, Takeo Nagata, Yoshitaka Matsuoka