Patents by Inventor Masatoshi Tsuchiya
Masatoshi Tsuchiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240245994Abstract: A non-transitory computer readable storage medium according to the present invention stores a computer program causing a control unit of a game device to function as the following devices, the game device providing a soccer game that causes a player on the defense side to execute a charge action under automatic control when a continuous pressing operation is executed on an L2 button of a controller. Namely, the computer program causes the control unit to function as a device that, when an operation is inputted after the hand of the player on the defense side reaches a player on the offense side during the charge action, acquires the result of the operation, and if the operation is an operation on an L stick, causes the player on the defense side to execute an opponent moving action that moves the player on the offense side in the operation direction of the operation, so that the operation is reflected in the charge action.Type: ApplicationFiled: April 4, 2024Publication date: July 25, 2024Applicant: KONAMI DIGITAL ENTERTAINMENT CO., LTD.Inventors: Masaki NAKAMURA, Shin TSUCHIYA, Masatoshi OJIMA, Shintaro KUMAKAWA, Shota KOBAYASHI, Akira YAMASHITA
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Patent number: 11637406Abstract: Provided is an electric connector, which is to be arranged between a connection terminal of a first device and a connection terminal of a second device, and is configured to electrically connect the connection terminal of the first device and the connection terminal of the second device to each other, the electric connector including a composite, the composite including: an elastic body having a plurality of through holes that penetrate therethrough in a thickness direction; and a conductive member, which is joined to an inner wall of each of the through holes, and is configured to electrically connect the connection terminal of the first device and the connection terminal of the second device to each other, wherein at least a part of a vicinity of at least one of distal ends of the conductive member is hollow.Type: GrantFiled: May 17, 2018Date of Patent: April 25, 2023Assignee: SHIN-ETSU POLYMER CO., LTD.Inventor: Masatoshi Tsuchiya
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Patent number: 11482801Abstract: An electric connector is disposed between a connection terminal of a first device and a connection terminal of a second device, and electrically connects these connection terminals. The electric connector includes a resin layer, and a plurality of metal wires extending through the resin layer in a thickness direction, and having a rectangular shape on surfaces to be connected to the connection terminals. At least first sides of the rectangular shapes of the metal wires are arranged at equal intervals along the same direction. The length of short sides of the rectangular shapes are less than 5 ?m.Type: GrantFiled: October 18, 2018Date of Patent: October 25, 2022Assignee: SHIN-ETSU POLYMER CO., LTD.Inventors: Masatoshi Tsuchiya, Atsuya Shimizu
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Publication number: 20210104854Abstract: Provided is an electric connector, which is to be arranged between a connection terminal of a first device and a connection terminal of a second device, and is configured to electrically connect the connection terminal of the first device and the connection terminal of the second device to each other, the electric connector including a composite, the composite including: an elastic body having a plurality of through holes that penetrate therethrough in a thickness direction; and a conductive member, which is joined to an inner wall of each of the through holes, and is configured to electrically connect the connection terminal of the first device and the connection terminal of the second device to each other, wherein at least a part of a vicinity of at least one of distal ends of the conductive member is hollow.Type: ApplicationFiled: May 17, 2018Publication date: April 8, 2021Inventor: Masatoshi TSUCHIYA
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Patent number: 10916521Abstract: Provided is an electric connector, which is to be arranged between a connection terminal of a first device and a connection terminal of a second device, and is configured to electrically connect the connection terminal of the first device and the connection terminal of the second device to each other, the electric connector including: an elastic body having a plurality of through holes each being opened on a first surface and a second surface; and one or more carbon nanotube yarns joined to each of the through holes.Type: GrantFiled: April 10, 2018Date of Patent: February 9, 2021Assignee: SHIN-ETSU POLYMER CO., LTD.Inventors: Shinji Hotta, Masatoshi Tsuchiya
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Publication number: 20200321144Abstract: An electric connector is disposed between a connection terminal of a first device and a connection terminal of a second device, and electrically connects these connection terminals. The electric connector includes a resin layer, and a plurality of metal wires extending through the resin layer in a thickness direction, and having a rectangular shape on surfaces to be connected to the connection terminals. At least first sides of the rectangular shapes of the metal wires are arranged at equal intervals along the same direction. The length of short sides of the rectangular shapes are less than 5 ?m.Type: ApplicationFiled: October 18, 2018Publication date: October 8, 2020Applicant: Shin-Etsu Polymer Co., Ltd.Inventors: Masatoshi TSUCHIYA, Atsuya SHIMIZU
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Publication number: 20200075532Abstract: Provided is an electric connector, which is to be arranged between a connection terminal of a first device and a connection terminal of a second device, and is configured to electrically connect the connection terminal of the first device and the connection terminal of the second device to each other, the electric connector including: an elastic body having a plurality of through holes each being opened on a first surface and a second surface; and one or more carbon nanotube yarns joined to each of the through holes.Type: ApplicationFiled: October 4, 2018Publication date: March 5, 2020Inventors: Shinji HOTTA, Masatoshi TSUCHIYA
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Patent number: 7371990Abstract: A cable monitoring system, which monitors failure of a plurality of cables connecting a power supply and a welding gun, has voltage detection lines connected to arbitrary two points of each of the cables, an insulating transformer a primary side of which is connected to the voltage detection lines of each cable, and a failure detector connected to a secondary side of the insulating transformer and detecting failure of each cable based on voltage on the secondary side of the insulating transformer for each cable.Type: GrantFiled: June 27, 2006Date of Patent: May 13, 2008Assignees: Nissan Motor Co., Ltd., Dengensha Manufacturing Company LimitedInventors: Seiji Nomizu, Masao Furuichi, Shigeru Ohkubo, Masatoshi Tsuchiya
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Publication number: 20060289395Abstract: A cable monitoring system, which monitors failure of a plurality of cables connecting a power supply and a welding gun, has voltage detection lines connected to arbitrary two points of each of the cables, an insulating transformer a primary side of which is connected to the voltage detection lines of each cable, and a failure detector connected to a secondary side of the insulating transformer and detecting failure of each cable based on voltage on the secondary side of the insulating transformer for each cable.Type: ApplicationFiled: June 27, 2006Publication date: December 28, 2006Inventors: Seiji Nomizu, Masao Furuichi, Shigeru Ohkubo, Masatoshi Tsuchiya
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Patent number: 6206671Abstract: A pressure molding apparatus comprises a furnace defining a heating space for accommodating a mold assembly including a mold body charged with a raw material to be molded, and a pressure piston for pressurizing the raw material; heating means for heating the heating space; and load imposing means for imposing a load on the pressure piston to mold the raw material. The load imposing means includes at least one weight means and weight supporting means. The weight supporting means is selectively set in a load-free state in which the weight supporting means supports the weight means so that the weight of the weight means is not imposed on the pressure piston, and a load imposed state in which the weight supporting means releases the support of the weight means so that the weight of the weight means is imposed on the pressure piston.Type: GrantFiled: February 3, 1999Date of Patent: March 27, 2001Assignees: Tokuyama Corporation, Yamato Scientific Co, LTDInventors: Masatoshi Tsuchiya, Atsushi Mogami, Yutaka Kobayashi, Hideki Ohno, Masato Sekino
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Patent number: 5296979Abstract: A magnetic disc apparatus includes a magnetic disc for recording information; a thin film magnetic head including a magnetic pole structure having an upper magnetic pole tip and a lower magnetic pole tip arranged to provide a magnetic gap at respective end portions thereof for writing and reading information in and from the magnetic disc; a device for rotating the magnetic disc; and a device for positioning the thin film magnetic head; the upper and lower magnetic pole tips having different contours at the respective end portions as viewed from a side confronting the magnetic disc wherein the difference (.DELTA.CW in .mu.m) in the width, along the magnetic gap, of the upper magnetic pole tip and the width, along the magnetic gap, of the lower magnetic pole tip satisfies the relation0<.DELTA.CW.ltoreq.5000/Trfor the magnetic disc having a track density Tr of 1800 or more tracks per inch.Type: GrantFiled: October 19, 1992Date of Patent: March 22, 1994Assignee: Hitachi, Ltd.Inventors: Takashi Kawabe, Moriaki Fuyama, Shinji Narishige, Masatoshi Tsuchiya, Eiji Ashida, Makoto Morijiri, Hideki Yamazaki, Yutaka Sugita, Hiroshi Fukui, Tadayuki Iwakura, Makoto Aihara, Makoto Saito, Shunichiro Kuwatsuka, Hiroshi Ikeda, Yokuo Saitoh
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Patent number: 4971896Abstract: A method of forming a thin film pattern on a base having a step portion. This method comprises a first step of forming a thin film of given material on the base, a second step of forming a predetermined pattern of a first photoresist film on said thin film at one of a first portion including a lower part of the step portion and a second portion including an upper part of the step portion, a third step of forming a predetermined pattern of a second photoresist film on said thin film at the other of the first and second portions and a fourth step of applying ion-milling to said thin film of given material using masks said first and second photoresist film patterns formed on said thin film at the first and second portions.Type: GrantFiled: December 7, 1988Date of Patent: November 20, 1990Assignee: Hitachi, Ltd.Inventors: Takashi Kawabe, Ataru Kobayashi, Moriaki Fuyama, Makoto Morijiri, Eiji Ashida, Masatoshi Tsuchiya, Tetsuya Okai, Masanobu Hanazono, Shinichi Hara, Shinji Narishige, Hiroshi Ikeda
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Patent number: 4729010Abstract: An integrated circuit package in which semiconductor elements mounted on an insulating substrate, ends of lead pieces introduced from the outside and wires that electrically connect them, are accommodated in a cell that is air-tightly defined by the substrate, a cap and a sealing glass. The lead pieces are composed of an alloy having a coefficient of thermal expansion nearly equal to, or smaller than, the coefficient of thermal expansion of the substrate. The alloy is an iron alloy which contains nickel and cobalt, and having a martensite transformation temperture of lower than -55.degree. C.Type: GrantFiled: July 30, 1986Date of Patent: March 1, 1988Assignee: Hitachi, Ltd.Inventors: Masatoshi Tsuchiya, Satoru Ogihara, Hiromi Kagohara, Kanji Otsuka, Tomoji Oishi
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Patent number: 4499774Abstract: A semiconductor pressure transducer comprising a piezoresistive semiconductor diaphragm, a cylindrical stem made of a glass having a thermal expansion coefficient approximating that of the diaphragm and hermetically bonded by anodic bonding to the latter, and a cylindrical holder hermetically bonded by anodic bonding to the cylindrical stem is disclosed. The holder is made of a ferromagnetic alloy material containing Fe, Co and Ni and having a mean thermal expansion coefficient of 35.times.10.sup.-7 /.degree.C. or less within the temperature range between 30.degree. C. and 350.degree. C.Type: GrantFiled: July 17, 1981Date of Patent: February 19, 1985Assignee: Hitachi, Ltd.Inventors: Masatoshi Tsuchiya, Ko Soeno, Tomomasa Yoshida
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Patent number: 4319397Abstract: A strain gauge is formed on one main surface of a semiconductor single crystal substrate while an insulating oxide film is formed on the other main surface of the substrate. A metal junction layer including several layers inclusive of eutectic alloy layers is formed on the surface of the insulating oxide film and the thus prepared structure is mounted on a metal strain generator. By heating this assembly to temperatures approximating to the eutectic point of the eutectic alloy layer, the semiconductor substrate and the metal strain generator are joined together.Type: GrantFiled: July 7, 1980Date of Patent: March 16, 1982Assignee: Hitachi, Ltd.Inventors: Masanori Tanabe, Satoshi Shimada, Akio Yasukawa, Hideyuki Nemoto, Motohisa Nishihara, Masatoshi Tsuchiya, Ko Soeno
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Patent number: 4303903Abstract: A pressure transducer comprising a silicon diaphragm on which a semiconductor strain gauge is formed and which has a diaphragm portion deformable in response to a pressure, an insulating support which is made of borosilicate glass having the silicon diaphragm rigidly mounted thereon and which is provided with a pressure introducing hole in its central part, a metallic support which is cylindrical, which is made of an iron-nickel alloy similar in the thermal expansion coefficient to the borosilicate glass and on which the glass insulating support is rigidly mounted, and a metallic housing within which the integrated structure consisting of the silicon diaphragm, the glass insulating support and the metallic support is arranged; the silicon diaphragm, the insulating support and the metallic support being joined by the anodic bonding, the metallic support being rigidly welded to the metallic housing at its lower end part.Type: GrantFiled: September 21, 1979Date of Patent: December 1, 1981Assignee: Hitachi, Ltd.Inventors: Yoshitaka Matsuoka, Michitaka Shimazoe, Yoshimi Yamamoto, Mitsuo Ai, Keiji Miyauchi, Hideyuki Nemoto, Masatoshi Tsuchiya, Masanori Tanabe
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Patent number: 4236925Abstract: A method of producing a sintered material having a high wearing resistance and damping capacity by mixing 5-30 wt. % of a powdery metal selected from the group consisting of lead, magnesium and graphite with the remainder of a powdery metal selected from the group consisting of iron, copper, aluminum, cast iron and alloys thereof, compression-molding the mixture, subjecting the same to plastic treatment and sintering the same by heating to a temperature above a recrystallization point of the matrix metal, and the sintered material thus produced.Type: GrantFiled: August 10, 1978Date of Patent: December 2, 1980Assignee: Hitachi, Ltd.Inventors: Jin Onuke, Masateru Suwa, Ko Soeno, Akio Okayama, Masatoshi Tsuchiya, Hisakiti Onodera
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Patent number: 4166384Abstract: A semiconductor transducer comprising an improved strain-yielding body yielding a strain in response to the impartation of a force or displacement, and a semiconductor strain gauge bonded to the strain-yielding body. The improved strain-yielding body is made of an iron-nickel-cobalt alloy containing 28.2 to 31.0% by weight of nickel and 15.0 to 19.5% by weight of cobalt. This iron-nickel-cobalt alloy is initially heated up to a temperature above 600.degree. C. for the purpose of standard heat treatment for removing its internal strain. After the standard heat treatment, the iron-nickel-cobalt alloy is subjected to cold working at a working rate of more than and including 60%, and is then subjected to heat treatment at a temperature between 350.degree. C. and 600.degree. C. The heat-treated iron-nickel-cobalt alloy is shaped into the predetermined form of the strain-yielding body.Type: GrantFiled: September 6, 1978Date of Patent: September 4, 1979Assignee: Hitachi, Ltd.Inventors: Yasumasa Matsuda, Kazuji Yamada, Satoshi Shimada, Motohisa Nishihara, Tomio Yasuda, Masatoshi Tsuchiya, Ko Soeno, Mitsuo Ai, Takeo Nagata, Yoshitaka Matsuoka