Patents by Inventor Masaya Koda

Masaya Koda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220064402
    Abstract: A thermosetting resin composition for laser direct structuring (LDS) which is used for LDS includes the following components: (A) a thermosetting resin; (B) an inorganic filler; (C) a non-conductive metal compound that forms a metal nucleus upon irradiation with active energy rays; and (D) a coupling agent, in which the component (A) contains one or more selected from the group consisting of an epoxy resin and a bismaleimide resin, and at least one of the following conditions is satisfied. Condition 1: a ratio of particles having a particle size equal to or more than 1 ?m and equal to or less than 20 ?m in the component (B) is equal to or more than 40% by volume and equal to or less than 95% by volume with respect to a total volume of the component (B), and Condition 2: an angle of fall of the thermosetting resin composition for LDS is equal to or less than 35°.
    Type: Application
    Filed: December 18, 2019
    Publication date: March 3, 2022
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventors: Masaya KODA, Masashi ENDO
  • Publication number: 20120126434
    Abstract: Disclosed are a liquid resin composition which contains a (A) liquid epoxy resin, (B) an amine hardener, (C) core-shell rubber particles, and (D) an inorganic filler, wherein the content of the solid components with respect to the total liquid resin composition is equal to or more than 65% by weight, and a semiconductor device using the liquid resin composition.
    Type: Application
    Filed: July 20, 2010
    Publication date: May 24, 2012
    Inventor: Masaya Koda
  • Patent number: 8169090
    Abstract: An encapsulation resin composition for preapplication, comprising (a) an epoxy resin, and (b) a curing agent having flux activity, wherein the tack after B-staging is at least 0 gf/5 mm? and at most 5 gf/5 mm?, and the melt viscosity at 130° C. is at least 0.01 Pa·s and at most 1.0 Pa·s; a preapplied encapsulated component and semiconductor device using the composition, and a process of fabrication thereof. The resin composition is less susceptible to air entrapment during provisional placement of semiconductor chips, and excels in workability and reliability.
    Type: Grant
    Filed: May 30, 2006
    Date of Patent: May 1, 2012
    Assignee: Sumitomo Bakelite Company, Ltd.
    Inventors: Satoru Katsurayama, Yushi Sakamoto, Masaya Koda
  • Publication number: 20090166897
    Abstract: An encapsulation resin composition for preapplication, comprising (a) an epoxy resin, and (b) a curing agent having flux activity, wherein the tack after B-staging is at least 0 gf/5 mm? and at most 5 gf/5 mm?, and the melt viscosity at 130° C. is at least 0.01 Pa·s and at most 1.0 Pa·s; a preapplied encapsulated component and semiconductor device using the composition, and a process of fabrication thereof. The resin composition is less susceptible to air entrapment during provisional placement of semiconductor chips, and excels in workability and reliability.
    Type: Application
    Filed: May 30, 2006
    Publication date: July 2, 2009
    Inventors: Satoru Katsurayama, Yushi Sakamoto, Masaya Koda