Abstract: A permanent adhesive composition for image sensors which provides an adhesive layer having excellent heat resistance and thermal shock resistance, and a bonding method and laminate using the permanent adhesive composition. The permanent adhesive composition for image sensors contains a thermosetting or photocurable resin containing a specific bifunctional (meth)acrylic acid ester-derived structural unit, a polymerizable monomer, and an antioxidant, and used to bond together a substrate and a support for the substrate. The bonding method includes bonding together a substrate and a support for the substrate using the permanent adhesive composition. The laminate is provided with a substrate, a support for the substrate, and an adhesive layer for bonding the substrate and the support together, and the adhesive layer is formed of the permanent adhesive composition.

Abstract: A permanent adhesive composition for image sensors which provides an adhesive layer having excellent heat resistance and thermal shock resistance, and a bonding method and laminate using the permanent adhesive composition. The permanent adhesive composition for image sensors contains a thermosetting or photocurable resin containing a specific bifunctional (meth)acrylic acid ester-derived structural unit, a polymerizable monomer, and an antioxidant, and used to bond together a substrate and a support for the substrate. The bonding method includes bonding together a substrate and a support for the substrate using the permanent adhesive composition. The laminate is provided with a substrate, a support for the substrate, and an adhesive layer for bonding the substrate and the support together, and the adhesive layer is formed of the permanent adhesive composition.

Abstract: Provided are a silicone resin that yields a cured product excellent in flexibility, toughness, and heat resistance and high in transparency, a process for producing the said silicone resin, and a curable resin composition comprising the said silicone resin. The silicone resin is obtained by reacting an organopolysiloxane containing SiH groups represented by general formula (3) with an organopolysiloxane containing hydroxyl groups at both ends represented by general formula (5) and an alcohol containing radically reactive groups represented by general formula (6) in the presence of a hydroxylamine compound represented by general formula (4) as a catalyst and this silicone resin is used in formulating a curable resin composition.

Abstract: Provided are a silicone resin that yields a cured product excellent in flexibility, toughness, and heat resistance and high in transparency, a process for producing the said silicone resin, and a curable resin composition comprising the said silicone resin. The silicone resin is obtained by reacting an organopolysiloxane containing SiH groups represented by general formula (3) with an organopolysiloxane containing hydroxyl groups at both ends represented by general formula (5) and an alcohol containing radically reactive groups represented by general formula (6) in the presence of a hydroxylamine compound represented by general formula (4) as a catalyst and this silicone resin is used in formulating a curable resin composition.

Abstract: Provided are a silicone resin that yields a cured product excellent in flexibility, toughness, and heat resistance and high in transparency, a process for producing the said silicone resin, and a curable resin composition comprising the said silicone resin. The silicone resin is obtained by reacting an organopolysiloxane containing SiH groups represented by general formula (3) with an organopolysiloxane containing hydroxyl groups at both ends represented by general formula (5) and an alcohol containing radically reactive groups represented by general formula (6) in the presence of a hydroxylamine compound represented by general formula (4) as a catalyst and this silicone resin is used in formulating a curable resin composition.

Abstract: Provided are a silicone resin that yields a cured product excellent in flexibility, toughness, and heat resistance and high in transparency, a process for producing the said silicone resin, and a curable resin composition comprising the said silicone resin. The silicone resin is obtained by reacting an organopolysiloxane containing SiH groups represented by general formula (3) with an organopolysiloxane containing hydroxyl groups at both ends represented by general formula (5) and an alcohol containing radically reactive groups represented by general formula (6) in the presence of a hydroxylamine compound represented by general formula (4) as a catalyst and this silicone resin is used in formulating a curable resin composition.

Abstract: This invention relates to a silicone resin composition which exhibits high heat resistance, high transparency and high dimensional stability and thus can be suitably used for optical applications such as a lens, an optical disc, an optical fiber, a substrate for a plat panel display, a window material for an automobile, and the like.

Abstract: The present invention relates to a silicone resin composition that can be used for a roll film having small birefringence, the silicone resin composition being suitable for, for example, optical applications, and a window material for an automobile, the silicone resin composition having high heat resistance, the silicon resin composition being stained at a low level, the silicone resin composition having a low thermal expansion coefficient, the silicone resin composition enabling a transparent conductive film to be stably formed, and the silicone resin composition providing good winding property.

Abstract: The present invention relates to a silica-containing silicone resin composition which provides high heat resistance, high transparency, and high dimension stability, and thus can be suitably used for optical applications such as a lens, an optical disc, an optical fiber, and a substrate for a flat panel display, or for a window material for an automobile and the like.

Abstract: The present invention relates to a silicone resin composition that can be used for a roll film having small birefringence, the silicone resin composition being suitable for, for example, optical applications, and a window material for an automobile, the silicone resin composition having high heat resistance, the silicon resin composition being stained at a low level, the silicone resin composition having a low thermal expansion coefficient, the silicone resin composition enabling a transparent conductive film to be stably formed, and the silicone resin composition providing good winding property.

Abstract: This invention relates to a silicone resin composition which exhibits high heat resistance, high transparency and high dimensional stability and thus can be suitably used for optical applications such as a lens, an optical disc, an optical fiber, a substrate for a plat panel display, a window material for an automobile, and the like.

Abstract: This invention relates to a silicone resin composition comprising a silicone resin and an unsaturated compound. This resin composition is formulated from a silicone resin which has in its structural unit cage type polyorganosilsesquioxane whose siloxy groups are linked to a triorganosilyl group represented by —Si(CH3)2—X (wherein X is —R1—OCO—CR2═CH2, —R1—CR2═CH2 or —CH═CH2, R1 is an alkyl group, an alkylidene group or phenylene group and R2 is a hydrogen atom or an alkyl group) and an unsaturated compound which contains an unsaturated group represented by —R3—CR4═CH2 or —CR4═CH2 (wherein R3 is an alkylene group, an alkylidene group or —OCO— group and R4 is a hydrogen atom or an alkyl group) at the weight ratio of the silicone resin to the unsaturated compound in the range of 1:99 to 99:1.

Abstract: This invention relates to a silicone resin composition comprising a silicone resin and an unsaturated compound. This resin composition is formulated from a silicone resin which has in its structural unit cage type polyorganosilsesquioxanewhose siloxy groups are linked to a triorganosilyl group represented by —Si(CH3)2—X (wherein X is —R1—OCO—CR2═CH2, —R1—CR2═CH2 or —CH═CH2, R1 is an alkyl group, an alkylidene group or phenylene group and R2 is a hydrogen atom or an alkyl group) and an unsaturated compound which contains an unsaturated group represented by —R3—CR4═CH2 or —CR4═CH2 (wherein R3 is an alkylene group, an alkylidene group or —OCO— group and R4 is a hydrogen atom or an alkyl group) at the weight ratio of the silicone resin to the unsaturated compound in the range of 1:99 to 99:1.