Abstract: A camera module is provided which has a simple structure, can be easily assembled, can avoid the adverse effects of dust on imaging, and can promote heat dissipation of an imaging device. In a camera module, which includes a lens unit that has a cylindrical thread portion, a flat plate-shaped imaging device that is mounted on a printed wiring board, and a holder that holds the lens unit and the printed wiring board with maintaining the predetermined positional relationship therebetween, an imaging field of the imaging device is disposed in a space tightly closed by a first spacer that is made into a ring shape made of an elastic material the surface of which is an adhesive surface, and the adhesive surface is exposed at least in an inner peripheral wall of the first spacer. The first spacer may be made of a material that further has favorable thermal conductivity.

Abstract: A receptacle, fixed to a first case, has a central conductor portion, an outer conductor portion that concentrically surrounds the central conductor portion, and a receptacle-side convex portion that extends in a connector circumferential direction and is formed on a top end portion of the outer conductor portion. A plug, fixed to a second case, has a plurality of inner contact pieces that make contact with an outer peripheral surface of the central conductor portion with fitting into the receptacle, a plurality of outer contact pieces that extend in a connector axial direction on an outer peripheral surface of the outer conductor portion with intervals therebetween, and plug-side convex portions that are freely displaceable in the connector axial direction in a state of being in surface contact with the outer peripheral surface of the outer conductor portion and are formed on the outer contact pieces of the plug.

Abstract: A camera module is provided which has a simple structure, can be easily assembled, can avoid the adverse effects of dust on imaging, and can promote heat dissipation of an imaging device. In a camera module, which includes a lens unit that has a cylindrical thread portion, a flat plate-shaped imaging device that is mounted on a printed wiring board, and a holder that holds the lens unit and the printed wiring board with maintaining the predetermined positional relationship therebetween, an imaging field of the imaging device is disposed in a space tightly closed by a first spacer that is made into a ring shape made of an elastic material the surface of which is an adhesive surface, and the adhesive surface is exposed at least in an inner peripheral wall of the first spacer. The first spacer may be made of a material that further has favorable thermal conductivity.

Abstract: A receptacle, fixed to a first case, has a central conductor portion, an outer conductor portion that concentrically surrounds the central conductor portion, and a receptacle-side convex portion that extends in a connector circumferential direction and is formed on a top end portion of the outer conductor portion. A plug, fixed to a second case, has a plurality of inner contact pieces that make contact with an outer peripheral surface of the central conductor portion with fitting into the receptacle, a plurality of outer contact pieces that extend in a connector axial direction on an outer peripheral surface of the outer conductor portion with intervals therebetween, and plug-side convex portions that are freely displaceable in the connector axial direction in a state of being in surface contact with the outer peripheral surface of the outer conductor portion and are formed on the outer contact pieces of the plug.

Abstract: A sensor module includes a lens attached on an opening side of a housing and a circuit board with a sensor device mounted thereon attached on the other opening side. A stepped part is formed on the inside of the housing. An adjustment gap for adjusting the position of the circuit board is formed between a vertical face of this stepped part and an outer peripheral face of the circuit board. An adhesive injection groove that varies the width of the adjustment gap is formed by providing a recess and/or a projection on the vertical face of the stepped part and an opposing face of the outer peripheral face of the circuit board in at least one of at least two fixing portions where the circuit board is fixed to the stepped part with an adhesive. Adhesive is applied into the adhesive injection groove.

Abstract: Manufacture of molded cases of various types is not required even if the molded cases house different numbers of substrates, so that cost of manufacturing camera modules with various functions is reduced. A camera module includes an optical system holder composed of a substrate supporting part in the form of a square box with a down-facing opening, and a cylindrical lens unit fixing part provided integrally with the substrate supporting part and formed at the center of the top of the substrate supporting part. A lens unit is supported in the lens unit fixing part, and an image capturing element holding substrate on which an image capturing element is placed is fixed in the substrate supporting part. A substrate holder is coupled to an end portion of the substrate supporting part of the optical system holder, and a circuit component holding substrate is supported in the substrate holder.