Patents by Inventor Masayoshi Miyazaki

Masayoshi Miyazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6438827
    Abstract: A ceramic electronic part includes at least one chip ceramic electronic part body having terminal electrodes and terminals provided on both sides. Each terminal is composed of a metal plate bent into a u shape. The outer face of a first leg of each bent terminal faces and is attached to a terminal electrode, and a second leg is attached to a substrate. The inner face of the bent terminal is provided with a solder-phobic surface not having affinity for solder, and the outer face of the bent terminal is provided with a solder-philic surface having high affinity for solder.
    Type: Grant
    Filed: January 25, 2000
    Date of Patent: August 27, 2002
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takuji Nakagawa, Yoshikazu Takagi, Masayoshi Miyazaki, Hideki Nakayama, Masaru Takahashi, Akira Nakamura
  • Patent number: 6185481
    Abstract: A semiconductor device provided with a first cooling fan and heat-radiating fins is mounted on a board, and there is provided a second cooling fan for supplying cooling air to the board, such that a flow passage is formed for directing the cooling air, supplied from the second cooling fan, toward the board through the first cooling fan.
    Type: Grant
    Filed: November 28, 1997
    Date of Patent: February 6, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Yoshihiro Kondou, Tadakatsu Nakajima, Shigeo Ohashi, Susumu Iwai, Masayoshi Miyazaki, Shoohei Fuse, Kazuo Morita, Hidetada Fukunaka
  • Patent number: 6046902
    Abstract: A ceramic electronic part includes at least one chip ceramic electronic part body having terminal electrodes and terminals provided on both sides. Each terminal is composed of a metal plate bent into a U shape. The outer face of a first leg of each bent terminal faces and is attached to a terminal electrode, and a second leg is attached to a substrate. The inner face of the bent terminal is provided with a solder-phobic surface not having affinity for solder, and the outer face of the bent terminal is provided with a solder-philic surface having high affinity for solder.
    Type: Grant
    Filed: July 23, 1998
    Date of Patent: April 4, 2000
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takuji Nakagawa, Yoshikazu Takagi, Masayoshi Miyazaki, Hideki Nakayama, Masaru Takahashi, Akira Nakamura
  • Patent number: D293242
    Type: Grant
    Filed: February 25, 1985
    Date of Patent: December 15, 1987
    Assignee: Hitachi, Ltd.
    Inventors: Shirou Hujimori, Masayoshi Miyazaki
  • Patent number: D432534
    Type: Grant
    Filed: August 12, 1999
    Date of Patent: October 24, 2000
    Assignee: Hitachi, Ltd.
    Inventors: Shingo Hirose, Takashi Yamamoto, Yoshiaki Amano, Kenta Kumagai, Taisuke Kashima, Tsukasa Ariyoshi, Masayoshi Miyazaki, Satoshi Hamazaki, Kenji Kasai, Peter Hohmann