Abstract: A stem is formed by fixing two leads to a base having a planar shape that is substantially circular to be remote from one diameter thereof by a specified distance and by providing a heat sink onto one surface side of the base to have a surface that is parallel to the two leads and that is perpendicular to the base. A laser chip is mounted onto one surface of the heat sink and a periphery thereof is covered by a cap. The heat sink is fixedly attached such that an emitting portion of the light of the laser chip becomes in center of the base. It is accordingly possible to obtain a semiconductor laser of an arrangement having a small outer diameter and that may be easily manufactured at low cost while increasing the size of the heat sink for improving the heat radiation properties even if the laser chip has a large chip size and a large heat generating in a high output laser chip, and accordingly an optical pickup of thin type.

Abstract: In order to manufacture a stem in a semiconductor laser device from a thin sheet metal by a pressing operation, a base is formed with an annular wall by pressing the thin sheet metal. Outer leads are disposed in a space which is formed within the annular wall. The leads are fixed by charging and curing an insulating thermosetting resin. A mounting for mounting a silicon sub-mount on said base is formed integrally with said base by a pressing operation. Lacking of strength and heat dissipation due to the fact that the stem is formed of a thin metal plate is compensated for by the formation of said continuous wall.

Abstract: A stem is formed by fixing two leads to a base having a planar shape that is substantially circular to be remote from one diameter thereof by a specified distance and by providing a heat sink onto one surface side of the base to have a surface that is parallel to the two leads and that is perpendicular to the base. A laser chip is mounted onto one surface of the heat sink and a periphery thereof is covered by a cap. The heat sink is fixedly attached such that an emitting portion of the light of the laser chip becomes in center of the base. It is accordingly possible to obtain a semiconductor laser of an arrangement having a small outer diameter and that may be easily manufactured at low cost while increasing the size of the heat sink for improving the heat radiation properties even if the laser chip has a large chip size and a large heat generating in a high output laser chip, and accordingly an optical pickup of thin type.