Abstract: A printer for a cigarette-manufacturing machine has a density sensor (70) disposed between a wrapping section (4) and a cutting section (16) of the machine, and the density sensor (70) detects the print density of printed information (PI) of a tobacco rod (TR). The information (PI) is printed on a paper web W by a printing unit (20) located upstream from the wrapping section (4). Disposed between the printing unit (20) and the wrapping section (4) is an adjusting device (62) for varying the length of a feeding path of the paper web W. A density signal from the density sensor (70) is used to control the operation of the printing unit (20) and adjusting device (62). Thus, based on the density signal, the print density of the printed information (PI) and the arrival timing thereof at the density sensor (70) are each controlled.

Abstract: A tip paper predrying apparatus attached to a filter attachment includes an infrared lamp unit (16) located in the middle of a transfer path for a tip paper (P). After paste is applied to one surface of the tip paper in a paste applicator section (2), the pasted surface of the tip paper is irradiated with infrared rays from the infrared lamp unit before the tip paper is cut into individual tip paper pieces in a cutter section (4), whereby the tip paper is predried without any special contact with a heat source.

Abstract: A polishing apparatus which attaches the semi-conductor wafers 5 to the polishing plate 4 for performing the polishing as applying pressure the polishing cloth with the semi-conductor wafers, is provided with a guide ring 7 disposed outside of the polishing plate for pressing the polishing cloth separately from the polishing plate, a retainer ring 8 provided at the lower end of the guide ring for contacting the polishing cloth, and a weight 9 detachably mounted on the upper surface of the guide ring for adjusting the pressure to the polishing cloth.

Abstract: A polishing apparatus which attaches the semi-conductor wafers 5 to the polishing plate 4 for performing the polishing as applying pressure the polishing cloth with the semi-conductor wafers, is provided with a guide ring 7 disposed outside of the polishing plate for pressing the polishing cloth separately from the polishing plate, a retainer ring 8 provided at the lower end of the guide ring for contacting the polishing cloth, and a weight 9 detachably mounted on the upper surface of the guide ring for adjusting the pressure to the polishing cloth.

Abstract: A tip paper predrying apparatus attached to a filter attachment includes an infrared lamp unit (16) located in the middle of a transfer path for a tip paper (P). After paste is applied to one surface of the tip paper in a paste applicator section (2), the pasted surface of the tip paper is irradiated with infrared rays from the infrared lamp unit before the tip paper is cut into individual tip paper pieces in a cutter section (4), whereby the tip paper is predried without any special contact with a heat source.