Patents by Inventor Masayoshi Takeuhi

Masayoshi Takeuhi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structure for mounting semiconductor part in which bump and land portion are hardly detached from each other and method of manufacturing mounting substrate used therein
    Patent number: 7456493
    Abstract: There is provided a structure for mounting a semiconductor part having improved productivity, in which a bump is detached from a land portion and a method of manufacturing a mounting substrate used therein. The structure for mounting the semiconductor part includes a mounting substrate 1 having an insulating substrate 2 on which a wiring pattern 3 and a land portion 4 are provided, a semiconductor part 5 mounted on the mounting substrate 1 using a bump 7 and the land portion 4, and an underfill 8 inserted between the semiconductor part 5 and the insulating substrate 2. An undercut portion 4c having an inverse tapered shape from the insulating substrate 2 to an upper surface of the land portion 4 is provided in an edge 4a of the land portion 4 in which the bump 7 is located, and the bump is inserted into the undercut portion. Accordingly, since the couple between the bump 7 and the land portion 4 becomes stronger, the bump is not detached from the land portion 4 when the underfill 8 expands or contracts.
    Type: Grant
    Filed: March 20, 2006
    Date of Patent: November 25, 2008
    Assignee: Alps Electric Co., Ltd.
    Inventors: Shinji Murata, Masayoshi Takeuhi