Abstract: Provided are a communication device and a communication system in which multi-hop communication is possible and management of communication routes is easy. In a distribution-system communication device 100, a port management means 132 is provided in a communication control unit 130, and each of ports provided in a port section 110 can be managed with the port management means 132 by IP addresses of adjacent stations connected to each of the ports. In a port management means 132 of a master station, correspondence information between port numbers of the port section 110 of each of the slave stations and the IP addresses of adjacent stations of a connection destination is input from the port management means 132 of each of the slave stations, and connection states between the ports of each of the slave stations can be managed based on the correspondence information.

Abstract: A semiconductor device manufacturing apparatus includes a stage, a head section facing the stage and configured to hold a semiconductor element, a driving section configured to drive one of the head section and the stage to move in a first direction intersecting the head section and the stage and apply a load to the other one of the stage and the head section, a load sensor configured to sense a load value of the applied load, and a controller configured to control the driving section to move one of the head section and the stage, and then separate the head section from the stage in accordance with a change in the load value.

Abstract: A communication system that performs communication route control includes a center node and at least one node connected thereto via a communication line. The node includes an error-detecting unit that detects an error in the communication route, a route request packet transmitting unit that broadcasts a new route request packet in response to the detection, a route answer packet receiving unit that receives a route answer packet transmitted from a node that is a target node or a node having a valid route to the target node or from the center node, and a communication route updating unit that updates a communication route based on the route answer packet. A node that is the target node or the node having a valid route to the target node or the center node transmits a route answer packet to the node in response to a route request packet transmitted from the node.

Abstract: A contactless information medium includes: a body forming an outer shape of the contactless information medium; an IC chip housed in the body; a coil antenna which is formed of a string of conductive wire, both ends of the conductive wire being connected to the IC chip, and which includes a main arrangement pattern provided along a closed curve and a plurality of sub-arrangement patterns, each of which has a smaller diameter than the main arrangement pattern; and a plurality of bobbins provided in the body and arranged along the closed curve, the string of conductive wire being wound around the plurality of bobbins along the closed curve to form the main arrangement pattern, the string of conductive wire being wound around each of the bobbins to form the sub-arrangement patterns.

Abstract: According to one embodiment, a semiconductor device includes a metal plate, a plurality of semiconductor chips, an insulation layer, a wiring layer, external connection terminals and a sealing resin portion. The metal plate includes a first surface and the plurality of semiconductor chips are laminated on a second surface of the metal plate. The insulation layer and the wiring layer are provided on the semiconductor chips. The external connection terminals are provided on the insulation layer and the wiring layer. The sealing resin portion seals the plurality of semiconductor chips while exposing the first surface of the metal plate. At least one pair of opposing outer peripheral surfaces of the metal plate are covered with the sealing resin portion.

Abstract: In one embodiment, a semiconductor device includes a chip stacked body disposed on an interposer substrate and an interface chip mounted on the chip stacked body. The chip stacked body has plural semiconductor chips, and is electrically connected via through electrodes provided in the semiconductor chips excluding a lowermost semiconductor chip in a stacking order of the plural semiconductor chips and bump electrodes. The interface chip is electrically connected to the interposer substrate via a rewiring layer formed on a surface of an uppermost semiconductor chip in the stacking order or through electrodes provided in the interface chip.

Abstract: An optical communication module in which the pin arrangement can be applied flexibly. An optical communication module has an outer shape formed based on normal standards and which is able to communicate with a host-side circuit board, etc. to which it is fitted, via a predetermined communication interface; wherein the optical communication module exchanges input/output I/F information with the circuit board, etc., and the communication interface can be switched to another communication interface based on these input/output I/F information.

Abstract: A communication system that performs communication route control includes a center node and at least one node connected thereto via a communication line. The node includes an error-detecting unit that detects an error in the communication route, a route request packet transmitting unit that broadcasts a new route request packet in response to the detection, a route answer packet receiving unit that receives a route answer packet transmitted from a node that is a target node or a node having a valid route to the target node or from the center node, and a communication route updating unit that updates a communication route based on the route answer packet. A node that is the target node or the node having a valid route to the target node or the center node transmits a route answer packet to the node in response to a route request packet transmitted from the node.

Abstract: A detailed data storage apparatus creates, when a detailed data database that stores therein detailed data relatint to each stage of a process executed through multiple stages receives detailed data relating to a predetermined stage, forecast detailed data indicating contents predicted for a stage next to a predetermined stage and subsequent stages from the detailed data, and stores the forecast detailed data in the detailed data database. The apparatus includes an order holding unit that orders and holds the multiple stages; a determining unit that determines whether there is a stage immediately previous to the predetermined stage; and an offset detailed-data creating unit that creates offset detailed data including a content for offsetting the forecast detailed data created at the immediately previous stage when the determining unit determines that there is the immediately previous stage, so as to store the offset detailed data in the detailed data database.

Abstract: An optical transmission system is provided. The optical transmission system includes a user side optical repeater device (ORD), a central office side ORD, and wavelength multiplexing and wavelength de-multiplexing functions (MUX/DEMUX). The user side optical repeater device (ORD) is to be connected with a user side optical network unit (ONU), transmits data in two ways, and is used for wavelength division multiplexing (WDM). The central office side ORD is to be connected with a central office side optical line terminal (OLT), transmits data in two ways, and is used for WDM. The wavelength multiplexing and a wavelength de-multiplexing functions (MUX/DEMUX), are used for relaying between the user side ORD and the central office side ORD.

Abstract: Provided are a communication device and a communication system in which multi-hop communication is possible and management of communication routes is easy. In a distribution-system communication device 100, a port management means 132 is provided in a communication control unit 130, and each of ports provided in a port section 110 can be managed with the port management means 132 by IP addresses of adjacent stations connected to each of the ports. In a port management means 132 of a master station, correspondence information between port numbers of the port section 110 of each of the slave stations and the IP addresses of adjacent stations of a connection destination is input from the port management means 132 of each of the slave stations, and connection states between the ports of each of the slave stations can be managed based on the correspondence information.

Abstract: A method of playing a game for two or more players comprising each player selecting a predetermined number of figures from a plurality of figures, a first player executing a turn, wherein the first player has an option of at least one of moving one of the first player's selected figures from one location to another and attacking one of another player's selected figures using one of the first player's selected figures, wherein a result of said attacking is determined by the first player performing a predetermined action using one of said first player's selected figures and another player performing the predetermined action using one of another player's selected figures.

Abstract: A detailed data aggregation apparatus holds detailed data of a plurality of events and a transcription and replenishment rule. In the rule, a plurality of common items, which are common to different events as a minimum unit of aggregation, are defined, and a transcription instruction (for instructing to transcribe a value corresponding to an event definition item to a value corresponding to the common item) and a replenishment instruction (for instructing to replenish a value to be replenished as the value corresponding to the common item) are described, associated with each common item for each event. Regarding the held detailed data, transcribed/replenished detailed data including values corresponding to the common items is created from the respective detailed data according to the transcription instruction or replenishment instruction.

Abstract: In one embodiment, a semiconductor device includes a chip stacked body disposed on an interposer substrate and an interface chip mounted on the chip stacked body. The chip stacked body has plural semiconductor chips, and is electrically connected via through electrodes provided in the semiconductor chips excluding a lowermost semiconductor chip in a stacking order of the plural semiconductor chips and bump electrodes. The interface chip is electrically connected to the interposer substrate via a rewiring layer formed on a surface of an uppermost semiconductor chip in the stacking order or through electrodes provided in the interface chip.

Abstract: The semiconductor device includes a wiring substrate having connection pads and a semiconductor chip having electrode pads. The semiconductor chip is mounted on the wiring substrate, and the electrode pads are connected to the connection pads via solder bumps. An underfill resin formed of a cured thermosetting resin is filled in a gap between the wiring substrate and the semiconductor chip. The underfill resin has a glass transition temperature which increases accompanying growth of crystal grains of the solder bumps.

Abstract: An optical transmission system is provided. The optical transmission system includes a user side optical repeater device, a central office side optical repeater device, and wavelength multiplexing and wavelength de-multiplexing functions. The user side optical repeater device is to be connected with a user side optical network unit, transmits data in two ways, and is used for wavelength division multiplexing. The central office side optical repeater device is to be connected with a central office side optical line terminal, transmits data in two ways, and is used for wavelength division multiplexing. The wavelength multiplexing and wavelength de-multiplexing functions are used for relaying between the user side optical repeater device and the central office side optical repeater device.

Abstract: In one embodiment, a preliminary solder layer made of a Sn alloy is formed on a connecting pad of a wiring substrate. A solder bump made of a Sn alloy is formed on an electrode pad of a semiconductor chip. After contacting the preliminary solder layer and the solder bump, the preliminary solder layer and the solder bump are melted by heating to a temperature of their melting points or higher to form a solder connecting part made of a Sn alloy containing Ag and Cu. Only the preliminary solder layer of the preliminary solder layer and the solder bump is composed of a Sn alloy containing Ag.

Abstract: Without using a component such as a chip coil, a winding pattern is formed with a wire with which a main wiring pattern is formed. This enables to deal with the flexibility by realizing a thin product using a coil antenna. Further, the wiring pattern is designed such that the winding pattern is provided and distributed to the main wiring pattern forming a loop, and is formed with the wire so as to have a wound shape small enough compared with the main wiring pattern. In this way, the ratio of the self-inductance to the mutual inductance is appropriately made further large, so that the mutual inductance is made comparatively small.

Abstract: In one embodiment, a separation layer and a wiring layer are formed in order on a supporting substrate. A plurality of semiconductor chips are mounted on the wiring layer. The plural semiconductor chips are collectively sealed by a sealing resin layer. A resin-sealed body is evenly held by a holder. The resin-sealed body is separated from the supporting substrate by shearing the separation layer while being heated. The separated resin-sealed body is cooled while a state of the resin-sealed body being held evenly by the holder is maintained, and then a holding state of the resin-sealed body by the holder is released. The resin-sealed body is cut to singulate a circuit structure body.

Abstract: In a semiconductor device manufacturing method, a first resin layer with optical transmission restrained is formed on a supporting substrate and a second resin layer made of thermoplastic resin is formed on the first resin layer. An insulating layer and a wiring layer are formed on the second resin layer and a first semiconductor chip is mounted on the wiring layer. The supporting substrate is separated by irradiating the first resin layer with a laser beam, and the second resin layer is removed.