Abstract: A welding structural part 1 is manufactured by overlapping the surfaces of steel sheets 2, and forming a weld zone by spot welding. The weld zone 3 includes: a weld nugget 4; and a heat affected zone 5 surrounding the weld nugget 4, wherein the hardness in the weld zone increases along an exterior region 6 of the heat affected zone 5 toward the heat affected zone 5, and then decreases along the heat affected zone 5 toward the central region of the weld nugget 4. In the boundary region between the weld nugget 4 and the heat affected zone 5, the weld nugget 4 may have a convex portion 4A bulging into the heat affected zone 5 along the overlapped portion. The steel sheets 2 contain carbon in 0.15 mass % or more.

Abstract: A high-strength die-quenched part 1 is formed by heating a high-strength steel sheet 11 up to an austenite region, hot stamping and cooling inside a mold, and its microstructure has the martensite wherein carbide particles 2 are finely dispersed over an entire region including prior-austenite grain boundaries. It is desirable that the prior-austenite grain size in the microstructure of the high-strength steel sheet, which is a base material, be 10 ?m or smaller. The high-strength die-quenched part has high-strength and high-ductility thanks to its martensite.

Abstract: A welding structural part 1 is manufactured by overlapping the surfaces of steel sheets 2, and forming a weld zone by spot welding. The weld zone 3 includes: a weld nugget 4; and a heat affected zone 5 surrounding the weld nugget 4, wherein the hardness in the weld zone increases along an exterior region 6 of the heat affected zone 5 toward the heat affected zone 5, and then decreases along the heat affected zone 5 toward the central region of the weld nugget 4. In the boundary region between the weld nugget 4 and the heat affected zone 5, the weld nugget 4 may have a convex portion 4A bulging into the heat affected zone 5 along the overlapped portion. The steel sheets 2 contain carbon in 0.15 mass % or more.

Abstract: A high-strength die-quenched part 1 is formed by heating a high-strength steel sheet 11 up to an austenite region, hot stamping and cooling inside a mold, and its microstructure has the martensite wherein carbide particles 2 are finely dispersed over an entire region including prior-austenite grain boundaries. It is desirable that the prior-austenite grain size in the microstructure of the high-strength steel sheet, which is a base material, be 10 ?m or smaller. The high-strength die-quenched part has high-strength and high-ductility thanks to its martensite.

Abstract: Production of hot dipped hot rolled steel strip by producing steel strip by casting by a thin slab continuous casting process and hot rolling, said steel strip containing, by mass %, C: 0.03% or more, Si: 0.02% or more, Mn: 0.15% or more, and Ca: 0.001% or more by heating it to a peak maximum steel strip temperature of 550° C. to less than 650° C. by a temperature elevation rate of 25° C./sec or more for 15 sec or more for oxidation, heating it to a peak maximum steel strip temperature of 700° C. to 760° C. so that the time when the steel strip temperature is 570° C. or more is 25 sec to 45 sec for reduction, then hot dipping it.

Abstract: The present invention relates to a monclonal antibody capable of suppressing the motility of cancer cells, a polypeptide recognizable by said anti-cancer antibody and its fragment peptides which is capable of suppressing the motility of cancer cells. The present invention also relates to a production and a use for preventing the matastasis of cancer thereof.

Abstract: The present invention relates to a monclonal antibody capable of suppressing the motility of cancer cells, a polypeptide recognizable by said anti-cancer antibody and its fragment peptides which is capable of suppressing the motility of cancer cells.The present invention also relates to a production and a use for preventing the matastasis of cancer thereof.

Abstract: A shift register having a plurality of flip-flop circuits connected in cascade in which a clock pulse is supplied to the flip-flop circuit at the final stage and the AND-outputs from the respective stage of flip-flop circuits are supplied to the preceding stage of flip-flop circuits as clock pulses, whereby the input data are shifted or transferred in synchronism with the clock pulse.

Abstract: A flip-flop circuit is disclosed which has a first semiconductor region of a first conductivity type, injector and base regions of a second conductivity type in the first region, and collector region of the first conductivity type in the base region. In this case, the first, base and collector regions constitute a gate transistor, two of the gate transistors constitute a flip-flop circuit, and each of the transistors has a predetermined distance relation among the injector and collector regions and base contacts in such a manner that the inherent difference of ON and OFF speeds between the transistors causes the flip-flop circuit to operate without causing unnecessary delay.