Abstract: There are provided aqueous dispersions for CMP that can efficiently polish both copper films and barrier metal films, which can give sufficient flattened finished surfaces without excessive polishing of insulating films, as well as a CMP process employing the aqueous dispersions. The aqueous dispersions for CMP according to the invention are characterized in that for polishing of a copper film, barrier metal film and insulating film under the same conditions, the polishing rate ratio (RCu/RBM) of the copper film (RCu) and the barrier metal film (RBM) is such that 0.5≦RCu/RBM≦2, and the polishing rate ratio (RCu/RIn) of the copper film (RCu) and the insulating film (RIn) is such that 0.5≦RCu/RIn≦2.

Abstract: The present invention provides aqueous dispersion slurry of inorganic particles which is so stable as not to increase in viscosity, gel or sediment even if stored for a long time and therefore can be used as raw materials for, for example, cosmetics, paint, coating materials and lapping slurry for semiconductor wafers, and production method of such aqueous dispersion slurry. The aqueous dispersion slurry according to the present invention has the number of particles whose a particle diameter of 1.3 .mu.m or more is 180,000 or less per mL in terms of 30 wt % in concentration, and the average particle diameter thereof is in a range of 0.05-0.9 .mu.m. The number of particles having aparticle diameter of 1.3 .mu.m or more is counted by using Particle Sensor KS-60, which is a light extinction type sensor for detecting particles, and Particle Counter KL-11, which is a particle counter, both of which made by the same manufacturer, Rion Electro Corp.

Abstract: An ethylene-.alpha.-olefin-non-conjugated diene copolymer rubber composition which comprises two kinds of ethylene-.alpha.-olefin-non-conjugated diene copolymers, ?the copolymers (A) and (B)!, copolymer (A) containing ethylidenenorbornene and either dicyclopentadiene or .alpha.,.omega.-diene having 8 to 20 carbon atoms in the main chain as the non-conjugated dienes, copolymer (B) containing ethylidenenorbornene as the non-conjugated diene, the weight ratio of the copolymer (A) to the copolymer (B) being 30/70 to 70/30, wherein the copolymer (A) has a relatively low molecular weight, a specific ethylene/.alpha.-olefin weight ratio and a specific non-conjugated diene content and the copolymer (B) has a relatively high molecular weight and a specific ethylene/.alpha.-olefin weight ratio. Said copolymer rubber composition, when highly foamed, shows no reduction particularly in low tensile stress, and is excellent in shape-retention during cross-linking and foaming, and in compression set and processibility.