Abstract: There is provided a limited-area reflection type optical sensor having an emitted light lens and a reflected light lens. An opposite-light-receiver-side portion opposite to a light receiver side constitutes a first curvature surface having a first curvature while a light-receiver-side portion on the light receiver side with respect to the opposite-light-receiver-side portion constitutes a second curvature surface having a second curvature smaller than the first curvature in the emitted light lens provided in an optical path of the emitted light. An opposite-light-emitter-side portion opposite to a light emitter side constitutes a fourth curvature surface having a fourth curvature while a light-emitter-side portion on the light emitter side with respect to the opposite-light-emitter-side portion constitutes a fifth curvature surface having a fifth curvature smaller than the fourth curvature in the reflected light lens provided in an optical path of the reflected light.

Abstract: There is provided a limited-area reflection type optical sensor having an emitted light lens and a reflected light lens. An opposite-light-receiver-side portion opposite to a light receiver side constitutes a first curvature surface having a first curvature while a light-receiver-side portion on the light receiver side with respect to the opposite-light-receiver-side portion constitutes a second curvature surface having a second curvature smaller than the first curvature in the emitted light lens provided in an optical path of the emitted light. An opposite-light-emitter-side portion opposite to a light emitter side constitutes a fourth curvature surface having a fourth curvature while a light-emitter-side portion on the light emitter side with respect to the opposite-light-emitter-side portion constitutes a fifth curvature surface having a fifth curvature smaller than the fourth curvature in the reflected light lens provided in an optical path of the reflected light.

Abstract: A limited reflection type photoelectric sensor has a light projecting unit having a light emitting element, a light receiving unit having a light receiving element, and a beam separating member that separates a projected light beam into beams oriented in a plurality of directions and located in an optical path of the projected light beam from the light emitting element. The light projecting unit and the light receiving unit are configured to meet the condition that an intersecting angle between an optical axis of a projected light beam and an optical axis of a receiving light beam is set such that the projected light beam from the light projecting unit is directed to an object detection limited area and the receiving light beam which is reflected light by an object existing in the object detection limited area is received by the light receiving unit.

Abstract: An input device has a housing having an operation hole formed therein, an operation member supported in a slidably moving manner in multi-directions within the operation hole, and at least two magnetic sensors, arranged at a periphery of the operation member, for detecting change in magnetic property by displacement of the operation member. The operation member includes a holder having a circular ring-shaped magnet incorporated in a fit-in hole and a central push button having a disc plate made of magnetic material integrated at a lower surface. The central push button is fitted in the circular ring-shaped magnet to adsorb, in a separable manner, the disc plate to the circular ring-shaped magnet and position-regulate the central push button.

Abstract: An input device includes a print substrate having a plurality of electrostatic electrodes arranged on an upper surface at a periphery of a fit-in hole and a rotation operating body turnably assembled by being fitted to the fit-in hole of the print substrate. A rotation plate of the rotation operating body elastically deforms in a plate thickness direction when the rotation plate is pushed, and returns when pushing is released.

Abstract: An input device has a housing having an operation hole formed therein, an operation member supported in a slidably moving manner in multi-directions within the operation hole, and at least two magnetic sensors, arranged at a periphery of the operation member, for detecting change in magnetic property by displacement of the operation member. The operation member includes a holder having a circular ring-shaped magnet incorporated in a fit-in hole and a central push button having a disc plate made of magnetic material integrated at a lower surface. The central push button is fitted in the circular ring-shaped magnet to adsorb, in a separable manner, the disc plate to the circular ring-shaped magnet and position-regulate the central push button.

Abstract: A convex portion is formed along the edge of a semiconductor substrate to surround a chip region on the main surface side of the semiconductor substrate. For example, the convex portion is formed part of the semiconductor substrate. The height of the convex portion is set to approximately the same height as the surface of an insulating film attained after the end of the CMP (chemical mechanical polishing) process effected for the insulating film. The width the of the convex portion is set smaller than the width from the edge of the semiconductor substrate to a position in front of the chip region. The semiconductor substrate is attached to a carrier and the CMP process is effected by use of a polishing pad and a slurry. At the time of CMP, since a local heavy load occurring in the edge portion of the semiconductor substrate is applied only to the convex portion, the wafer edge over-polishing will not occur.

Abstract: In a method of manufacturing a semiconductor device, an interlayer insulating film is formed along a surface of a semiconductor substrate having a stepped surface. A stopper surface is formed at least at a recess in the interlayer insulating film. The interlayer insulating film and the stopper film are polished until the interlayer insulating film and the stopper film are exposed on the same plane. The stopper film remaining after the polishing is etched and removed. The interlayer insulating film is polished and flattened.