Abstract: A coil component and a method for manufacturing the coil component. A coil component includes a body having a plurality of stacked magnetic layers, and a coil inside the body and having a plurality of stacked coil wirings. The magnetic layers and the coil wirings are alternately stacked in one direction, a first surface of the coil wiring on one side in the one direction and one magnetic layer located on one side in the one direction of the coil wiring are in contact with each other, a gap portion exists between a second surface of the coil wiring on the other side in the one direction and the other magnetic layer located on the other side in the one direction of the coil wiring, and a magnetic film is present in at least a part of the second surface of the coil wiring.

Abstract: A coil component in which stress is relieved and a coil is stably positioned is to be provided. A coil component of the present disclosure includes a base body; and a coil provided in the base body. The base body includes a plurality of laminated magnetic layers. The coil includes a plurality of laminated coil wirings. The magnetic layers and the coil wirings are alternately laminated. A gap portion is provided between each of the magnetic layers and each of the coil wirings. Part of the coil wirings contacts the magnetic layers, and a region containing a metal oxide is present on part of a surface of each of the coil wirings on a side of the gap portion.

Abstract: A coil component in which stress is relieved and a coil is stably positioned is to be provided. A coil component of the present disclosure includes a base body; and a coil provided in the base body. The base body includes a plurality of laminated magnetic layers. The coil includes a plurality of laminated coil wirings. The magnetic layers and the coil wirings are alternately laminated. A gap portion is provided between each of the magnetic layers and each of the coil wirings. Part of the coil wirings contacts the magnetic layers, and a region containing a metal oxide is present on part of a surface of each of the coil wirings on a side of the gap portion.

Abstract: An indoor unit for an air-conditioning apparatus includes a cartridge provided to an air inlet so as to be freely mountable and dismountable. The cartridge accommodates a filter so as to be freely movable in a fore-and-aft direction and has an opening port formed in one end portion in the fore-and-aft direction. A dust box is provided on a side of the end portion of the cartridge. The dust box includes a cleaning mechanism configured to clean the filter and a dust collecting portion configured to collect dust.

Abstract: A method of manufacturing a coil component which includes an element body including magnetic layers stacked in a first direction and having a surface located in the first direction or a second direction reverse to the first direction, a coil and extended wiring in the element body, and an outer electrode at least on the surface. The method includes forming an unbaked coil wiring layer zone by providing a paste-like unbaked coil wiring layer and a paste-like unbaked magnetic layer in the same layer in the direction orthogonal to the first direction on an upper surface of a sheet-like unbaked magnetic layer with respect to the first direction; and forming an unbaked extended wiring layer zone by providing a paste-like unbaked extended wiring layer and a paste-like unbaked magnetic layer in the same layer in the direction orthogonal to the first direction without providing a sheet-like unbaked magnetic layer.

Abstract: A coil component includes a multilayer body including a plurality of insulating layers and a plurality of coil conductor layers which are stacked in a stacking direction, and a first via conductor and a second via conductor that electrically connect the coil conductor layers. The first via conductor is smaller than the second via conductor.

Abstract: A test system of embodiments electrically connects one or more first semiconductor chips formed on a first wafer and one or more second semiconductor chips formed on a second wafer to perform tests on the one or more first and second semiconductor chips. The test system includes a test device that supplies a test signal to each of the one or more first semiconductor chips, a first probe device including a first probe to be connected to a first internal pad of each of the one or more first semiconductor chips and a first communication circuit configured to transmit and receive a signal, and a second probe device including a second probe to be connected to a second internal pad of each of the one or more second semiconductor chips and a second communication circuit configured to transmit and receive the signal to and from the first communication circuit.

Abstract: A multilayer coil component including an element assembly that includes an insulator portion and a coil embedded in the insulator portion and composed of a plurality of coil conductors electrically connected to each other, an extension portion disposed at each end portion of the coil, and an outer electrode disposed on the surface of the insulator portion and electrically connected to the extension portion. The thickness of the coil conductor in the extension portion of the coil is about 1.05 times or more and 2.0 times or less (i.e., from about 1.05 times to 2.0 times) the thickness of the coil conductor in a winding portion of the coil.

Abstract: An air-conditioning apparatus includes a heat-source detection unit provided at the front of a housing. The heat-source detection unit includes an infrared sensor that detects a heat source in an air-conditioned space and a supporting member that supports the infrared sensor. The supporting member is rotated about an axis that extends in a vertical direction. Part of the infrared sensor that corresponds to the field of view thereof is exposed when the infrared sensor faces the air-conditioned space, and the part of the infrared sensor is concealed when the infrared sensor does not face the air-conditioned space.

Abstract: A coil component that can mitigate stress generated between a coil wire and a magnetic layer and make a position of a coil stable, and a manufacturing method of the coil component. The coil component includes a base body and a coil disposed in the base body, the base body includes a plurality of magnetic layers laminated in a first direction, the coil includes a plurality of coil wires laminated in the first direction, the base body further includes a crack generating layer that overlaps at least a part of the coil wires when viewed in the first direction, and a crack is present inside the crack generating layer.

Abstract: A coil component is capable of reducing specific resistance of a coil and reliably mitigating stress. A coil component includes a base body and a coil disposed in the base body. The base body includes a plurality of magnetic layers laminated in a first direction. The coil includes a plurality of coil wires laminated in the first direction. The coil wires extend along a plane orthogonal to the first direction. Each of the coil wires includes a first coil conductor layer and a second coil conductor layer laminated in the first direction. Specific resistance of the first coil conductor layer is smaller than specific resistance of the second coil conductor layer.

Abstract: An AC electric motor drive system includes a power supply transformer connected to an AC power supply and insulating an AC power supply side and a load side; an AC electric motor; a power converter which converts AC voltage outputted from the power supply transformer to output AC voltage, and which outputs the output AC voltage to the AC electric motor; and a capacitive component having one end connected to the load side of the power supply transformer, and another end grounded.

Abstract: A test system of embodiments electrically connects one or more first semiconductor chips formed on a first wafer and one or more second semiconductor chips formed on a second wafer to perform tests on the one or more first and second semiconductor chips. The test system includes a test device that supplies a test signal to each of the one or more first semiconductor chips, a first probe device including a first probe to be connected to a first internal pad of each of the one or more first semiconductor chips and a first communication circuit configured to transmit and receive a signal, and a second probe device including a second probe to be connected to a second internal pad of each of the one or more second semiconductor chips and a second communication circuit configured to transmit and receive the signal to and from the first communication circuit.

Abstract: A multilayer inductor manufacturing method includes stacking a first coil conductor layer on a first magnetic layer; stacking a first burn-away material on side surfaces of the first coil conductor layer; stacking a second magnetic layer on the first burn-away material and first magnetic layer; stacking a second burn-away material on the second magnetic layer laterally outside an upper surface of the first coil conductor layer; stacking a second coil conductor layer on the upper surface of the first coil conductor layer and second burn-away material; stacking a third burn-away material on side surfaces and an upper surface of the second coil conductor layer; stacking a third magnetic layer on side surfaces of the third burn-away material and the second magnetic layer; stacking a fourth magnetic layer on the third burn-away material and the third magnetic layer; and burning away the first, second, and third burn-away materials via firing.

Abstract: A coil component and a method for manufacturing the coil component. A coil component includes a body having a plurality of stacked magnetic layers, and a coil inside the body and having a plurality of stacked coil wirings. The magnetic layers and the coil wirings are alternately stacked in one direction, a first surface of the coil wiring on one side in the one direction and one magnetic layer located on one side in the one direction of the coil wiring are in contact with each other, a gap portion exists between a second surface of the coil wiring on the other side in the one direction and the other magnetic layer located on the other side in the one direction of the coil wiring, and a magnetic film is present in at least a part of the second surface of the coil wiring.

Abstract: A coil component includes an element and a coil that is provided inside the element and that is spirally wound. The coil includes a plurality of coil conductor layers and an extended conductor layer, which are laminated in a first direction. The extended conductor layer overlaps a side gap portion, which is situated on an outer side of a region of the element that is surrounded by the coil conductor layers, and extends so as to reach an outer surface of the element. The element includes a first stress relaxation layer that contacts the coil conductor layers, and a second stress relaxation layer that, while extending along the extended conductor layer, contacts a coil-conductor-layer side of the extended conductor layer, and is positioned inside the side gap portion without reaching the outer surface of the element.

Abstract: A fan includes an impeller including a boss serving as a center of rotation and a plurality of blades provided on an outer circumferential surface of the boss, and a structure member installed on an upstream side of the impeller in an airflow direction. The plurality of blades each have a plurality of recesses disposed only on a side of a suction surface of a leading edge. The plurality of recesses each have a rectangular shape having two longitudinal sides. Consequently, it is possible to reduce fluctuations of lift on the plurality of blades and thereby reduce discrete frequency noise.

Abstract: A coil component in which stress is relieved and a coil is stably positioned is to be provided. A coil component of the present disclosure includes a base body; and a coil provided in the base body. The base body includes a plurality of laminated magnetic layers. The coil includes a plurality of laminated coil wirings. The magnetic layers and the coil wirings are alternately laminated. A gap portion is provided between each of the magnetic layers and each of the coil wirings. Part of the coil wirings contacts the magnetic layers, and a region containing a metal oxide is present on part of a surface of each of the coil wirings on a side of the gap portion.

Abstract: A coil component that can stabilize the position of a coil while relaxing the stress between coil wiring and a magnetic layer includes an element body and a coil in the element body. The element body has magnetic layers laminated in a first direction. The coil has pieces of coil wiring laminated in the first direction. The pieces extend along a plane orthogonal to the first direction. Each of the pieces of coil wiring has two faces on both sides in the first direction and two side faces on both sides in a direction orthogonal to the first direction, in a section orthogonal to an extending direction of each of the pieces. The two faces and one side face among the two side faces form a gap with the magnetic layer, and the other side face among the two side faces is in contact with the magnetic layer.