Abstract: A laser apparatus includes a laser oscillator; an acousto-optic modulation unit including a first acousto-optic modulator that diffracts a laser beam from the laser oscillator when a first ultrasonic wave is applied and a second acousto-optic modulator that diffracts a higher order beam output from the first acousto-optic modulator when a second ultrasonic wave is applied; and an amplifier that amplifies the laser beam from the acousto-optic modulation unit, a propagation direction of the first ultrasonic wave relative to a diffracted direction of the higher order beam emitted from the first acousto-optic modulator and a propagation direction of the second ultrasonic wave relative to a diffracted direction of a higher order beam emitted from the second acousto-optic modulator being different.

Abstract: A laser apparatus includes a laser oscillator; an acousto-optic modulation unit including a first acousto-optic modulator that diffracts a laser beam from the laser oscillator when a first ultrasonic wave is applied and a second acousto-optic modulator that diffracts a higher order beam output from the first acousto-optic modulator when a second ultrasonic wave is applied; and an amplifier that amplifies the laser beam from the acousto-optic modulation unit, a propagation direction of the first ultrasonic wave relative to a diffracted direction of the higher order beam emitted from the first acousto-optic modulator and a propagation direction of the second ultrasonic wave relative to a diffracted direction of a higher order beam emitted from the second acousto-optic modulator being different.

Abstract: A laser processing method for laser processing of a workpiece made of a base material and a fiber reinforced composite material containing fibers having a thermal conductivity and a processing threshold higher than physical properties of glass fibers. The laser processing method includes a step of processing the workpiece by forming a plurality of through-holes extending through the workpiece by irradiating the workpiece with pulsed laser light from a processing head while relatively moving the workpiece and the processing head in a predetermined cutting direction. The pulsed laser light has a pulse width smaller than 1 ms and an energy density capable of forming each of the through-holes by a single pulse.

Abstract: A cell culture analyzer comprises a stirring member and an air discharge and intake unit. The stirring member is used in a state of being immersed in a medium, and has a liquid discharge and intake port for discharging or drawing in the medium, and an air discharge and intake port for discharging or drawing in air in order to discharge or draw in the medium from the liquid discharge and intake port. The air discharge and intake unit is linked to the air discharge and intake port of the stirring member, and discharges or draws in the air discharged or drawn in from the air discharge and intake port.

Abstract: A laser processing method for laser processing of a workpiece made of a base material and a fiber reinforced composite material containing fibers having a thermal conductivity and a processing threshold higher than physical properties of glass fibers. The laser processing method includes a step of processing the workpiece by forming a plurality of through-holes extending through the workpiece by irradiating the workpiece with pulsed laser light from a processing head while relatively moving the workpiece and the processing head in a predetermined cutting direction. The pulsed laser light has a pulse width smaller than 1 ms and an energy density capable of forming each of the through-holes by a single pulse.

Abstract: A laser machining apparatus that separates a workpiece into a machined product and a remnant material by cutting using irradiation with a laser beam includes: a nozzle that squirts gas at a machining point; a rotation mechanism that causes the nozzle or the workpiece to rotate about an optical axis; and a controller that performs control of the rotation mechanism. This control causes the nozzle, which squirts the gas at the machining point, to be at the machined product side during the cutting.

Abstract: A laser processing method for laser processing of a workpiece made of a base material and a fiber reinforced composite material containing fibers having a thermal conductivity and a processing threshold higher than physical properties of glass fibers. The laser processing method includes a step of processing the workpiece by forming a plurality of through-holes extending through the workpiece by irradiating the workpiece with pulsed laser light from a processing head while relatively moving the workpiece and the processing head in a predetermined cutting direction. The pulsed laser light has a pulse width smaller than 1 ms and an energy density capable of forming each of the through-holes by a single pulse.

Abstract: A laser machining apparatus that separates a workpiece into a machined product and a remnant material by cutting using irradiation with a laser beam includes: a nozzle that squirts gas at a machining point; a rotation mechanism that causes the nozzle or the workpiece to rotate about an optical axis; and a controller that performs control of the rotation mechanism. This control causes the nozzle, which squirts the gas at the machining point, to be at the machined product side during the cutting.

Abstract: A laser processing method for laser processing of a workpiece made of a base material and a fiber reinforced composite material containing fibers having a thermal conductivity and a processing threshold higher than physical properties of glass fibers. The laser processing method includes a step of processing the workpiece by forming a plurality of through-holes extending through the workpiece by irradiating the workpiece with pulsed laser light from a processing head while relatively moving the workpiece and the processing head in a predetermined cutting direction. The pulsed laser light has a pulse width smaller than 1 ms and an energy density capable of forming each of the through-holes by a single pulse.

Abstract: A substrate for sample analysis is a substrate for sample analysis used for causing a binding reaction between an analyte and a ligand in a liquid sample, the substrate for sample analysis including: a base substrate having a rotation axis and a predetermined thickness; a chamber located in the base substrate for holding a liquid sample containing an analyte and a ligand immobilized on a surface of magnetic particles; and at least one magnet arranged at a position such that the magnetic particles are captured in the chamber by the magnet.

Abstract: A laser machining beam method is a method that is carried out by a laser beam machine including a laser oscillator that is a first laser oscillator which emits a pulse of a laser beam that is a first laser beam, and a laser oscillator that is a second laser oscillator which emits a pulse of a laser beam that is a second laser beam differing in wavelength or pulse width from the first laser beam. In the laser beam machining method, the first laser beam and the second laser beam are caused to alternate in irradiating a workpiece.

Abstract: A substrate for sample analysis is a substrate for sample analysis used for causing a binding reaction between an analyte and a ligand in a liquid sample, the substrate for sample analysis including: a base substrate having a rotation axis and a predetermined thickness; a chamber located in the base substrate for holding a liquid sample containing an analyte and a ligand immobilized on a surface of magnetic particles; and at least one magnet arranged at a position such that the magnetic particles are captured in the chamber by the magnet.

Abstract: A valve drive mechanism includes a generally cylindrically shaped tappet assembly (24) comprising a center tappet (41 ) and a side tappet (42). The center tappet (41 ) has a circular-arcuate side walls (41c) formed with vertical side shrouds (41d) at opposite sides of each side wall (41c) which overlap and slide contact with opposite end guide walls (42h) of the side tappet (42), respectively. When the tappet assembly (24) is in an unlocked state so as to transmit rotation of the side cams (25, 27), the vertical side shroud (41d) of the center tappet (41 ) slide on the vertical side walls (42h) of the side tappet 42 so as thereby to guide slide movement of the center tappet (41) relative to the side tappet (42).

Abstract: A valve drive mechanism includes a generally cylindrically shaped tappet assembly (24) comprising a center tappet (41 ) and a side tappet (42). The center tappet (41 ) has a circular-arcuate side walls (41c) formed with vertical side shrouds (41d) at opposite sides of each side wall (41c) which overlap and slide contact with opposite end guide walls (42h) of the side tappet (42), respectively. When the tappet assembly (24) is in an unlocked state so as to transmit rotation of the side cams (25, 27), the vertical side shroud (41d) of the center tappet (41 ) slide on the vertical side walls (42h) of the side tappet 42 so as thereby to guide slide movement of the center tappet (41 ) relative to the side tappet (42).