Abstract: To provide a resin molding mold capable of forming a resin molded product having embossing in which by controlling appearance of gloss, its texture is improved, and the resin molded product is prevented from occurrence of white blurring on the surface on which the molded embossing is formed. A resin molding mold in accordance with the present application is used for molding a resin molded product having embossing formed thereon. The resin molding mold includes a molding mold and a buffer layer formed on an inside mold surface of the molding mold. The buffer layer is formed by a mixture of a thermosetting resin and fine particles having substantially spherical shapes. The fine particles have a bulk specific gravity in a range from 0.4 g/ml or more to 0.9 g/ml or less, and on the surface of the buffer layer, a plurality of gloss adjusting convex portions having substantially spherical shapes derived from the fine particles are formed.

Abstract: An image forming apparatus includes an image forming portion configured to form a developer image on a recording material, a fixing portion configured to heat-fix the developer image to the recording material, a first motor configured to drive the image forming portion, a second motor configured to drive the fixing portion, and a control portion configured to control the first motor and the second motor. The second motor is a stepping motor. The control portion allows the second motor to start rotation at a speed in a self-start region, temporarily stops the second motor at a timing at which the first motor is activated, then allows the second motor to restart rotation at a speed in the self-start region, and changes the speed of the second motor to a speed outside of the self-start region before the recording material arrives at the fixing portion.

Abstract: To prevent the detection accuracy from deteriorating due to stray light, an optical apparatus includes the following configuration. The optical apparatus includes a light-emitting member, a light-receiving member, and a substrate on which the light-emitting member and the light-receiving member are mounted. The substrate includes a plate-like substrate layer and a plate-like conductive layer. The optical apparatus further includes a light-shielding member disposed between the light-receiving member and the light-emitting member and inserted in a through-hole of the substrate provided between the light-receiving member and the light-emitting member. The light-receiving member receives reflected light from a portion to be irradiated with the light emitted from the light-emitting member. The conductive layer is excellent in light-shielding property compared to the substrate layer. The conductive layer is exposed to an inner cylindrical surface of the through-hole.

Abstract: An image forming apparatus includes an image forming portion configured to form a developer image on a recording material, a fixing portion configured to heat-fix the developer image to the recording material, a first motor configured to drive the image forming portion, a second motor configured to drive the fixing portion, and a control portion configured to control the first motor and the second motor. The second motor is a stepping motor. The control portion allows the second motor to start rotation at a speed in a self-start region, temporarily stops the second motor at a timing at which the first motor is activated, then allows the second motor to restart rotation at a speed in the self-start region, and changes the speed of the second motor to a speed outside the self-start region before the recording material arrives at the fixing portion.

Abstract: Provided is a method for manufacturing a recording head having a head chip that ejects ink, an upstream flow path member, a downstream flow path member where an accommodating portion and a downstream flow path are disposed, a wiring member that is connected to a piezoelectric actuator in the head chip, a wiring substrate, a first insertion hole into which the wiring member and a tool are inserted, and a second insertion hole where a wiring member insertion portion into which the wiring member is inserted and a tool insertion portion into which the tool can be inserted are integrally formed, the method including inserting the tool into the tool insertion portion, holding the wiring member with the tool, withdrawing the tool from the tool insertion portion by moving the downstream flow path member to the head chip side, and inserting the wiring member into the wiring member insertion portion.

Abstract: To provide a resin molding mold capable of generating gloss on a resin molded product surface comparatively easily, even when the resin molding mold has concavo-convex portions by embossing, and of obtaining a resin molded product having improved texture by providing high luster. A resin molding mold in accordance with the present application is a resin molding mold for molding a resin molded product. The resin molding mold includes a molding mold and a mirror-surface coat layer formed on a mold surface of the molding mold. The mirror-surface coat layer is formed by a thermosetting resin having a thermal conductivity in a range from 0.10 W/(mK) or more to 0.99 W/(mK) or less. The thickness of the mirror-surface coat layer is set in a range from 1.0 ?m or more to 30 ?m or less, and is preferably set to 20 ?m or less. The surface of the mirror-surface coat layer is provided with a flat-surface maintaining part formed into a substantially flat surface.

Abstract: To provide a resin molding mold capable of forming a resin molded product having embossing in which by controlling appearance of gloss, its texture is improved, and the resin molded product is prevented from occurrence of white blurring on the surface on which the molded embossing is formed. A resin molding mold in accordance with the present application is used for molding a resin molded product having embossing formed thereon. The resin molding mold includes a molding mold and a buffer layer formed on an inside mold surface of the molding mold. The buffer layer is formed by a mixture of a thermosetting resin and fine particles having substantially spherical shapes. The fine particles have a bulk specific gravity in a range from 0.4 g/ml or more to 0.9 g/ml or less, and on the surface of the buffer layer, a plurality of gloss adjusting convex portions having substantially spherical shapes derived from the fine particles are formed.

Abstract: The image forming apparatus includes a plate movable up and down, a control cam that moves the plate up and down, a stepping motor that derives the control cam, a sheet feeding roller that contacts the sheet on the plate moved up by the control cam to feed the sheet held in contact with the feeding unit through rotation caused by drive from the stepping motor, and a control unit that controls the stepping motor. The control unit rotates the stepping motor at a first speed so that the control cam moves the plate up. After the sheet feeding roller is rotated, when the sheet feeding roller is stopped to stop the stepping motor, the control unit changes the rotational speed of the stepping motor from the first speed to a second speed.

Abstract: To prevent the detection accuracy from deteriorating due to stray light, an optical apparatus includes the following configuration. The optical apparatus includes a light-emitting member, a light-receiving member, and a substrate on which the light-emitting member and the light-receiving member are mounted. The substrate includes a plate-like substrate layer and a plate-like conductive layer. The optical apparatus further includes a light-shielding member disposed between the light-receiving member and the light-emitting member and inserted in a through-hole of the substrate provided between the light-receiving member and the light-emitting member. The light-receiving member receives reflected light from a portion to be irradiated with the light emitted from the light-emitting member. The conductive layer is excellent in light-shielding property compared to the substrate layer. The conductive layer is exposed to an inner cylindrical surface of the through-hole.

Abstract: The circuit substrate includes at least two lands formed on a substrate, wherein one electrode is to be mounted on the at least two lands, an electronic part having electrodes, one of the electrodes is soldered on the at least two lands with solders whose amounts are adjusted by a metal mask having at least two opening parts, positions of the at least two opening parts corresponding to the at least two lands when the solders are applied and melted, areas of the at least two opening parts being different with each other, wherein a height of one of the solders is different from a height of the other of the solders according to the difference of the areas of the at least two opening parts of the metal mask, whereby the electronic part is mounted on the circuit substrate in an inclined state.

Abstract: To prevent the detection accuracy from deteriorating due to stray light, an optical apparatus includes the following configuration. The optical apparatus includes a light-emitting member, a light-receiving member, and a substrate on which the light-emitting member and the light-receiving member are mounted. The substrate includes a plate-like substrate layer and a plate-like conductive layer. The optical apparatus further includes a light-shielding member disposed between the light-receiving member and the light-emitting member and inserted in a through-hole of the substrate provided between the light-receiving member and the light-emitting member. The light-receiving member receives reflected light from a portion to be irradiated with the light emitted from the light-emitting member. The conductive layer is excellent in light-shielding property compared to the substrate layer. The conductive layer is exposed to an inner cylindrical surface of the through-hole.

Abstract: The circuit substrate includes at least two lands formed on a substrate, wherein one electrode is to be mounted on the at least two lands, an electronic part having electrodes, one of the electrodes is soldered on the at least two lands with solders whose amounts are adjusted by a metal mask having at least two opening parts, positions of the at least two opening parts corresponding to the at least two lands when the solders are applied and melted, areas of the at least two opening parts being different with each other, wherein a height of one of the solders is different from a height of the other of the solders according to the difference of the areas of the at least two opening parts of the metal mask, whereby the electronic part is mounted on the circuit substrate in an inclined state.

Abstract: An image formation apparatus includes: an image formation device to form a developer image based on image data; a transfer device to transfer the developer image onto a recording medium; a fixing unit including a rotary body and configured to fix the developer image by rotating the rotary body in a first direction to move the recording medium to a downstream side in the conveyance path to heat and press the recording medium, and a wrap-around detection device to detect when the recording medium with the developer image is wrapped around the rotary body. The wrap-around detection device detects that the recording medium is wrapped around the rotary body based on a detected temperature of the rotary body and based on a medium detection result of detecting the recording medium on the upstream and downstream sides of the rotary body in the medium conveyance path.

Abstract: To prevent the detection accuracy from deteriorating due to stray light, an optical apparatus includes the following configuration. The optical apparatus includes a light-emitting member, a light-receiving member, and a substrate on which the light-emitting member and the light-receiving member are mounted. The substrate includes a plate-like substrate layer and a plate-like conductive layer. The optical apparatus further includes a light-shielding member disposed between the light-receiving member and the light-emitting member and inserted in a through-hole of the substrate provided between the light-receiving member and the light-emitting member. The light-receiving member receives reflected light from a portion to be irradiated with the light emitted from the light-emitting member. The conductive layer is excellent in light-shielding property compared to the substrate layer. The conductive layer is exposed to an inner cylindrical surface of the through-hole.