Patents by Inventor Masayuki Shinkai
Masayuki Shinkai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20090169940Abstract: A fuel cell employs a stack structure in which a plurality of sheet bodies and a plurality of separators are stacked and joined together in alternating layers. Chemical reactions occur in the sheet bodies. The separators separate, from each other, two kinds of gasses (air and fuel gas) which are necessary for the chemical reactions. The plurality of separators consist of high-rigidity separator(s), and ordinary separators, which are lower in rigidity than the high-rigidity separator. This configuration reliably suppresses the occurrence of “separation of a joint region” attributable to “stress concentration caused by increase in the number of the stacked separators.Type: ApplicationFiled: December 10, 2008Publication date: July 2, 2009Applicant: NGK Insulators, Ltd.Inventors: Makoto Ohmori, Natsumi Shimogawa, Masayuki Shinkai, Tsutomu Nanataki
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Publication number: 20090023048Abstract: In a fuel cell, perimetric portions of each sheet body, an upper support member, and a lower support member are sealed against one another by a seal including first and second seal portions. The first seal portion is of glass having a softening point lower than a working temperature of the reactor and seals against the upper surface of the perimetric portion of the sheet body and the lower surface of the perimetric portion of the upper support member as well as the lower surface of the perimetric portion of the sheet body and the upper surface of the perimetric portion of the lower support member. The second seal portion is of glass having a softening point higher than the working temperature and seals against the lower side end and upper side end of the perimetric portions of the upper and lower support members, respectively.Type: ApplicationFiled: July 17, 2008Publication date: January 22, 2009Applicant: NGK Insulators, Ltd.Inventors: Makoto Ohmori, Natsumi Shimogawa, Tsutomu Nanataki, Masayuki Shinkai
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Publication number: 20080272180Abstract: A heat spreader module has a pedestal, a heat spreader member joined to the pedestal by a first active hard brazing material, an intermediate layer joined to the heat spreader member by a second active hard brazing material, an insulating board joined to the intermediate layer by a third active hard brazing material, and a circuit board joined to the insulating board by a fourth active hard brazing material. The first through fourth active hard brazing materials are supplied such that the active hard brazing materials have a thickness ranging from 3 to 20 ?m when the components of the heat spreader module are joined together under pressure, and contain an active element in an amount ranging from 400 to 1000 ?g/cm2.Type: ApplicationFiled: July 11, 2008Publication date: November 6, 2008Applicant: NGK Insulators, Ltd.Inventors: Takahiro ISHIKAWA, Masayuki SHINKAI, Makoto MIYAHARA, Shuhei ISHIKAWA, Nobuaki NAKAYAMA, Seji YASUI
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Patent number: 7433187Abstract: A heat spreader module has a pedestal, a heat spreader member joined to the pedestal by a first active hard brazing material, an intermediate layer joined to the heat spreader member by a second active hard brazing material, an insulating board joined to the intermediate layer by a third active hard brazing material, and a circuit board joined to the insulating board by a fourth active hard brazing material. The first through fourth active hard brazing materials are supplied such that the active hard brazing materials have a thickness ranging from 3 to 20 ?m when the components of the heat spreader module are joined together under pressure, and contain an active element in an amount ranging from 400 to 1000 ?g/cm2.Type: GrantFiled: March 24, 2004Date of Patent: October 7, 2008Assignee: NGK Insulators, Ltd.Inventors: Takahiro Ishikawa, Masayuki Shinkai, Makoto Miyahara, Shuhei Ishikawa, Nobuaki Nakayama, Seiji Yasui
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Publication number: 20080230585Abstract: A different materials bonded member includes a ceramic base material and a metallic member which are bonded together through an Au solder material. The solder material is disposed on a bonding surface of the ceramic base through a given active metal layer or a given metalized layer and the solder material is heated and melted to form a pre-coat layer adhering to the bonding surface, the metallic member is disposed on a surface of the pre-coat layer through a barrier layer having a given function. A bonded part is formed by solidifying the pre-coat layer after it has been heated and melted under given temperature conditions to bond the ceramic base and the metallic member to one another.Type: ApplicationFiled: April 17, 2008Publication date: September 25, 2008Applicant: NGK Insulators, Ltd.Inventors: Masayuki Shinkai, Takahiro Ishikawa, Masahiro Kida
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Patent number: 7398912Abstract: A different materials bonded member includes a ceramic base material and a metallic member which are bonded together through an Au solder material. The solder material is disposed on a bonding surface of the ceramic base through a given active metal layer or a given metalized layer and the solder material is heated and melted to form a pre-coat layer adhering to the bonding surface, the metallic member is disposed on a surface of the pre-coat layer through a barrier layer having a given function. A bonded part is formed by solidifying the pre-coat layer after it has been heated and melted under given temperature conditions to bond the ceramic base and the metallic member to one another.Type: GrantFiled: December 11, 2003Date of Patent: July 15, 2008Assignee: NGK Insulators, Ltd.Inventors: Masayuki Shinkai, Takahiro Ishikawa, Masahiro Kida
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Patent number: 7329384Abstract: A porous composite material includes a metal material for forming a matrix, and at least two kinds of fine particle materials having different wettabilities with respect to the metal material. The porous composite material is provided by melting and impregnating the metal material for forming a matrix with the mixture of at least two kinds of fine particle materials. The porous composite material has excellent characteristics in shock absorbency, acoustics, non-combustibility, lightness, rigidity, and so forth.Type: GrantFiled: September 21, 2001Date of Patent: February 12, 2008Assignee: NGK Insulators, Ltd.Inventors: Masayuki Shinkai, Masahiro Kida
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Publication number: 20070271756Abstract: A plate material vertical processing line that is capable of subjecting large-sized and thinned glass plates to scribing, venting, etc without degrading their quality, comprises a plurality of processing devices each having a modular structure; wherein each of the processing devices includes a platform; a belt conveyor that is mounted on the platform and is configured to convey a glass plate placed in a substantially upright position while supporting a lower end of the glass plate; and a fluid guide that is mounted on the platform and is configured to apply a fluid pressure to a surface of the glass plate to support the glass plate in the substantially upright position and in a non-contact state; and wherein the processing devices include a combination of at least two processing devices selected from a scribing device, a venting device, a chamfering device, a cleaning agent washing device, a water washing device, a high-pressure water spray device, and a glass plate turn device.Type: ApplicationFiled: February 18, 2004Publication date: November 29, 2007Applicants: Kawasaki Plant Systems Kabushiki Kaisha, Corning Japan K.K.Inventors: Yoshiaki Aoki, Keiji Tsujita, Morimasa Kuge, Takaaki Yokoyama, Takashi Sakurai, Michio Suzuki, Masayuki Anada, Masayuki Shinkai
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Publication number: 20070209513Abstract: A hydrogen gas separator fixing structure includes a gas separator having a support and a membrane provided on at least one surface of the support, which membrane contains a first metal capable of separating hydrogen gas from a hydrogen-containing gas, a metal flange connected to at least one open end of the gas separator, a bonding layer containing a second metal, provided at the portion at which the gas separator and the metal flange are connected to each other and on the surface of the gas separation membrane side of the portion, a packing provided on the bonding layer, and a ring-shaped metal member capable of fixing the packing by pressing, provided so that at least part thereof is in contact with the bonding layer, wherein the bonding layer is provided by a heat treatment conducted at a temperature lower than the melting point of the second metal.Type: ApplicationFiled: February 22, 2007Publication date: September 13, 2007Applicant: NGK Insulators, Ltd.Inventors: Masayuki SHINKAI, Osamu SAKAI
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Patent number: 7207866Abstract: The present invention is directed to an apparatus for grinding or polishing at least one edge of a glass substrate. The apparatus includes an air bearing support member configured to pivot about an axis of rotation with zero frictional resistance opposing said pivotal movement. A grinding unit is coupled to the air bearing support member. The grinding unit is configured to apply a predetermined force normal to the at least one edge to remove a predetermined amount of material from the at least one edge. The predetermined force is directly proportional to the predetermined amount of material and less than a normal force resulting in glass substrate breakage.Type: GrantFiled: January 17, 2006Date of Patent: April 24, 2007Assignee: Corning IncorporatedInventors: Roger A. Allaire, James W. Brown, Toshihiko Ono, Babak R. Raj, Masayuki Shinkai
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Patent number: 7161807Abstract: A heat spreader module includes a base, a heat spreader member arranged on the base, a thermal conductive layer arranged on the heat spreader member, a first joining member interposed between the base and the heat spreader member, and a second joining member interposed between the heat spreader member and the thermal conductive layer. The base comprises a copper alloy which has a proof stress of not less than 45 MPa and a coefficient of thermal conductivity of not less than 270 W/mK after performing a heat treatment between 600° and 900° C. for 10 minutes.Type: GrantFiled: February 20, 2004Date of Patent: January 9, 2007Assignee: NGK Insulators, Ltd.Inventors: Takahiro Ishikawa, Masayuki Shinkai, Makoto Miyahara, Shuhei Ishikawa, Nobuaki Nakayama, Kazuyoshi Inoue
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Publication number: 20060121832Abstract: The present invention is directed to an apparatus for grinding or polishing at least one edge of a glass substrate. The apparatus includes an air bearing support member configured to pivot about an axis of rotation with zero frictional resistance opposing said pivotal movement. A grinding unit is coupled to the air bearing support member. The grinding unit is configured to apply a predetermined force normal to the at least one edge to remove a predetermined amount of material from the at least one edge. The predetermined force is directly proportional to the predetermined amount of material and less than a normal force resulting in glass substrate breakage.Type: ApplicationFiled: January 17, 2006Publication date: June 8, 2006Inventors: Roger Allaire, James Brown, Toshihiko Ono, Babak Raj, Masayuki Shinkai
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Patent number: 7018272Abstract: The present invention is directed to an apparatus for grinding or polishing at least one edge of a glass substrate. The apparatus includes an air bearing support member configured to pivot about an axis of rotation with zero frictional resistance opposing said pivotal movement. A grinding unit is coupled to the air bearing support member. The grinding unit is configured to apply a predetermined force normal to the at least one edge to remove a predetermined amount of material from the at least one edge. The predetermined force is directly proportional to the predetermined amount of material and less than a normal force resulting in glass substrate breakage.Type: GrantFiled: July 29, 2003Date of Patent: March 28, 2006Assignee: Corning IncorporatedInventors: Roger A. Allaire, James W. Brown, Toshihiko Ono, Babak R. Raj, Masayuki Shinkai
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Patent number: 6918530Abstract: A bonded member including a ceramic base material 1 and a metallic member 7 which are bonded together, wherein a solder material 5 comprising Au is disposed on the surface of the ceramic base material 1 via an active metal layer, the active metal layer and the solder material 5 are molten by heating so as to form a precoat layer 6, the metallic member 7 is disposed on the surface of the precoat layer 6 via an insertion metal layer comprising pure metal which may form an alloy having a lower melting point than Au with Au or an alloy of the pure metal and Au, and the insertion metal layer and at least a portion in the vicinity of the interface between the insertion metal layer and the precoat layer 6 are molten by heating to bond the metallic member 7 and the precoat layer 6.Type: GrantFiled: January 21, 2003Date of Patent: July 19, 2005Assignee: NGK Insulators, Ltd.Inventors: Masayuki Shinkai, Takahiro Ishikawa, Masahiro Kida, Mitsuru Ohta
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Patent number: 6916355Abstract: A composite material 5 in which a dispersing material 7 is dispersed in a matrix 6 is provided. The composite material 5 is producible by steps of filling said mixed material in a space forming region to be defined by at least two container elements when said at least two container elements are integrated into one body, and then infiltrating said aluminum (Al) being molten due to heat generated by said self-combustion reaction into pores inside said mixed material through at least one hole formed in an upper part of a reaction container formed by combining said at least two container elements in which said mixed material is filled in said space forming region in a state being fixed to a predetermined shape, thereby an aluminide intermetallic compound is formed by self-combustion reaction between said metal powder and said aluminum (Al), and a dispersing material is dispersed into said matrix.Type: GrantFiled: November 19, 2002Date of Patent: July 12, 2005Assignee: NGK Insulators, Ltd.Inventors: Masahiro Kida, Takahiro Ishikawa, Masayuki Shinkai, Takatoshi Ikematsu
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Patent number: 6881499Abstract: A bonded member includes a ceramic base material and a metal member solid-phase bonded via a soldering material. An active metal is placed on a surface of the ceramic base material and the soldering material, which includes Au, is placed on the active metal, and the active metal and the soldering material are heated so as to form a precoat layer. The metal member is placed on the surface of the precoat layer via a barrier layer, which is capable of inhibiting diffusion of a metal constituting the metal member, and the precoat layer and the metal member are pressurized heated so as to be solid-phase bonded. The production method of the bonded member is also disclosed.Type: GrantFiled: January 21, 2003Date of Patent: April 19, 2005Assignee: NGK Insulators, Ltd.Inventors: Masayuki Shinkai, Takahiro Ishikawa, Masahiro Kida
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Patent number: 6857556Abstract: A bonding method for bonding one member having a dented portion and a second different member having an engaging protruding portion with an adhesive composition having a controlled coefficient of expansion and the resultant composite product. Three alternative techniques are used to first apply a hard solder in contact with a layer of fine particles between the two members. Then a final heating is applied under pressure to melt the hard solder. The resulting bonding layer bonds the two different fitting members.Type: GrantFiled: January 3, 2002Date of Patent: February 22, 2005Assignee: NGK Insulators, Ltd.Inventors: Takahiro Ishikawa, Masayuki Shinkai, Masahiro Kida
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Publication number: 20050026541Abstract: The present invention is directed to an apparatus for grinding or polishing at least one edge of a glass substrate. The apparatus includes an air bearing support member configured to pivot about an axis of rotation with zero frictional resistance opposing said pivotal movement. A grinding unit is coupled to the air bearing support member. The grinding unit is configured to apply a predetermined force normal to the at least one edge to remove a predetermined amount of material from the at least one edge. The predetermined force is directly proportional to the predetermined amount of material and less than a normal force resulting in glass substrate breakage.Type: ApplicationFiled: July 29, 2003Publication date: February 3, 2005Inventors: Roger Allaire, James Brown, Toshihiko Ono, Babak Raj, Masayuki Shinkai
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Patent number: 6817513Abstract: An adhesive composition is provided for bonding two or more different members which can give a bonded material having excellent heat resistance characteristics while inhibiting breakage of the materials to be bonded by reducing the expansion coefficient, the Young's modulus and the proof stress value. A method for bonding two or more different members using the adhesive composition, and a composite member comprising two or more different members bonded by the above method can be provided by the adhesive composition which comprises a hard solder and a mixture of at least two fine particle materials differing in wettability with the hard solder and which is controlled in expansion coefficient, Young's modulus and proof stress value.Type: GrantFiled: March 11, 2003Date of Patent: November 16, 2004Assignee: NGK Insulators, Ltd.Inventors: Masayuki Shinkai, Masahiro Kida
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Publication number: 20040207987Abstract: A heat spreader module includes a base, a heat spreader member arranged on the base, a thermal conductive layer arranged on the heat spreader member, a first joining member interposed between the base and the heat spreader member, and a second joining member interposed between the heat spreader member and the thermal conductive layer. The base comprises a copper alloy which has a proof stress of not less than 45 MPa and a coefficient of thermal conductivity of not less than 270 W/mK after performing a heat treatment between 600° and 900° C. for 10 minutes.Type: ApplicationFiled: February 20, 2004Publication date: October 21, 2004Applicant: NGK Insulators, Ltd.Inventors: Takahiro Ishikawa, Masayuki Shinkai, Makoto Miyahara, Shuhei Ishikawa, Nobuaki Nakayama, Kazuyoshi Inoue