Abstract: An electronic component embedded substrate includes conductor layers L1 to L3, insulating layers 112 and 113 provided between the conductor layers L2 and L3, an insulating layer 114 provided between the conductor layers L1 and L2, a semiconductor embedded in the insulating layers 112 and 113, a via conductor 142 filling a via V, and a via conductor 143 filling a via 143a. The via 143a is provided at such a position that overlaps the via V and is shallower than the via V. The inner wall of the via 143a is larger in surface roughness than the inner wall of the via V. This makes voids less likely to occur in the via conductor 142 filling the deep via V and enhances adhesion between the via conductor 143 and the shallow via 143a that the via conductor 143 fills.

Abstract: Disclosed herein is a composite electronic component that includes: a first coil pattern formed on at least a first conductor layer, the first coil pattern having one end coupled to the first terminal electrode and other end coupled to the second terminal electrode; a second coil pattern formed on at least a second conductor layer; a third coil pattern formed on at least the first and second conductor layers, the third coil pattern having one end coupled to the one end of the second coil pattern and other end coupled to the third terminal electrode; and a fourth coil pattern formed on at least the first and second conductor layers, the fourth coil pattern having one end coupled to the other end of the second coil pattern and other end coupled to the fourth terminal electrode.

Abstract: An electronic circuit module component includes an electronic component, a substrate, a first resin, a second resin, a metal layer, and an opening. The electronic component is mounted on the substrate. The first resin has pores and is in contact with at least a part of the electronic component. The second resin covers a surface of the first resin and has porosity which is lower than that of the first resin. The metal layer covers the first resin and the second resin and is electrically connected to a ground of the substrate. The opening is provided in the metal layer and allows a part of the first resin to be exposed to an outside at least of the metal layer.

Abstract: The present invention provides a terminal structure 14 including a terminal 12 having a conductor 40 containing at least one metal selected from the group consisting of gold, silver, and copper, a first layer containing phosphorus and nickel disposed on the conductor 40, and a second layer having a nickel/phosphorus atomic ratio smaller than that of the first layer and containing Ni3P disposed on the first layer; and solder 70 disposed on the second layer of the terminal 12, while the second layer has a thickness of at least 0.35 ?m; and a module substrate 100 having the terminal structure.

Abstract: The present invention provides a plating film 50 including a nickel plating layer containing phosphorus and a gold plating layer formed on the nickel plating layer, wherein the nickel plating layer has a phosphorus content of 11 to 16 mass %, and wherein (3×?×100)/X is 10 or less, where X and ? are the average value and standard deviation of the phosphorus content in a surface of the nickel plating layer on the gold plating layer side, respectively; and a module substrate 100 having the plating film 50.

Abstract: An electronic circuit module component includes an electronic component, a substrate, a first resin, a second resin, a metal layer, and an opening. The electronic component is mounted on the substrate. The first resin has pores and is in contact with at least a part of the electronic component. The second resin covers a surface of the first resin and has porosity which is lower than that of the first resin. The metal layer covers the first resin and the second resin and is electrically connected to a ground of the substrate. The opening is provided in the metal layer and allows a part of the first resin to be exposed to an outside at least of the metal layer.

Abstract: The present invention provides a terminal structure 14 including a terminal 12 having a conductor 40 containing at least one metal selected from the group consisting of gold, silver, and copper, a first layer containing phosphorus and nickel disposed on the conductor 40, and a second layer having a nickel/phosphorus atomic ratio smaller than that of the first layer and containing Ni3P disposed on the first layer; and solder 70 disposed on the second layer of the terminal 12, while the second layer has a thickness of at least 0.35 ?m; and a module substrate 100 having the terminal structure.

Abstract: The present invention provides a plating film 50 including a nickel plating layer containing phosphorus and a gold plating layer formed on the nickel plating layer, wherein the nickel plating layer has a phosphorus content of 11 to 16 mass %, and wherein (3×?×100)/X is 10 or less, where X and ? are the average value and standard deviation of the phosphorus content in a surface of the nickel plating layer on the gold plating layer side, respectively; and a module substrate 100 having the plating film 50.