Patents by Inventor Mathieu Vanden Bulcke

Mathieu Vanden Bulcke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming packaged microelectronic devices and devices thus obtained
    Publication number: 20080046080
    Abstract: A packaged microelectronic device (20) is provided comprising at least one electrode (10) comprising a chip (18) embedded in a package. The chip (18) comprises a back electrode (17) located at a first side of the chip (18), and electronic circuitry (14) located at a second side of the chip (18), the second side being opposite to the first side, and wherein the back electrode (17) is part of the package. A method for forming such packaged microelectronic devices (20) is also described.
    Type: Application
    Filed: July 9, 2007
    Publication date: February 21, 2008
    Applicant: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC)
    Inventors: Mathieu Vanden Bulcke, Eric Beyne