Abstract: Epoxy resin-based fibre matrix compositions contain alkyl substituted ethylene amines such as dimethyldiethylenetriamine (DMDETA, also dimethyl-1,4,7-triazaheptane), as a curing agent. These curing agents are characterized by a short curing time for a comparatively long processing time, and make it possible to obtain cured epoxy resins that exhibit low brittleness and high tensile strength and have a high glass transition temperature; as a result of which the fibre matrix composition is suitable particularly for use in pultrusion and winding processes.

Abstract: An alkylene-diamine, a hydroxyalkylene-amine, and hydrogen are reacted in presence of a heterogenous catalyst containing copper to produce polyalkylene-polyamines.

Abstract: Epoxy resin-based fibre matrix compositions contain alkyl substituted ethylene amines such as dimethyldiethylenetriamine (DMDETA, also dimethyl-1,4,7-triazaheptane), as a curing agent. These curing agents are characterized by a short curing time for a comparatively long processing time, and make it possible to obtain cured epoxy resins that exhibit low brittleness and high tensile strength and have a high glass transition temperature; as a result of which the fibre matrix composition is suitable particularly for use in pultrusion and winding processes.

Abstract: Secondary diamine N,N?-dialkyl methylcyclohexanediamine acts as a reactive diluent for curable epoxy resin compositions. The addition of this compounds significantly reduces the initial viscosity of the epoxy resin composition while the resulting cured epoxy resin exhibits comparable favorable mechanical, chemical resistance and thermal properties such as low water uptake and high glass transition temperatures. Such compositions are particular suitable for manufacturing of composites with high mechanical and heat resistance properties by the means of resin transfer molding (RTM), vacuum aided resin transfer molding (VARTM) or infusion technology.

Abstract: The invention is directed to a curable composition, which comprises an epoxy resin mixture, wherein the epoxy resin mixture comprises a) an epoxy resin; b) diethyl methyl benzene diamine (DETDA) as hardener; c) at least one compound selected from the group consisting of 1,8-diazabicyclo[5.4.0]undec-7-ene (DBU) and 1,5-diazabicyclo[4.3.0]non-5-ene (DBN) as catalyst.