Patents by Inventor Matthew Bade

Matthew Bade has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for wafer bonding and for nucleating bonding nanophases using wet and steam pressurization
    Patent number: 9589801
    Abstract: Substrates may be bonded according to a method comprising contacting a first bonding surface of a first substrate with a second bonding surface of a second substrate to form an assembly in the presence of an steam atmosphere under suitable conditions to form a bonding layer between the first and second surfaces, wherein the first bonding surface comprises a polarized surface layer; the second bonding surface comprises a hydrophilic surface layer; the first and second bonding surfaces are different.
    Type: Grant
    Filed: October 31, 2012
    Date of Patent: March 7, 2017
    Assignee: Arizona Board Of Regents, A Body Corporated Of The State Of Arizona, Acting For And On Behalf Of Arizona State University
    Inventors: Nicole Herbots, Shawn Whaley, Robert Culbertson, Ross Bennett-Kennett, Ashlee Murphy, Matthew Bade, Sam Farmer, Brance Hudzietz
  • Molecular Film Containing Polymeric Mixture for Hydrophobic Implant Surfaces
    Publication number: 20140295054
    Abstract: Compositions are disclosed containing a polymeric mixture diluted into an aqueous solution, which can be usefully applied to any surface mat is hydbcphoixc to act, for example, as an aotifoggiag coating with minimal optical distortion and excellent transparency. The compositions can also be used as lubricious agents on medical implants, shunts, and surgical supplies to minimize tissue trauma, to maximize bio-compatibility, and to increase healing by enhancing better irrigation and flow in adjacent tissue.
    Type: Application
    Filed: October 26, 2012
    Publication date: October 2, 2014
    Inventors: Nicole Herbots, Ashlee Murphy, David Sell, Robert Culbertson, Angelica S. Benitez, Tyler Kutz, Ross Bennett-Kennett, Matthew Bade, Brance P. Hudzeitz
  • Methods for Wafer Bonding and for Nucleating Bonding Nanophases Using Wet and Steam Pressurization
    Publication number: 20140235031
    Abstract: Substrates may be bonded according to a method comprising contacting a first bonding surface of a first substrate with a second bonding surface of a second substrate to form an assembly in the presence of an steam atmosphere under suitable conditions to form a bonding layer between the first and second surfaces, wherein the first bonding surface comprises a polarized surface layer; the second bonding surface comprises a hydrophilic surface layer; the first and second bonding surfaces are different.
    Type: Application
    Filed: October 31, 2012
    Publication date: August 21, 2014
    Inventors: Nicole Herbots, Shawn Whaley, Robert Culbertson, Ross Bennett-Kennett, Ashlee Murphy, Matthew Bade, Sam Farmer, Brance Hudzietz