Abstract: Methods of making an assembly are disclosed. The assembly may include a circuit board with a top surface and a circuit component mounted on the top surface of the circuit board. The method may include positioning an inductor coil above the circuit component and the top surface of the circuit board and encapsulating the inductor coil, the circuit component and at least part of the top surface of the circuit board in a magnetic material. Assemblies according to such methods are also disclosed.

Abstract: Methods of making an assembly are disclosed. The assembly may include a circuit board with a top surface and a circuit component mounted on the top surface of the circuit board. The method may include positioning an inductor coil above the circuit component and the top surface of the circuit board and encapsulating the inductor coil, the circuit component and at least part of the top surface of the circuit board in a magnetic material. Assemblies according to such methods are also disclosed.

Abstract: A method of producing a thermally conductive cover for an electric circuit assembly having a plurality of heat dissipating components is disclosed. The thermally conductive cover including a top surface, a bottom surface, and at least one rib extending downwardly from the bottom surface. The method includes selecting a plurality of dimensions for the thermally conductive cover such that the bottom surface will be spaced above and extend over top sides of the plurality of heat dissipating components when the thermally conductive cover is installed over the electronic circuit assembly. The at least one rib will extend over and be spaced from the plurality of heat dissipating components when the thermally conductive cover is installed over the electronic circuit assembly. The method further includes producing the thermally conductive cover with the selected dimensions. Thermally conductive covers are also disclosed.