Patents by Inventor Matthew David Romig
Matthew David Romig has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11669069Abstract: Methods, systems, and apparatus to facilitate multi-channel isolation is disclosed. An example apparatus includes a multiplexer including a first input terminal, a second input terminal, and an output terminal; a modulator including an input terminal and an output terminal, the input terminal of the modulator coupled to the output terminal of the multiplexer; an isolation capacitor including a first terminal and a second terminal, the first terminal of the isolation capacitor coupled to the output terminal of the modulator; a first receiver die coupled to the second terminal of the isolation capacitor; and a second receiver die coupled to the second terminal of the isolation capacitor.Type: GrantFiled: June 4, 2021Date of Patent: June 6, 2023Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Matthew David Romig, Mayank Garg
-
Publication number: 20230129232Abstract: A multi-chip module (MCM) package includes a leadframe including half-etched lead terminals including a full-thickness and half-etched portion, and second lead terminals including a thermal pad(s). A first die is attached by a dielectric die attach material to the half-etched lead terminals. The first die includes first bond pads coupled to first circuitry configured for receiving a control signal and for outputting a coded signal and a transmitter. The second die includes second bond pads coupled to second circuitry configured for a receiver with a gate driver. The second die is attached by a conductive die attach material to the thermal pad. Bond wires include die-to-die bond wires between a portion of the first and second bond pads. A high-voltage isolation device is between the transmitter and receiver. A mold compound encapsulates the first and the second die.Type: ApplicationFiled: December 22, 2022Publication date: April 27, 2023Inventors: Matthew David Romig, Wei Zhang, Mohammad Waseem Hussain, Peter Anthony Fundaro
-
Patent number: 11538741Abstract: A multi-chip module (MCM) package includes a leadframe including half-etched lead terminals including a full-thickness and half-etched portion, and second lead terminals including a thermal pad(s). A first die is attached by a dielectric die attach material to the half-etched lead terminals. The first die includes first bond pads coupled to first circuitry configured for receiving a control signal and for outputting a coded signal and a transmitter. The second die includes second bond pads coupled to second circuitry configured for a receiver with a gate driver. The second die is attached by a conductive die attach material to the thermal pad. Bond wires include die-to-die bond wires between a portion of the first and second bond pads. A high-voltage isolation device is between the transmitter and receiver. A mold compound encapsulates the first and the second die.Type: GrantFiled: February 17, 2021Date of Patent: December 27, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Matthew David Romig, Wei Zhang, Mohammad Waseem Hussain, Peter Anthony Fundaro
-
Patent number: 11525739Abstract: A thermistor-based thermal probe includes a thermistor die having a thermistor thereon with first and second bond pads coupled across the thermistor, and first and second die interconnects coupled to the respective bond pads. First and second wires W1, W2 that extend beyond the thermistor die are attached to the first and to the second die interconnects, respectively. An encapsulant material encapsulates the thermistor die and a die end of the first and second wires.Type: GrantFiled: May 8, 2018Date of Patent: December 13, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Matthew David Romig, Steven Aldred Kummerl, Steve Edward Harrell
-
Publication number: 20210294302Abstract: Methods, systems, and apparatus to facilitate multi-channel isolation is disclosed. An example apparatus includes a multiplexer including a first input terminal, a second input terminal, and an output terminal; a modulator including an input terminal and an output terminal, the input terminal of the modulator coupled to the output terminal of the multiplexer; an isolation capacitor including a first terminal and a second terminal, the first terminal of the isolation capacitor coupled to the output terminal of the modulator; a first receiver die coupled to the second terminal of the isolation capacitor; and a second receiver die coupled to the second terminal of the isolation capacitor.Type: ApplicationFiled: June 4, 2021Publication date: September 23, 2021Inventors: Matthew David Romig, Mayank Garg
-
Publication number: 20210257282Abstract: A multi-chip module (MCM) package includes a leadframe including half-etched lead terminals including a full-thickness and half-etched portion, and second lead terminals including a thermal pad(s). A first die is attached by a dielectric die attach material to the half-etched lead terminals. The first die includes first bond pads coupled to first circuitry configured for receiving a control signal and for outputting a coded signal and a transmitter. The second die includes second bond pads coupled to second circuitry configured for a receiver with a gate driver. The second die is attached by a conductive die attach material to the thermal pad. Bond wires include die-to-die bond wires between a portion of the first and second bond pads. A high-voltage isolation device is between the transmitter and receiver. A mold compound encapsulates the first and the second die.Type: ApplicationFiled: February 17, 2021Publication date: August 19, 2021Inventors: Matthew David Romig, Wei Zhang, Mohammad Waseem Hussain, Peter Anthony Fundaro
-
Patent number: 11082028Abstract: In one aspect of the disclosure, a semiconductor package is disclosed. The semiconductor package includes a lead frame. A semiconductor die is attached to a first side of the lead frame. A protective shell covers at least a first portion of the first surface of the semiconductor die. The protective shell comprises of ink residue. A layer of molding compound covers an outer surface of the protective shell and exposed portion of the first surface of the semiconductor die. A cavity space is within an inner space of the protective shell and the first portion of the top surface of the semiconductor die.Type: GrantFiled: December 23, 2019Date of Patent: August 3, 2021Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: James Cooper Wainerdi, Luu Nguyen, Alexander Harvey Scheuermann, Matthew David Romig
-
Patent number: 11061384Abstract: Methods, systems, and apparatus to facilitate multi-channel isolation is disclosed. An example apparatus includes a multiplexer including a first input terminal, a second input terminal, and an output terminal; a modulator including an input terminal and an output terminal, the input terminal of the modulator coupled to the output terminal of the multiplexer; an isolation capacitor including a first terminal and a second terminal, the first terminal of the isolation capacitor coupled to the output terminal of the modulator; a first receiver die coupled to the second terminal of the isolation capacitor; and a second receiver die coupled to the second terminal of the isolation capacitor.Type: GrantFiled: November 22, 2019Date of Patent: July 13, 2021Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Matthew David Romig, Mayank Garg
-
Patent number: 11049836Abstract: A system includes a substrate; a bond pad; a wire spanning above the substrate, having a first end bonded to the bond pad and a second end extending from the bond pad to terminate in a second end thereof; and a support structure disposed on the substrate, the support structure comprising at least a side wall and extending from the substrate to terminate in an end portion spaced from the substrate to support the wire.Type: GrantFiled: April 23, 2018Date of Patent: June 29, 2021Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Matthew David Romig, Benjamin Stassen Cook
-
Publication number: 20210175326Abstract: In described examples of an isolation device, an isolation die that has a set of bond pads is mounted on a first lead frame that has a set of leads. A portion of the bond pads are coupled to respective leads. A first mold material encapsulates the isolation device and the first lead frame forming a first package. The first package is mounted on a second lead frame that has a set of leads. A portion of the first lead frame leads is coupled to respective ones of the second lead frame leads. A second mold material encapsulates the first package and the second lead frame.Type: ApplicationFiled: September 10, 2020Publication date: June 10, 2021Inventors: Matthew David Romig, Enis Tuncer, Rajen Manicon Murugan, Yiqi Tang
-
Publication number: 20210157299Abstract: Methods, systems, and apparatus to facilitate multi-channel isolation is disclosed. An example apparatus includes a multiplexer including a first input terminal, a second input terminal, and an output terminal; a modulator including an input terminal and an output terminal, the input terminal of the modulator coupled to the output terminal of the multiplexer; an isolation capacitor including a first terminal and a second terminal, the first terminal of the isolation capacitor coupled to the output terminal of the modulator; a first receiver die coupled to the second terminal of the isolation capacitor; and a second receiver die coupled to the second terminal of the isolation capacitor.Type: ApplicationFiled: November 22, 2019Publication date: May 27, 2021Inventors: Matthew David Romig, Mayank Garg
-
Patent number: 10756013Abstract: A packaged semiconductor system, including: at least one electronic device on a device mounting surface of a substrate having terminals for attaching bond wires; at least one discrete component adjacent to the at least one electronic device, a second electrode of the at least one discrete component parallel to and spaced from a first electrode by a component body; the first electrode a metal foil having a protrusion extending laterally from the body and having a surface facing towards the second electrode; bonding wires interconnecting respective terminals of the at least one electronic device, the first electrode and the second electrode, and bonded to the surface of the second electrode and to the protrusion that extend away from the respective surfaces in a same direction; and packaging compound covering portions of the at least one electronic device, the at least one discrete component, and the bonding wires.Type: GrantFiled: February 17, 2020Date of Patent: August 25, 2020Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Saumya Gandhi, Matthew David Romig, Abram Castro
-
Publication number: 20200185323Abstract: A packaged semiconductor system, including: at least one electronic device on a device mounting surface of a substrate having terminals for attaching bond wires; at least one discrete component adjacent to the at least one electronic device, a second electrode of the at least one discrete component parallel to and spaced from a first electrode by a component body; the first electrode a metal foil having a protrusion extending laterally from the body and having a surface facing towards the second electrode; bonding wires interconnecting respective terminals of the at least one electronic device, the first electrode and the second electrode, and bonded to the surface of the second electrode and to the protrusion that extend away from the respective surfaces in a same direction; and packaging compound covering portions of the at least one electronic device, the at least one discrete component, and the bonding wires.Type: ApplicationFiled: February 17, 2020Publication date: June 11, 2020Inventors: Saumya Gandhi, Matthew David Romig, Abram Castro
-
Publication number: 20200127637Abstract: In one aspect of the disclosure, a semiconductor package is disclosed. The semiconductor package includes a lead frame. A semiconductor die is attached to a first side of the lead frame. A protective shell covers at least a first portion of the first surface of the semiconductor die. The protective shell comprises of ink residue. A layer of molding compound covers an outer surface of the protective shell and exposed portion of the first surface of the semiconductor die. A cavity space is within an inner space of the protective shell and the first portion of the top surface of the semiconductor die.Type: ApplicationFiled: December 23, 2019Publication date: April 23, 2020Inventors: James Cooper Wainerdi, Luu Nguyen, Alexander Harvey Scheuermann, Matthew David Romig
-
Patent number: 10566276Abstract: A packaged semiconductor system, including: at least one electronic device on a device mounting surface of a substrate having terminals for attaching bond wires; at least one discrete component adjacent to the at least one electronic device, a second electrode of the at least one discrete component parallel to and spaced from a first electrode by a component body; the first electrode a metal foil having a protrusion extending laterally from the body and having a surface facing towards the second electrode; bonding wires interconnecting respective terminals of the at least one electronic device, the first electrode and the second electrode, and bonded to the surface of the second electrode and to the protrusion that extend away from the respective surfaces in a same direction; and packaging compound covering portions of the at least one electronic device, the at least one discrete component, and the bonding wires.Type: GrantFiled: November 8, 2017Date of Patent: February 18, 2020Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Saumya Gandhi, Matthew David Romig, Abram Castro
-
Patent number: 10516381Abstract: In one aspect of the disclosure, a semiconductor package is disclosed. The semiconductor package includes a lead frame. A semiconductor die is attached to a first side of the lead frame. A protective shell covers at least a first portion of the first surface of the semiconductor die. The protective shell comprises of ink residue. A layer of molding compound covers an outer surface of the protective shell and exposed portion of the first surface of the semiconductor die. A cavity space is within an inner space of the protective shell and the first portion of the top surface of the semiconductor die.Type: GrantFiled: December 29, 2017Date of Patent: December 24, 2019Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: James Cooper Wainerdi, Luu Nguyen, Alexander Harvey Scheuermann, Matthew David Romig
-
Publication number: 20190346312Abstract: A thermistor-based thermal probe includes a thermistor die having a thermistor thereon with first and second bond pads coupled across the thermistor, and first and second die interconnects coupled to the respective bond pads. First and second wires W1, W2 that extend beyond the thermistor die are attached to the first and to the second die interconnects, respectively. An encapsulant material encapsulates the thermistor die and a die end of the first and second wires.Type: ApplicationFiled: May 8, 2018Publication date: November 14, 2019Inventors: MATTHEW DAVID ROMIG, STEVEN ALDRED KUMMERL, STEVE EDWARD HARRELL
-
Publication number: 20190326247Abstract: A system includes a substrate; a bond pad; a wire spanning above the substrate, having a first end bonded to the bond pad and a second end extending from the bond pad to terminate in a second end thereof; and a support structure disposed on the substrate, the support structure comprising at least a side wall and extending from the substrate to terminate in an end portion spaced from the substrate to support the wire.Type: ApplicationFiled: April 23, 2018Publication date: October 24, 2019Inventors: MATTHEW DAVID ROMIG, BENJAMIN STASSEN COOK
-
Publication number: 20190207582Abstract: In one aspect of the disclosure, a semiconductor package is disclosed. The semiconductor package includes a lead frame. A semiconductor die is attached to a first side of the lead frame. A protective shell covers at least a first portion of the first surface of the semiconductor die. The protective shell comprises of ink residue. A layer of molding compound covers an outer surface of the protective shell and exposed portion of the first surface of the semiconductor die. A cavity space is within an inner space of the protective shell and the first portion of the top surface of the semiconductor die.Type: ApplicationFiled: December 29, 2017Publication date: July 4, 2019Inventors: James Cooper WAINERDI, Luu NGUYEN, Alexander Harvey SCHEUERMANN, Matthew David ROMIG
-
Publication number: 20190139883Abstract: A packaged semiconductor system, including: at least one electronic device on a device mounting surface of a substrate having terminals for attaching bond wires; at least one discrete component adjacent to the at least one electronic device, a second electrode of the at least one discrete component parallel to and spaced from a first electrode by a component body; the first electrode a metal foil having a protrusion extending laterally from the body and having a surface facing towards the second electrode; bonding wires interconnecting respective terminals of the at least one electronic device, the first electrode and the second electrode, and bonded to the surface of the second electrode and to the protrusion that extend away from the respective surfaces in a same direction; and packaging compound covering portions of the at least one electronic device, the at least one discrete component, and the bonding wires.Type: ApplicationFiled: November 8, 2017Publication date: May 9, 2019Inventors: Saumya Gandhi, Matthew David Romig, Abram Castro