Abstract: An apparatus and method for liquid-phase dispensing of layers onto a substrate of an electronic device. An absorbent material reduces or eliminates splatter of printing material on the substrate during continuous printing operations. The absorbent material can be regenerated by exposure of new surface area or vacuum drawing of printing material through the absorbent material.

Abstract: An apparatus and method for liquid-phase coating of layers onto a substrate of an electronic device. Electo-form nozzles containing a body and disc are arranged in an array to perform multiple depositions on the substrate. A low solids mixture produces a very thin dried film of electronic materials.

Abstract: Methods and devices are provided for improving the encapsulation processes for an organic electronic device.

Abstract: Described are encapsulation assemblies useful for electronic devices having a substrate and an active area, the encapsulation assembly comprising a barrier sheet and a barrier structure that contains an adhesive and a discreet material, wherein the barrier structure is configured so as to substantially hermetically seal an electronic device when in use thereon. The barrier structure bonds the encapsulation assembly to the electronic device and contains a getter material to protect against environmental degradation.

Abstract: An apparatus and method for liquid-phase dispensing of layers onto a substrate of an electronic device. An absorbent material reduces or eliminates splatter of printing material on the substrate during continuous printing operations. The absorbent material can be regenerated by exposure of new surface area or vacuum drawing of printing material through the absorbent material.

Abstract: An electronic device includes a radiation-emitting component, a radiation-responsive component, or a combination thereof. In one embodiment, the electronic device includes a substrate and a first structure overlying the substrate. The electronic device also includes a second structure that includes a first layer, wherein the first layer has a first refractive index, and the first layer includes a first edge. The electronic device further includes a second layer overlying at least portions of the first structure and the second structure at the first edge. The second layer has a second refractive index that is lower than the first refractive index. In another embodiment, the first structure includes a layer having a perimeter and a pattern lying within the perimeter. The pattern extends at least partly though the first layer to define an opening with a first edge. In another embodiment, a process is used to form the electronic device.

Abstract: Methods and devices are provided for improving the encapsulation processes for an organic electronic device.

Abstract: An electronic device includes a radiation-emitting component, a radiation-responsive component, or a combination thereof. In one embodiment, the electronic device includes a substrate and a first structure overlying the substrate. The electronic device also includes a second structure that includes a first layer, wherein the first layer has a first refractive index, and the first layer includes a first edge. The electronic device further includes a second layer overlying at least portions of the first structure and the second structure at the first edge. The second layer has a second refractive index that is lower than the first refractive index. In another embodiment, the first structure includes a layer having a perimeter and a pattern lying within the perimeter. The pattern extends at least partly though the first layer to define an opening with a first edge. In another embodiment, a process is used to form the electronic device.

Abstract: The present invention relates to fluid jet interlace apparatus and related methods for interlacing filaments into a yarn with the filaments intermingled with adjacent ones of the filaments and groups of the filaments to maintain unity of the yarn by frictional constraint between the filaments at periodic nodes along the yarn. The invention also relates to methods of making fluid jet interlace apparatus.