Patents by Inventor Matthew E. Tarabulski

Matthew E. Tarabulski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRONIC COMPONENT BONDING MACHINES, AND METHODS OF MEASURING A DISTANCE ON SUCH MACHINES
    Publication number: 20220384384
    Abstract: An electronic component bonding machine is provided. The electronic component bonding machine includes: a support structure for supporting a substrate; a bond head assembly for holding an electronic component, and for bonding the electronic component to the substrate; and a measuring system for measuring a distance between (i) an upper target on the electronic component bonding machine and (ii) a lower target on the electronic component bonding machine, the upper target including at least one of a portion of the bond head assembly and the electronic component, the lower target including at least one of a portion of the support structure and the substrate.
    Type: Application
    Filed: May 31, 2022
    Publication date: December 1, 2022
    Inventors: Matthew B. Wasserman, James E. Eder, Michael P. Schmidt-Lange, Matthew E. Tarabulski
  • Bonding and placement tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods
    Patent number: 11011493
    Abstract: A bonding tool for bonding a semiconductor element to a substrate on a bonding machine is provided. The bonding tool includes a body portion including a contact region for contacting the semiconductor element during a bonding process on the bonding machine. The body portion defines a non-contact region adjacent the contact region. The bonding tool also includes a heat resistant coating applied to the non-contact region.
    Type: Grant
    Filed: October 3, 2018
    Date of Patent: May 18, 2021
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Ai Jun Song, Daniel P. Buergi, Horst Clauberg, Matthew E. Tarabulski, Matthew B. Wasserman
  • BONDING AND PLACEMENT TOOLS FOR BONDING MACHINES, BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, AND RELATED METHODS
    Publication number: 20190164931
    Abstract: A bonding tool for bonding a semiconductor element to a substrate on a bonding machine is provided. The bonding tool includes a body portion including a contact region for contacting the semiconductor element during a bonding process on the bonding machine. The body portion defines a non-contact region adjacent the contact region. The bonding tool also includes a heat resistant coating applied to the non-contact region.
    Type: Application
    Filed: October 3, 2018
    Publication date: May 30, 2019
    Inventors: Ai Jun Song, Daniel P. Buergi, Horst Clauberg, Matthew E. Tarabulski, Matthew B. Wasserman