Abstract: A continuity testing and cleaning fixture includes a continuity test area disposed on a portion of a first surface of the fixture, wherein the continuity test area comprises an upper region comprising at least 99.99 wt % tungsten. The continuity testing and cleaning fixture may be used in a method involving contacting at least two conductive elements of a probe card with a continuity test area of a continuity testing and cleaning fixture, wherein the continuity test area comprises an upper region comprising at least 99.99 wt % tungsten; determining an electrical resistance between the at least two conductive elements; and cleaning the at least two conductive elements with at least one cleaning zone of the continuity testing and cleaning fixture in response to determining the electrical resistance to be above a first threshold.

Abstract: A continuity testing and cleaning fixture includes a continuity test area disposed on a portion of a first surface of the fixture, wherein the continuity test area comprises an upper region comprising at least 99.99 wt % tungsten. The continuity testing and cleaning fixture may be used in a method involving contacting at least two conductive elements of a probe card with a continuity test area of a continuity testing and cleaning fixture, wherein the continuity test area comprises an upper region comprising at least 99.99 wt % tungsten; determining an electrical resistance between the at least two conductive elements; and cleaning the at least two conductive elements with at least one cleaning zone of the continuity testing and cleaning fixture in response to determining the electrical resistance to be above a first threshold.

Abstract: A gauge and method of use. The gauge includes a body configured to removeably mount to substrate chuck of a spin apply coating tool, the body rotatable about an axis passing through a center of the chuck; an extendable arm having a first end mounted to the body, the extendable arm having a retracted position and a deployed position, a second end of the arm including an upper finger and a lower finger, the upper finger configured to be positioned above a rim of the coat apply bowl and the lower finger positioned below the rim of the coat apply bowl in the deployed position when the coat apply bowl is mounted in the spin apply tool; and wherein the gauge provides an error indication when the gauge is rotated about the axis and the coat apply bowl is not installed in the spin apply coating tool correctly.

Abstract: An apparatus and method for facilitating Atomic Force Microscopy, SEM Nano-Probing, Scanning Probe Microscopy, and Collimated Ion Milling, through the implementation of a removable, magnetized fixture for fixing the position of a sample requiring surface treatment, the fixture attachable to a holder requiring surface treatment, the holder being mountable in various instruments, the fixture being transportable in a container having a magnetized surface plate or disc for magnetic attachment of said fixture, with the container having a valve to permit alternative evacuation and backfill with an inert gas to protect the sample surface.

Abstract: A gauge and method of use. The gauge includes a body configured to removeably mount to substrate chuck of a spin apply coating tool, the body rotatable about an axis passing through a center of the chuck; an extendable arm having a first end mounted to the body, the extendable arm having a retracted position and a deployed position, a second end of the arm including an upper finger and a lower finger, the upper finger configured to be positioned above a rim of the coat apply bowl and the lower finger positioned below the rim of the coat apply bowl in the deployed position when the coat apply bowl is mounted in the spin apply tool; and wherein the gauge provides an error indication when the gauge is rotated about the axis and the coat apply bowl is not installed in the spin apply coating tool correctly.

Abstract: A method of generating a capacitance-voltage (C-V) characteristic for a discrete device formed within a semiconductor structure may include exposing first and second contact regions associated with the discrete device, coupling a high-frequency impedance probe having a frequency range of about 5 Mhz to about 110 Mhz to an impedance analyzer, and coupling the high-frequency impedance probe to a first and a second atomic force probe tip. Using an atomic force microscope, the first atomic force probe tip is coupled to the exposed first contact region and the second atomic force probe tip is coupled to the exposed second contact region. The C-V characteristic for the discrete device is then measured on the impedance analyzer, whereby the impedance analyzer applies an operating frequency corresponding to the frequency range of about 5 Mhz to about 110 Mhz to the first and second contact regions of the discrete device using the high-frequency impedance probe.

Abstract: A method of generating a capacitance-voltage (C-V) characteristic for a discrete device formed within a semiconductor structure may include exposing first and second contact regions associated with the discrete device, coupling a high-frequency impedance probe having a frequency range of about 5 Mhz to about 110 Mhz to an impedance analyzer, and coupling the high-frequency impedance probe to a first and a second atomic force probe tip. Using an atomic force microscope, the first atomic force probe tip is coupled to the exposed first contact region and the second atomic force probe tip is coupled to the exposed second contact region. The C-V characteristic for the discrete device is then measured on the impedance analyzer, whereby the impedance analyzer applies an operating frequency corresponding to the frequency range of about 5 Mhz to about 110 Mhz to the first and second contact regions of the discrete device using the high-frequency impedance probe.

Abstract: A system and method for detecting leaks in pressurized or vacuum pipes is disclosed. A pipe clamp comprises a housing that surrounds a pipe fitting. A containment chamber within the pipe clamp prevents leaked gas from escaping into the environment. The pipe clamp is installed in series with an exhaust line to remove the leaked gas from the containment chamber. A sensor may be configured and disposed to detect a change in pressure in the containment chamber to indicate the occurrence of a leak.

Abstract: A system and method for detecting leaks in pressurized or vacuum pipes is disclosed. A pipe clamp comprises a housing that surrounds a pipe fitting. A containment chamber within the pipe clamp prevents leaked gas from escaping into the environment. The pipe clamp is installed in series with an exhaust line to remove the leaked gas from the containment chamber. A sensor may be configured and disposed to detect a change in pressure in the containment chamber to indicate the occurrence of a leak.

Abstract: An integrated coupon structure for atom probe tomography (APT) analysis includes a base portion and an array of microtip posts protruding from the base portion. Both the base portion and the microtip posts formed from a same metal material, and the microtip posts being shaped at an apex thereof so as to be adapted to receive a sample attached thereto.