Patents by Inventor Matthew J. KELTY

Matthew J. KELTY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interface card cooling using heat pipes
    Patent number: 10091911
    Abstract: A device may have: a frame section having a cage with a first receiving portion and a second receiving portion, the second receiving portion receiving a module; a first plate having an end, the first plate being received by the first receiving portion; a heat pipe having a first end attached to the end of the first plate and having a second end; a second plate attached to the second end of the heat pipe; and a spring attached to the first plate to bias the first plate against the module, the first plate being capable of receiving heat dissipated by the module, the heat pipe being capable of receiving the heat received by the first plate and transferring the heat to the second plate, the second plate receiving the heat transferred by the heat pipe and dissipating the received heat.
    Type: Grant
    Filed: December 11, 2012
    Date of Patent: October 2, 2018
    Assignee: Infinera Corporation
    Inventor: Matthew J. Kelty
  • INTERFACE CARD COOLING UISNG HEAT PIPES
    Publication number: 20140160679
    Abstract: A device may have: a frame section having a cage with a first receiving portion and a second receiving portion, the second receiving portion receiving a module; a first plate having an end, the first plate being received by the first receiving portion; a heat pipe having a first end attached to the end of the first plate and having a second end; a second plate attached to the second end of the heat pipe; and a spring attached to the first plate to bias the first plate against the module, the first plate being capable of receiving heat dissipated by the module, the heat pipe being capable of receiving the heat received by the first plate and transferring the heat to the second plate, the second plate receiving the heat transferred by the heat pipe and dissipating the received heat.
    Type: Application
    Filed: December 11, 2012
    Publication date: June 12, 2014
    Applicant: Infinera Corporation
    Inventor: Matthew J. KELTY