Patents by Inventor Matthew P. Szapucki

Matthew P. Szapucki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6237528
    Abstract: A plasma reactor showerhead electrode assembly for processing semiconductor wafers comprised of a typically silicon disk shaped gas plate having a plurality of gas passage holes formed therethrough by a ultrahigh velocity water jet boring apparatus, and a graphite circular split collar assembly including first and second semicircular sections forming a circumferential inner slot when opposing ends of said sections are secured together, the slot mating in a dovetail connection with an outer circumferential groove of said gas plate for retaining the latter between said sections. A conductive gasket may be interposed between the gas plate groove and the mating collar assembly to provide an electrically and thermally conductive seal. The first and second semicircular sections have opposing ends screwed or pinned together for providing easy disassembly thereof for replacement of the gas plate.
    Type: Grant
    Filed: January 24, 2000
    Date of Patent: May 29, 2001
    Assignee: M.E.C. Technology, Inc.
    Inventors: Matthew P. Szapucki, Richard Kulkaski, Trevor J. Hadley, Mark Anthony Santorelli
  • Patent number: 5458322
    Abstract: A clip assembly for retaining a semiconductor wafer on a pedestal during processing of the wafer, and releasing the wafer for removal from the pedestal after processing, includes a pair of tines each having a lower sloping surface for contacting an edge of an associated semiconductor wafer, and a ledge provided immediately above the lower sloping surface inward from a shared leading edge serves to catch debris or particulate material, preventing it from falling onto the surface of the semiconductor wafer. A metal spring, biasing the clip head into contact with the wafer, has an upper portion affixed to a front face of the clip head via an electrically nonconductive rectangularly shaped retainer for substantially reducing voltage arcing between the highly electrically charged plasma used in processing a semiconductor wafer and the clip head.
    Type: Grant
    Filed: March 25, 1994
    Date of Patent: October 17, 1995
    Inventors: Richard Kulkaski, Matthew P. Szapucki
  • Patent number: 5098388
    Abstract: A Veress needle instrument consists of a housing serving as a handle, a hollow needle having one end mounted in the housing and a pointed other end, a tube slidably mounted within the needle, the tube having one end sealed off and a side wall hole proximate the sealed end, the other end of the tube passing through the hollow needle and into the length of a passageway of a spring biased bobbin mounted in the housing, with the other end being secured in the passageway. The passageway of the bobbin opens into a porthole thereof for receiving a fluid coupling through a hole in the top end of the housing, thereby permitting fluid to be passed directly between the tube and the fluid coupling. The bobbin is normally biased toward the bottom end of the housing, for causing the one end of the tube to extend away from a pointed end of the needle with the side hole of the tube unobstructed.
    Type: Grant
    Filed: May 2, 1991
    Date of Patent: March 24, 1992
    Inventors: Richard Kulkashi, Matthew P. Szapucki, Stephen A. Grochmal