Abstract: A land grid array module is provided that includes a land grid array interface. The interface includes a substrate having a mating face. A contact pad is provided on the mating face of the substrate. The contact pad has an exposed surface with a depression that is configured to restrain transverse movement of a mating contact tip when the mating contact tip is loaded against the contact pad. The substrate layer may include a via having a diameter such that the depression is formed in the contact pad when the contact pad is plated over the via. The depression may also be stamped in the exposed surface of the contact pad. Alternatively, the depression may be surrounded by a raised conductive perimeter that is configured to retain the mating contact tip.

Abstract: A contact includes a conductive portion, a wire-receiving portion and a bundle of wound wires. The conductive portion has a compliant portion extending from a first end thereof. The compliant portion is configured to be positioned in an opening of a panel. The wire-receiving portion has a wire-receiving channel provided thereon. The bundle of wound wires is mounted in the wire-receiving channel and has a contact section which is configured to engage a mating connector.

Abstract: An electrical connector is provided and includes a housing that has a mating face configured to engage a mating connector. The electrical connector also includes a plurality of conductors that extend through the housing and a plurality of socket members that project from the mating face. Each socket member is electrically coupled to one of the conductors and includes a shaft that is configured to be inserted into a cavity of the mating connector. The shaft forms a passage that is configured to receive an associated mating contact held within the cavity for establishing an electrical connection.

Abstract: A contact module assembly includes a dielectric body having a mating end with a plurality of mating contacts and a mounting end with a plurality of mounting contacts. A lead frame is at least partially encased by the dielectric body, wherein the lead frame has a plurality of conductors representing both signal conductors and ground conductors extending alone a lead frame plane. The signal and ground conductors extend from respective ones of the mating contacts and the mounting contacts, wherein at least some of the ground conductors include a mating contact terminal proximate the respective mating contact and a mounting contact terminal proximate the respective mounting contact. The ground conductors extend only partially between the mating contact and the mounting contact associated with the respective ground conductor such that a gap exists between the mating contact terminal and the mounting contact terminal of the ground conductor.

Abstract: A straddle mount connector for connecting a daughter card to a circuit board includes a dielectric housing extending along a longitudinal axis. The housing has a daughter card side and an opposite straddle mount side. A longitudinally extending mating slot at the daughter card side is configured to receive a mating edge of the daughter card. A longitudinally extending mounting slot at the straddle mount side is configured to receive a mounting edge of the circuit board. The daughter card is inserted in the mating slot at an acute insertion angle with respect to a plane of the circuit board and rotated to a fully mated position wherein the daughter card is substantially coplanar with the circuit board.

Abstract: A memory card connector assembly for use within a chassis includes a conductive shell that has a forward perimeter. A connector including a dielectric housing holding contacts is positioned within the shell. An EMI shielding member is disposed on the forward perimeter of the shell. The EMI shielding member is configured to engage a panel of the chassis to suppress the escape of EMI energy from the chassis.

Abstract: An electrical contact is provided that includes a support body that is configured to be electrically connected to a first electrical component. The support body includes a flex region that is located proximate to the first electrical component, where the flex region is also substantially parallel to a surface of the first electrical component. The contact also includes an arm that extends from the flex region and away from the first electrical component to a distal end. The arm is configured to engage a second electrical component which is proximate the distal end.

Abstract: A contact module assembly includes a dielectric body having a mating end with a plurality of mating contacts and a mounting end with a plurality of mounting contacts. A lead frame is at least partially encased by the dielectric body, wherein the lead frame has a plurality of conductors representing both signal conductors and ground conductors extending alone a lead frame plane. The signal and ground conductors extend from respective ones of the mating contacts and the mounting contacts, wherein at least some of the ground conductors include a mating contact terminal proximate the respective mating contact and a mounting contact terminal proximate the respective mounting contact. The ground conductors extend only partially between the mating contact and the mounting contact associated with the respective ground conductor such that a gap exists between the mating contact terminal and the mounting contact terminal of the ground conductor.

Abstract: An electrical contact is provided that includes a support body that is configured to be electrically connected to a first electrical component. The support body includes a flex region that is located proximate to the first electrical component, where the flex region is also substantially parallel to a surface of the first electrical component. The contact also includes an arm that extends from the flex region and away from the first electrical component to a distal end. The arm is configured to engage a second electrical component which is proximate the distal end.

Abstract: A connector for mounting to a panel is provided that includes a housing that has a front edge configured to be located proximate an opening in the panel. The connector also includes a tab that extends from the front edge of the housing where the tab is oriented to engage an outer surface of the panel. A spring member also extends from the front edge of the housing and is positioned to engage an inner surface of the panel. The spring member is flexible toward and away from the tab.

Abstract: A straddle mount connector for connecting a daughter card to a circuit board includes a dielectric housing extending along a longitudinal axis. The housing has a daughter card side and an opposite straddle mount side. A longitudinally extending mating slot at the daughter card side is configured to receive a mating edge of the daughter card. A longitudinally extending mounting slot at the straddle mount side is configured to receive a mounting edge of the circuit board. The daughter card is inserted in the mating slot at an acute insertion angle with respect to a plane of the circuit board and rotated to a fully mated position wherein the daughter card is substantially coplanar with the circuit board.

Abstract: A land grid array module is provided that includes a land grid array interface. The interface includes a substrate having a mating face. A contact pad is provided on the mating face of the substrate. The contact pad has an exposed surface with a depression that is configured to restrain transverse movement of a mating contact tip when the mating contact tip is loaded against the contact pad. The substrate layer may include a via having a diameter such that the depression is formed in the contact pad when the contact pad is plated over the via. The depression may also be stamped in the exposed surface of the contact pad. Alternatively, the depression may be surrounded by a raised conductive perimeter that is configured to retain the mating contact tip.

Abstract: A heat sink assembly includes a circuit board, a first integrated circuit package and a second integrated circuit package mounted to the circuit board in a stacked relation to one another. A first heat sink is engaged to and is in thermal communication with the first integrated circuit package, and a second heat sink is engaged to and is in thermal communication with the second integrated circuit package, wherein each of the first and second heat sinks are positioned over the first and second integrated circuit packages on a single side of the circuit board. Optionally, the first heat sink may include an opening extending therethrough and exposing the second integrated circuit package. The second heat sink may extend through the opening and engage the second integrated circuit package.

Abstract: An electrical connector is provided having a housing and multiple contact modules loaded in the housing. Each contact module includes an array of contacts held in a dielectric carrier. Each array of contacts includes multiple contacts formed as part of a generic lead frame. The contacts in each array are spaced-apart from each other in a respective contact pattern. At least two contact modules hold different first and second patterns of the contacts, wherein the contacts in the first pattern have a first spaced-apart relationship and the contacts in the second pattern have a different second spaced-apart relationship. The generic lead frame includes both the first and second patterns of contacts such that either one of the first and second patterns may be selectively obtained from the generic lead frame.

Abstract: An electrical connector includes a housing having a mating end and a loading end. First and second contact wafers are loaded into the loading end of the housing. The first and second contact wafers each have a dielectric carrier holding a contact therein. The carriers have outer walls, wherein at least one of the outer walls on each of the carriers has a spacer engagement element provided thereon. A wafer spacer is configured to be positioned between the first and second contact wafers. The wafer spacer is positioned in one of different first and second orientations relative to the side walls of the first and second contact wafers. The wafer spacer has opposed first and second side walls that are separated by a spacer core thickness. The first side wall has a wafer engagement element provided thereon. When the wafer spacer is in the first orientation, the wafer spacer separates the first and second contact wafers by a first distance.

Abstract: An electrical connector is provided that comprises a housing with a front wall that separates a mating end from a loading end. The housing has a module support shroud that extends from the front wall toward the loading end and that has a latch element provided thereon. The connector also includes a contact module having an array of contacts that are held in a dielectric carrier. The contact module includes a mating end, sides and a module end. The module end slides along the module support shroud as the contact is loaded into the housing, until the mating end is located proximate to the front wall when the contact module is fully loaded. A retention latch member is formed separate from, and held by, the contact module. The retention latch member extends beyond the module edge and engages the latch element on the module support shroud to retain securely the contact module in the housing.

Abstract: An electrical socket is provided that holds an array of contacts. Each contact includes first and second contact elements that are configured to be joined in an electrically common manner. The first and second contact elements have first and second contact beams, respectively, that are oriented to project toward one another and to overlap. The first and second contact elements each have base portions that are formed separate from one another and are configured to be joined to a common conductive path on the circuit board.

Abstract: A socket connector is provided that includes a housing holding a plurality of electrical contacts. The housing includes a base having a top side and a bottom side. Opposed side walls upwardly extend from the top side of the base. A datum protrusion is formed on each of the side walls. The datum protrusions define a first dimension extending in a first direction and a second dimension extending in a second direction that is perpendicular to the first direction. The first and second dimensions extend from a maximum protrusion on one of the side walls to a maximum protrusion on an opposed side wall. An inspection window is proximate each datum protrusion. The inspection window enables a measurement of the first dimension and the second dimension.

Abstract: A socket connector including a socket base having a slot oriented at a first angle with respect to a bottom surface of the socket base. The socket connector also includes a contact having a base beam and a retention portion. The retention portion forms an initial angle with the base beam before the contact is assembled with the socket base that differs from the first angle. The socket base receives the contact with the retention portion held in the slot such that an angle between the base beam and the retention portion is changed from the initial angle.

Abstract: An electrical connector having a shroud and a skirt is provided. The shroud includes opposed side walls configured to retain a plurality of contact pins. The skirt extends from an end of the side walls of the shroud, and the skirt has a surface facing the shroud and a latch member extending from the surface.