Abstract: In a Field Effect Transistor (FET) with a semiconductor channel the use of a high Tc oxide superconductor material in the gate electrode provides both control of parasitic resistance and capacitance and a proper work function when operated at a temperature below the Tc. The 1-2-3 compound oxide superconductors with the general formula Y1Ba2Cu3O7-y where y is approximately 0.1 have the ability in use in FET's to provide convenient work functions, low resistance and capacitance, and to withstand temperatures encountered in processing as the FET is being manufactured.

Abstract: A method and system of refreshing a DRAM having a multitude of successive wordlines. The method comprises the step of starting a refresh cycle, and this starting step includes the steps of (I) counting the wordlines one at a time in succession, (ii) refreshing the wordlines counted over a first period t1, and (iii) at the end of period t1, stopping the refreshing of the wordlines, and continuing the counting of the wordlines for a period t2. The method further comprises the step of, after period t2, restarting the refresh cycle. Preferably, the restarting step includes the steps of, at the end of period t2, delaying for a period t3; and restarting the refresh cycle at the end of period t3. The method may include the further step of adjusting the length of the period t1, and preferably, during the combined periods t1 and t2, all of the wordlines are counted.

Abstract: According to the present invention, a method for fabricating vertical circuit devices which include a body contact is disclosed. During the fabrication process, the body of a transistor is formed from a pillar of single crystal silicon. The silicon pillar is formed over a butted junction of N+ and P+ diffusions. This fabrication process results in a pillar structure which has an n+ diffusion contacting a portion of the base of the transistor body and a P+ diffusion contacting the remainder of the base of the transistor body. The proportion of N+ and P+ area at the base of the silicon pillar depends on the overlay of the opening to the butted junction. Gate oxide is grown over the entire pillar and a polysilicon gate material is then deposited and etched to form the transistor gate. Metal contact studs are formed, preferably via deposition. After fabrication, the entire surface of the device can be planarized by using any standard Chemical Mechanical Planarization (CMP) process.

Abstract: According to the present invention, a method for fabricating vertical circuit devices which include a body contact is disclosed. During the fabrication process, the body of a transistor is formed from a pillar of single crystal silicon. The silicon pillar is formed over a butted junction of N+ and P+ diffusions. This fabrication process results in a pillar structure which has an n+ diffusion contacting a portion of the base of the transistor body and a P+ diffusion contacting the remainder of the base of the transistor body. The proportion of N+ and P+ area at the base of the silicon pillar depends on the overlay of the opening to the butted junction. Gate oxide is grown over the entire pillar and a polysilicon gate material is then deposited and etched to form the transistor gate. Metal contact studs are formed, preferably via deposition. After fabrication, the entire surface of the device can be planarized by using any standard Chemical Mechanical Planarization (CMP) process.

Abstract: A voltage control circuit for maintaining voltage levels on a pair of bitlines at a desirable above ground voltage is disclosed herein. In an exemplary embodiment, a semiconductor storage device includes a plurality of pairs of bitlines; a p-type field effect transistor multiplexer (PMUX) connecting each bitline of the pair to a sense amplifier; and a clamping circuit which prevents voltage levels on the bitlines from dwelling below a predetermined minimum voltage level. A method is also disclosed herein in which voltage levels on a pair of bitlines are maintained at a desirable above ground voltage level by connecting each bitline of a pair to a sense amplifier through a p-type field effect transistor multiplexer (PMUX); and clamping each bitline to prevent the voltage level thereon from dwelling below a predetermined minimum voltage level.