Abstract: A very light enclosure for electronic systems incorporates a rigid core enclosure structure formed with forward and rearward rigid, zig-zag configured, generally open mesh structure stabilization frames extending between oppositely disposed connection ends. The connection ends are rigidly attached to oppositely disposed sheet metal side assemblies to complete the core enclosure structure. The structure stabilization frames directly support card guides and power supply modules on oppositely disposed sides of a backplane tray.

Abstract: Method and System for dissipating thermal energy from conduction-cooled circuit card assemblies in which thermal energy is directed into proximate heat sink assemblies and additionally is conveyed by heat pipes to one or more remote heat sink assemblies configured for the transfer of thermal energy to a flow of air and located within a chassis at a position remote from the system thermal load.

Abstract: Method and System for dissipating thermal energy from conduction-cooled circuit card assemblies in which thermal energy is directed into proximate heat sink assemblies and additionally is conveyed by heat pipes to one or more remote heat sink assemblies configured for the transfer of thermal energy to a flow of air and located within a chassis at a position remote from the system thermal load.

Abstract: Modular power supply apparatus wherein a plurality of d.c.-to-d.c. converters are coupled to an internally structured heat exchange channel through which fan driven air is passed in an unobstructed manner along a flow axis. Each of the converter modules is combined with a dedicated module circuit board which provides regulated output terminals in an orientation or direction arranged transversely to the flow axis. The opposite end of the module circuit boards are plugged into a main interconnect circuit board positioned along one side of the heat exchange channel. A support channel is provided outwardly of the main interconnect circuit board within which principal components of supporting circuitry are contained.

Abstract: A power supply/backplane assembly and system wherein a substantially flat power supply assembly including a printed circuit, power converter modules, and heat sink is mounted directly to the rearwardly disposed surface of a backplane. The size of the power supply and the region at which it is mounted substantially falls within the border of a fully defined region of the backplane. Flat copper traces carried by the power supply circuit board function to carry regulated power directly to the backplane via a power bolt system. Thus, conventional cabling is eliminated. The circuit board also is employed in conjunction with readily accessible connector components to provide for simplified wiring installation of support features such as the interaction between a supervisory panel and a front end a.c.-to-d.c. conversion component.