Abstract: There is provided a method of printing a regular array of rows of subpixels on a workpiece. The subpixels have c different colors and have a subpixel pitch s. A printing head has z nozzles arranged in a row with a spacing p, where z=n1(c) and p=(c?1)(s), the printhead being at a first position relative to the workpiece. There are c different printing inks, one for each of the c colors, and each of the printing inks is supplied to the nozzles in a regular alternating pattern. The method includes steps of printing a first set of z rows of subpixels with the printing head; moving the workpiece laterally relative to the printing head by a distance d1, where d1=z(s); printing a second set of z rows of subpixels with the printing head; repeating the printing steps n2 times for a total of n2+2 sets of z rows of subpixels. Variables include: c, an integer greater than 1; n1, an integer greater than 0, with the proviso that when c is an odd number, then n1 is an odd number; and n2, an integer greater than 0.

Abstract: An electronic device includes a substrate. The substrate includes a first pixel driving circuit, a first conductive member, and a second conductive member. The first and second conductive members are spaced apart from each other. The first conductive member is connected to the first pixel driving circuit. The second conductive member is part of a power transmission line. The electronic device further includes a well structure overlying the substrate and defining a pixel opening, a via, and a channel. The pixel opening is connected to the via through the channel. In addition, the electronic device includes a first electronic component. The electronic component includes a first electrode that contacts the first conductive member in the pixel opening, a second electrode that contacts the second conductive member in the via, and an organic layer lying between the first and second electrodes.

Abstract: There is provided a process of forming a regular array of rows of subpixels on a workpiece. The subpixels having 3 different colors, and a subpixel pitch s. Of the three colors, q colors are formed by printing and r colors are formed by a non-printing method.

Abstract: There is provided a process of forming a regular array of rows of subpixels on a workpiece. The subpixels having four different colors, and a subpixel pitch s. Of the four colors, q colors are formed by printing and r colors are formed by a non-printing method.

Abstract: There is provided a method of printing a regular array of rows of subpixels on a workpiece. The subpixels have c different colors and have a subpixel pitch s. A printing head has z nozzles arranged in a row with a spacing p, where z=n1(c) and p=(c?1)(s), the printhead being at a first position relative to the workpiece. There are c different printing inks, one for each of the c colors, and each of the printing inks is supplied to the nozzles in a regular alternating pattern. The method includes steps of printing a first set of z rows of subpixels with the printing head; moving the workpiece laterally relative to the printing head by a distance d1, where d1=z(s); printing a second set of z rows of subpixels with the printing head; repeating the printing steps n2 times for a total of n2+2 sets of z rows of subpixels. Variables include: c, an integer greater than 1; n1, an integer greater than 0, with the proviso that when c is an odd number, then n1 is an odd number; and n2, an integer greater than 0.

Abstract: Provided are containment structures having a substrate structure having a plurality of walls extending from a surface to define a space, wherein at least one of the walls has an overall negative slope; a first layer deposited in the space having a first surface energy no greater than 30 mN/m; and a second layer deposited on top of the first layer.

Abstract: In the fabrication of a display, such as an OLED display, the OLED layer stack is deposited on an electrode on the substrate. The electrode may be the anode and may comprise indium tin oxide (ITO). Desirably, the deposited films are of uniform thickness over the entire active area of the electrode. If the films are not uniform, then areas that are thicker will not emit light, and areas that are too thin may emit light in a less than optimum efficient way (power loss) and/or result in leakage current leaks through the device in a way that does not generate photons. An active-matrix organic light emitting diode comprises a substrate with a larger well size or wider channel width compared to the emission area. This improves the effective aperture ratio, which improves pixel intensity homogeneity.

Abstract: There is provided a backplane for an organic electronic device. The backplane has a TFT substrate having a multiplicity of electrode structures thereon. There are spaces around the electrode structures and a layer of organic filler in the spaces. The thickness of the layer of organic filler is the same as the thickness of the electrode structures.

Abstract: There is provided a backplane for an organic electronic device. The backplane has a TFT substrate having a multiplicity of electrode structures thereon. There are spaces around the electrode structures and a layer of inorganic filler in the spaces. The thickness of the layer of inorganic filler is the same as the thickness of the electrode structures.

Abstract: An electronic device includes an array. In one embodiment, a process for forming an electronic device includes the array, which includes electronic components, can include printing one or more layers as a series of segments onto a workpiece. In one embodiment, a process includes printing a layer onto the workpiece and at least one exposed portion of the chuck. In still another embodiment, a printing head is greater than 0.5 mm from the workpiece. In a further embodiment, “hybrid” printing can be used to help form a thicker layer having a relatively thinner width. In a further embodiment, processes can be used to reduce the likelihood of a stitching defect, nonuniformity of a layer across an array, or a combination thereof. A printing apparatus can be modified to achieve more flexibility in liquid compositions, temperatures or other conditions used in printing a layer.

Abstract: There is provided a backplane for an organic electronic device. The backplane has a TFT substrate; a multiplicity of electrode structures; and a bank structure defining a multiplicity of pixel openings on the electrode structures. The bank structure has a height adjacent to the pixel opening, hA, and a height removed from the pixel opening, hR, and hA is significantly less than hR.

Abstract: There is provided a method of forming a regular array of rows of subpixels on a workpiece. The subpixels have c different colors, where a colors are formed by printing. The subpixel pitch is s.

Abstract: An electronic device includes a substrate. The substrate includes a first pixel driving circuit, a first conductive member, and a second conductive member. The first and second conductive members are spaced apart from each other. The first conductive member is connected to the first pixel driving circuit. The second conductive member is part of a power transmission line. The electronic device further includes a well structure overlying the substrate and defining a pixel opening, a via, and a channel. The pixel opening is connected to the via through the channel. In addition, the electronic device includes a first electronic component. The electronic component includes a first electrode that contacts the first conductive member in the pixel opening, a second electrode that contacts the second conductive member in the via, and an organic layer lying between the first and second electrodes.

Abstract: There is provided herein a process for forming an encapsulated electronic device. The device has active areas and sealing areas on a substrate. The process includes providing the substrate; forming a discontinuous pattern of a material having a first surface energy on at least a portion of the sealing areas; forming multiple active layers, where at least one active layer is formed by liquid deposition from a liquid medium having a surface energy greater than the first surface energy; providing an encapsulation assembly; and bonding the encapsulation assembly to the substrate in the sealing areas. Also provided are devices formed by the disclosed processes.

Abstract: There is provided herein a process for forming an encapsulated electronic device. The device has active areas and sealing areas on a substrate. The process includes providing the substrate; forming a discontinuous pattern of a material having a first surface energy on at least a portion of the sealing areas; forming multiple active layers, where at least one active layer is formed by liquid deposition from a liquid medium having a surface energy greater than the first surface energy; providing an encapsulation assembly; and bonding the encapsulation assembly to the substrate in the sealing areas. Also provided are devices formed by the disclosed processes.

Abstract: There is provided a process for forming an organic electronic device. The process includes the steps of providing a TFT substrate; forming a thick organic planarization layer over the substrate; forming on the planarization layer a multiplicity of thin first electrode structures having a first thickness, where the electrode structures have tapered edges with a taper angle of no greater than 75°; forming a buffer layer by liquid deposition of a composition including a buffer material in a first liquid medium, the buffer layer having a second thickness, wherein the second thickness is at least 20% greater than the first thickness; forming over the buffer layer a chemical containment pattern defining pixel openings; depositing into at least a portion of the pixel openings a composition including a first active material in a second liquid medium; and forming a second electrode.

Abstract: There is provided a method of printing a regular array of rows of subpixels on a workpiece. The subpixels have c different colors and have a subpixel pitch s. A printing head has z nozzles arranged in a row with a spacing p, where z=n1(c) and p=n2(s), the printhead being at a first position relative to the workpiece. There are c different printing inks, one for each of the c colors, and each of the printing inks is supplied to the nozzles in a regular alternating pattern. The method includes steps of printing a first set of z rows of subpixels with the printing head; moving the workpiece laterally relative to the printing head by a distance d1, where d1=n3(s); printing a second set of z rows of subpixels with the printing head; repeating the printing steps for a total of n2 sets of z rows of subpixels. Variables include: c, an integer greater than 1; n1, n2, and n3 which are the same or different and are independently selected from integers greater than 0, with the proviso that n2 is not a multiple of c.

Abstract: There is provided a process for forming an organic electronic device wherein a TFT substrate having a non-planar surface has deposited over that substrate a planarization layer such that a substantially planar substrate, or planarized substrate, is formed. A multiplicity of thin first electrode structures having a first thickness and having tapered edges with a taper angle of no greater than 75° are formed over the planarized substrate. A multiplicity of active layers is formed over the planarized substrate. Then a buffer layer is formed by liquid deposition of a composition comprising a buffer material in a first liquid medium. The buffer layer has a second thickness which is at least 20% greater than the first thickness. A chemical containment pattern defining pixel openings is then formed over the buffer layer. A composition comprising a first active material in a second liquid medium is deposited into at least a portion of the pixel openings. Then a second electrode is formed.

Abstract: An apparatus and method for liquid-phase dispensing of layers onto a substrate of an electronic device. An absorbent material reduces or eliminates splatter of printing material on the substrate during continuous printing operations. The absorbent material can be regenerated by exposure of new surface area or vacuum drawing of printing material through the absorbent material.

Abstract: An electronic device includes a printed layer. In one embodiment, a process for forming the electronic device includes placing a workpiece over a chuck within a printing apparatus. A temperature difference is established between the workpiece and a liquid composition. The process further includes continuously printing the liquid composition over the workpiece. A viscosity of the liquid composition is allowed to increase at a rate significantly higher than an ambient viscosity increase rate. In another embodiment, the workpiece is allowed to cool to a temperature significantly below an ambient temperature before printing occurs. In still another embodiment, a printing apparatus is used for continuously printing the liquid composition over the workpiece. The printing apparatus includes the chuck, a printing head, a container, a feed line, and a first temperature-adjusting element thermally coupled to the chuck, the printing head, the container the feed line, or a combination thereof.