Abstract: A first chip includes a first plurality of optical waveguides exposed at a facet of the first chip. A second chip includes a second plurality of optical waveguides exposed at a facet of the second chip. The second chip includes first and second spacers on opposite sides of the second plurality of optical waveguides. The first and second spacers have respective alignment surfaces oriented substantially parallel to the facet of the second chip at a controlled perpendicular distance away from the facet of the second chip. The second chip is positioned with the alignment surfaces of the first and second spacers contacting the facet of the first chip, and with the second plurality of optical waveguides respectively aligned with the first plurality of optical waveguides. The first and second spacers define and maintain an air gap of at least micrometer-level precision between the first and second pluralities of optical waveguides.

Abstract: An optical data communication system includes an optical power supply and an electro-optical chip. The optical power supply includes a laser that generates laser light at a single wavelength. A comb generator receives the light at the single wavelength and generates multiple wavelengths of continuous wave light from laser light at the single wavelength. The multiple wavelengths of continuous wave light are provided as light input to the electro-optical chip. The electro-optical chip includes at least one transmit macro that receives the multiple wavelengths of continuous wave light and that modulates one or more of the multiple wavelengths of continuous wave light to generate modulated light signals that convey digital data.

Abstract: A first chip includes a first plurality of optical waveguides exposed at a facet of the first chip. A second chip includes a second plurality of optical waveguides exposed at a facet of the second chip. The second chip includes first and second spacers on opposite sides of the second plurality of optical waveguides. The first and second spacers have respective alignment surfaces oriented substantially parallel to the facet of the second chip at a controlled perpendicular distance away from the facet of the second chip. The second chip is positioned with the alignment surfaces of the first and second spacers contacting the facet of the first chip, and with the second plurality of optical waveguides respectively aligned with the first plurality of optical waveguides. The first and second spacers define and maintain an air gap of at least micrometer-level precision between the first and second pluralities of optical waveguides.

Abstract: An optical distribution network includes a fore-positioned optical multiplexer section that has a plurality of optical inputs and a plurality of intermediate optical outputs. Each of the plurality of optical inputs of the fore-positioned optical multiplexer section receives a respective one of a plurality of input light signals of different wavelengths. The fore-positioned optical multiplexer section multiplexes a unique subset of the plurality of input light signals onto each of the plurality of intermediate optical outputs. The optical distribution network also includes an optical coupler section that has a plurality of optical inputs respectively optically connected to the plurality of intermediate optical outputs of the fore-positioned optical multiplexer section. The optical coupler section distributes a portion of each light signal received at each of the plurality of optical inputs of the optical coupler section to each and every one of a plurality of optical outputs of the optical coupler section.

Abstract: An electro-optical chip includes a plurality of transmit macros, each of which includes an optical waveguide and a plurality of ring resonators positioned along the optical waveguide. An optical distribution network is implemented onboard the electro-optical chip. The optical distribution network has a plurality of optical inputs and a plurality of optical outputs. The optical distribution network conveys a portion of light received at each and every one of the plurality of optical inputs to each of the plurality of optical outputs, such that light conveyed to each of the plurality of optical outputs includes all wavelengths of light conveyed to the plurality of optical inputs. Each of the plurality of optical outputs is optically connected to the optical waveguide in a corresponding one of the plurality of transmit macros. The electro-optical chip is optically connected to a remote optical power supply.

Abstract: An electro-optical chip includes a plurality of transmit macros, each of which includes an optical waveguide and a plurality of ring resonators positioned along the optical waveguide. An optical distribution network is implemented onboard the electro-optical chip and includes a plurality of optical inputs and a plurality of optical outputs. The optical distribution network conveys a portion of light received at a subset of the plurality of optical inputs to one or more of the plurality of optical outputs, such that light conveyed to said one or more of the plurality of optical outputs includes wavelengths of light conveyed to said subset of the plurality of optical inputs. The subset of the plurality of optical inputs includes at least two of the plurality of optical inputs. Each of the plurality of optical outputs is optically connected to the optical waveguide in a corresponding one of the plurality of transmit macros.

Abstract: An optical power supply includes a plurality of lasers in a laser array. Each of the plurality of lasers is configured to generate a separate beam of continuous wave laser light. The optical power supply includes a temperature sensor that acquires a temperature associated with the laser array. The optical power supply includes a digital controller that receives notification of the temperature from the temperature senor. The optical power supply includes an optical power adjuster controlled by the digital controller. The optical power adjuster adjusts an optical power level of one or more beams of continuous wave laser light generated by the plurality of lasers to produce an optical power encoding that conveys information about the temperature associated with the laser array as acquired by the temperature sensor. An electro-optic chip receives the beams of continuous wave laser light from the optical power supply and decodes the optical power encoding.

Abstract: An optical data communication system includes an optical power supply and an electro-optical chip. The optical power supply includes a laser that generates laser light at a single wavelength. A comb generator receives the light at the single wavelength and generates multiple wavelengths of continuous wave light from laser light at the single wavelength. The multiple wavelengths of continuous wave light are provided as light input to the electro-optical chip. The electro-optical chip includes at least one transmit macro that receives the multiple wavelengths of continuous wave light and that modulates one or more of the multiple wavelengths of continuous wave light to generate modulated light signals that convey digital data.

Abstract: An optical data communication system includes a plurality of resonator structures and a laser array that includes a plurality of lasers optically connected to the plurality of resonator structures. Each resonator structure has a respective free spectral wavelength range and a respective resonance wavelength. A maximum difference in resonance wavelength between any two resonator structures in the plurality of resonator structures is less than a minimum free spectral wavelength range of any resonator structure in the plurality of resonator structures. Each laser in the plurality of lasers is configured to generate continuous wave light having a respective wavelength. The laser array has a central wavelength. A variability of the central wavelength is greater than a minimum difference in resonance wavelength between any two spectrally neighboring resonator structures in the plurality of resonator structures.

Abstract: An optical data communication system includes a plurality of resonator structures and a laser array that includes a plurality of lasers optically connected to the plurality of resonator structures. Each resonator structure has a respective free spectral wavelength range and a respective resonance wavelength. A maximum difference in resonance wavelength between any two resonator structures in the plurality of resonator structures is less than a minimum free spectral wavelength range of any resonator structure in the plurality of resonator structures. Each laser in the plurality of lasers is configured to generate continuous wave light having a respective wavelength. The laser array has a central wavelength. A variability of the central wavelength is greater than a minimum difference in resonance wavelength between any two spectrally neighboring resonator structures in the plurality of resonator structures.

Abstract: An optical data communication system includes a plurality of resonator structures and a laser array that includes a plurality of lasers optically connected to the plurality of resonator structures. Each resonator structure has a respective free spectral wavelength range and a respective resonance wavelength. A maximum difference in resonance wavelength between any two resonator structures in the plurality of resonator structures is less than a minimum free spectral wavelength range of any resonator structure in the plurality of resonator structures. Each laser in the plurality of lasers is configured to generate continuous wave light having a respective wavelength. The laser array has a central wavelength. A variability of the central wavelength is greater than a minimum difference in resonance wavelength between any two spectrally neighboring resonator structures in the plurality of resonator structures.

Abstract: A first chip includes a first plurality of optical waveguides exposed at a facet of the first chip. A second chip includes a second plurality of optical waveguides exposed at a facet of the second chip. The second chip includes first and second spacers on opposite sides of the second plurality of optical waveguides. The first and second spacers have respective alignment surfaces oriented substantially parallel to the facet of the second chip at a controlled perpendicular distance away from the facet of the second chip. The second chip is positioned with the alignment surfaces of the first and second spacers contacting the facet of the first chip, and with the second plurality of optical waveguides respectively aligned with the first plurality of optical waveguides. The first and second spacers define and maintain an air gap of at least micrometer-level precision between the first and second pluralities of optical waveguides.

Abstract: An optical data communication system includes an optical power supply and an electro-optical chip. The optical power supply includes a laser that generates laser light at a single wavelength. A comb generator receives the light at the single wavelength and generates multiple wavelengths of continuous wave light from laser light at the single wavelength. The multiple wavelengths of continuous wave light are provided as light input to the electro-optical chip. The electro-optical chip includes at least one transmit macro that receives the multiple wavelengths of continuous wave light and that modulates one or more of the multiple wavelengths of continuous wave light to generate modulated light signals that convey digital data.

Abstract: Monolithic asymmetric optical waveguide grating resonators including an asymmetric resonant grating are disposed in a waveguide. A first grating strength is provided along a first grating length, and a second grating strength, higher than the first grating strength, is provided along a second grating length. In advantageous embodiments, the effective refractive index along first grating length is substantially matched to the effective refractive index along second grating length through proper design of waveguide and grating parameters. A well-matched effective index of refraction may permit the resonant grating to operate in a highly asymmetric single longitudinal mode (SLM). In further embodiments, an asymmetric monolithic DFB laser diode includes front and back grating sections having waveguide and grating parameters for highly asymmetric operation.

Abstract: Monolithic asymmetric optical waveguide grating resonators including an asymmetric resonant grating are disposed in a waveguide. A first grating strength is provided along a first grating length, and a second grating strength, higher than the first grating strength, is provided along a second grating length. In advantageous embodiments, the effective refractive index along first grating length is substantially matched to the effective refractive index along second grating length through proper design of waveguide and grating parameters. A well-matched effective index of refraction may permit the resonant grating to operate in a highly asymmetric single longitudinal mode (SLM). In further embodiments, an asymmetric monolithic DFB laser diode includes front and back grating sections having waveguide and grating parameters for highly asymmetric operation.

Abstract: A semiconductor metallurgy includes a ratio of germanium and palladium that provides low contact resistance to both n-type material and p-type material. The metallurgy allows for a contact that does not include gold and is compatible with mass-production CMOS techniques. The ratio of germanium and palladium can be achieved by stacking layers of the materials and annealing the stack, or simultaneously depositing the germanium and palladium on the material where the contact is to be manufactured.

Abstract: A semiconductor metallurgy includes a ratio of germanium and palladium that provides low contact resistance to both n-type material and p-type material. The metallurgy allows for a contact that does not include gold and is compatible with mass-production CMOS techniques. The ratio of germanium and palladium can be achieved by stacking layers of the materials and annealing the stack, or simultaneously depositing the germanium and palladium on the material where the contact is to be manufactured.

Abstract: A multi-wavelength array of hybrid silicon lasers and a method of fabricating such a device. The method may include providing a silicon-on-insulator wafer; patterning waveguides in the silicon-on-insulator wafer; providing a III-V wafer comprising multiple layers; applying quantum well intermixing to obtain a plurality of regions of different bandgaps within the III-V wafer; and bonding the silicon on insulator wafer with the III-V wafer.

Abstract: An optimized structure for heat dissipation is provided that may include two types of thermal shunts. The first type of thermal shunt employed involves using p and n metal contact layers to conduct heat away from the active region and into the silicon substrate. The second type of thermal shunt involves etching and backfilling a portion of the silicon wafer with poly-silicon to conduct heat to the silicon substrate.

Abstract: A multi-wavelength array of hybrid silicon lasers and a method of fabricating such a device. The method may include providing a silicon-on-insulator wafer; patterning waveguides in the silicon-on-insulator wafer; providing a III-V wafer comprising multiple layers; applying quantum well intermixing to obtain a plurality of regions of different bandgaps within the III-V wafer; and bonding the silicon on insulator wafer with the III-V wafer.