Patents by Inventor Matthew Thomas Tiersch

Matthew Thomas Tiersch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composite polish pad for CMP
    Patent number: 5944583
    Abstract: A method and apparatus for polishing a semiconductor wafer using a polishing pad. Circumferential rings of alternating compressibility of hard and soft/sponge-like material are located in the polishing pad. The concentric rings may also be located off-center from the geometric center of the polishing pad.
    Type: Grant
    Filed: March 17, 1997
    Date of Patent: August 31, 1999
    Assignee: International Business Machines Corporation
    Inventors: Jose Luis Cruz, Steven James Messier, Douglas Keith Sturtevant, Matthew Thomas Tiersch
  • Off-center grooved polish pad for CMP
    Patent number: 5842910
    Abstract: A method and apparatus for polishing a semiconductor wafer using a polishing pad. The polishing pad contains circumferential grooves which are located off center from the geometric center of the polishing pad.
    Type: Grant
    Filed: March 10, 1997
    Date of Patent: December 1, 1998
    Assignee: International Business Machines Corporation
    Inventors: Timothy Charles Krywanczyk, Douglas Keith Sturtevant, Matthew Thomas Tiersch