Abstract: In one aspect, an ultrasound transducer system comprises a two-dimensional array of transducer elements, the transducer elements having a first side comprising individual first electrodes in electrical communication with control circuitry of the ultrasound transducer system. A matching layer is coupled to a second side of the transducer elements via an electrically conductive face, wherein the electrically conductive face serves as a common electrical contact for the transducer elements. The matching layer also comprises kerfs extending to a depth less than the electrically conductive face.

Abstract: In one aspect, ultrasound transducers are described herein comprising acoustic lenses having enhanced wear resistance. Such transducers can be employed in applications having harsh operating conditions, including veterinary applications. A transducer described herein, in some embodiments, comprises a polymeric acoustic lens having an acoustic velocity greater than 1.7 mm/?s, the polymeric acoustic lens arranged over an array of transducer elements wherein the array of transducer elements has a curvature in an elevation plane sufficient to compensate for wave refraction induced by the acoustic velocity of the polymeric acoustic lens to provide elevation focusing of an ultrasound beam generated by the transducer element array.

Abstract: In one aspect, ultrasound transducers are described herein comprising monolithic caps having low acoustic impedance. Such transducers can be safer to use and/or simpler to manufacture. A transducer described herein, in some embodiments, a casing, a transducer element assembly disposed in the casing, an impedance matching layer assembly positioned over the transducer element assembly, and a monolithic thermoplastic cup enclosing the inner impedance matching layer assembly, the monolithic thermoplastic cup comprising side walls extending over side walls of the casing and an impedance matching bottom wall having an acoustic impedance of 1.5 MRayls to 4.0 MRayls.

Abstract: In one aspect, an ultrasound transducer system comprises a two-dimensional array of transducer elements, the transducer elements having a first side comprising individual first electrodes in electrical communication with control circuitry of the ultrasound transducer system. A matching layer is coupled to a second side of the transducer elements via an electrically conductive face, wherein the electrically conductive face serves as a common electrical contact for the transducer elements. The matching layer also comprises kerfs extending to a depth less than the electrically conductive face.

Abstract: In one aspect, ultrasound transducers are described herein comprising monolithic caps having low acoustic impedance. Such transducers can be safer to use and/or simpler to manufacture. A transducer described herein, in some embodiments, a casing, a transducer element assembly disposed in the casing, an impedance matching layer assembly positioned over the transducer element assembly, and a monolithic thermoplastic cup enclosing the inner impedance matching layer assembly, the monolithic thermoplastic cup comprising side walls extending over side walls of the casing and an impedance matching bottom wall having an acoustic impedance of 1.5 MRayls to 4.0 MRayls.

Abstract: In some embodiments, circuits for ultrasonic transducer element arrays are provided. In some embodiments, a circuit described herein comprises a first layer for receiving a transducer element array, a ground layer comprising at least one ground disposed over the first layer and a plurality of first vias corresponding to transducer elements of the array, the first vias extending through the first layer to the at least one ground and comprising first ends for receiving ground electrodes of the transducer elements and second ends electrically connected to the ground.

Abstract: In one aspect, ultrasound transducers are described herein comprising acoustic lenses having enhanced wear resistance. Such transducers can be employed in applications having harsh operating conditions, including veterinary applications. A transducer described herein, in some embodiments, comprises a polymeric acoustic lens having an acoustic velocity greater than 1.7 mm/?s, the polymeric acoustic lens arranged over an array of transducer elements wherein the array of transducer elements has a curvature in an elevation plane sufficient to compensate for wave refraction induced by the acoustic velocity of the polymeric acoustic lens to provide elevation focusing of an ultrasound beam generated by the transducer element array.

Abstract: In some embodiments, circuits for ultrasonic transducer element arrays are provided. In some embodiments, a circuit described herein comprises a first layer for receiving a transducer element array, a ground layer comprising at least one ground disposed over the first layer and a plurality of first vias corresponding to transducer elements of the array, the first vias extending through the first layer to the at least one ground and comprising first ends for receiving ground electrodes of the transducer elements and second ends electrically connected to the ground.

Abstract: A system and method for an ultrasonic array transducer is provided. The system includes a plurality of transducer elements, each including a positive electrode and a ground electrode. The system includes a plurality of twisted pair cables. Each twisted pair cable is operatively connected to a respective transducer element by way of a circuit connected therebetween. The circuit includes a plurality of first circuit conductors and a plurality of second circuit conductors. Each first circuit conductor is operatively connected to a respective ground electrode and to a respective twisted pair cable. Each second circuit conductor is operatively connected to a respective positive electrode and to a respective twisted pair cable. The system allows for discrete connections to be made at individual ground electrodes in the transducer array. As a result, appreciable time and labor savings in the process of forming the transducer system can be realized.

Abstract: In a method of making an ultrasonic transducer, a piezoelectric ceramic material that is at least partially covered by metal plating is provided. A plurality of substantially parallel cuts is formed in the plating so as to define a plurality of transducer elements and a ground element. A plurality of conductors is provided. An end portion of each conductor is operatively connected, such as by ultrasonic bonding, to a respective one of the transducer elements or the ground element. Next, a backing material is bonded to the plurality of transducer elements and the ground element such that the end portion of each conductor is sandwiched between the backing material and a respective one of the transducer elements or the ground element. The conductors are bent to allow for operative connection to an ultrasound system. The operative connection between the conductors and the transducer elements is maintained during the bending step.

Abstract: In one aspect, testing apparatus for ultrasound transducers comprising arrays of transducing elements are described herein. In some embodiments, a test apparatus for an ultrasound transducer having a curved transducing element array comprises a block of material permitting propagation of an acoustic signal generated by the transducer, the block of material comprising a transducer receiving surface and a second surface in facing opposition to the receiving surface and forming an acoustically reflective interface with a medium, the second surface comprising a curvature having a center similar to or substantially similar to the center of curvature of the transducer element array when the transducer is coupled to the receiving surface.

Abstract: A transducer system includes a multi-layer flexible circuit. The flexible circuit includes a first layer, a second layer and a third layer. The circuit engages a piezoelectric material/electrode subassembly. Vias are used to operatively connect ground electrodes of individual transducer elements to grounds in the third layer of the circuit. The vias extend through the first and second layers to the third layer of the circuit. When the flexible circuit is diced during the assembly of the transducer system, no cuts are made in the third layer of the circuit. As a result, a common ground connection is maintained by way of the grounds in the third layer of the circuit. Thus, no subsequent operation of reconnecting the common ground electrode is required.

Abstract: In a method of making an ultrasonic transducer, a piezoelectric ceramic material that is at least partially covered by metal plating is provided. A plurality of substantially parallel cuts is formed in the plating so as to define a plurality of transducer elements and a ground element. A plurality of conductors is provided. An end portion of each conductor is operatively connected, such as by ultrasonic bonding, to a respective one of the transducer elements or the ground element. Next, a backing material is bonded to the plurality of transducer elements and the ground element such that the end portion of each conductor is sandwiched between the backing material and a respective one of the transducer elements or the ground element. The conductors are bent to allow for operative connection to an ultrasound system. The operative connection between the conductors and the transducer elements is maintained during the bending step.

Abstract: A transducer system includes a multi-layer flexible circuit. The flexible circuit includes a first layer, a second layer and a third layer. The circuit engages a piezoelectric material/electrode subassembly. Vias are used to operatively connect ground electrodes of individual transducer elements to grounds in the third layer of the circuit. The vias extend through the first and second layers to the third layer of the circuit. When the flexible circuit is diced during the assembly of the transducer system, no cuts are made in the third layer of the circuit. As a result, a common ground connection is maintained by way of the grounds in the third layer of the circuit. Thus, no subsequent operation of reconnecting the common ground electrode is required.