Abstract: Methods and systems to control stacked hexapod platforms for use as tools, which function with both high accuracy and high precision are provided. In some embodiments, the methods and systems include a convergence of modern control theory, and machine learning. Furthermore, some embodiments provide control algorithms to carry out autonomous in-space assembly operations using assemblers. Some embodiments provide methods and systems which combine long-reach low precision manipulators and smaller, high-precision assembler with interchangeable tools.

Abstract: Radiation detection is disclosed. A radiation detection package includes a radio-photoluminescent glass (RPLG), an EMR source and a photodetector. The EMR source includes an input lead, and is configured to emit first energy in a predetermined band of EMR in a downstream direction toward the RPLG in response to receipt of an input signal on the input lead of the EMR source. The photodetector has an output lead, and is configured to detect second energy that is emitted by the RPLG in an emission band of EMR in response to the receipt of the first energy in the predetermined band of EMR, and generate a first output signal on the output lead indicative of an amount of the second energy.

Abstract: Mechanisms for verification of an item. A controller reads out signals from an antenna array comprising a plurality of individual antenna elements that is configured to overlay an item that generates radio frequency (RF) emissions. The signals quantify the RF emissions received by antenna elements from the item. The controller generates an ad hoc RF emission signature based on the signals. A predetermined RF emission signature associated with the item is accessed. The ad hoc RF emission signature and the predetermined RF emission signature are compared to determine a verification status, and the controller performs a verification action based on the verification status.

Abstract: A device having the capability for electrical, thermal, optical, and fluidic interconnections to various layers. Through-substrate vias in the interconnect device are filled to enable electrical and thermal connection or optionally hermetically sealed relative to other surfaces to enable fluidic or optical connection. Optionally, optical components may be placed within the via region in order to manipulate optical signals. Redistribution of electrical interconnection is accomplished on both top and bottom surfaces of the substrate of the interconnect chip.

Abstract: An infinitely stackable interconnect device and method having the capability for electrical, thermal, optical, and fluidic interconnections to various layers. Through-substrate vias in the interconnect device are filled to enable electrical and thermal connection or optionally hermetically sealed relative to other surfaces to enable fluidic or optical connection. Optionally, optical components may be placed within the via region in order to manipulate optical signals. Redistribution of electrical interconnection is accomplished on both top and bottom surfaces of the substrate of the interconnect chip.