Abstract: Thermally conductive adhesive materials having a first metallic component with a high melting point metal; a second metallic component having a low melting point metal; a fatty acid, an optional amine, an optional triglyceride and optional additives. Also provided are methods of making the same and uses thereof for adhering electronic components to substrates.

Abstract: A method of a solar cell array arranged on the surface of a support by providing and utilizing an assembly fixture having a smooth, concave surface. An uncured supporting film composed of a composite material (such as a carbon fiber composite) is mounted directly on the back side of the solar cells; and the film of composite material is co-cured on the assembly fixture so that the array of interconnected solar cells is bonded to the supporting film. The bonded and cured film of composite material and an array of interconnected solar cells is then removed from the assembly fixture.

Abstract: Thermally conductive adhesive materials having a first metallic component with a high melting point metal; a second metallic component having a low melting point metal; a fatty acid, an optional amine, an optional triglyceride and optional additives. Also provided are methods of making the same and uses thereof for adhering electronic components to substrates.

Abstract: A method of fabricating an airfoil, and the airfoil or airfoil skin so fabricated, including a solar cell array arranged on the surface of the airfoil by providing and utilizing an assembly fixture having a smooth, concave surface. An uncured supporting film composed of a composite material (such as a carbon fiber composite) is mounted directly on the back side of the solar cells; and the film of composite material is co-cured on the assembly fixture so that the array of interconnected solar cells is bonded to the supporting film. The bonded and cured film of composite material and an array of interconnected solar cells is then removed from the assembly fixture.

Abstract: A method of fabricating a solar cell array on the surface of a support by providing an assembly fixture having a smooth, concave surface; mounting a film composed of ethylene tetrafluoroethylene (ETFE) directly on the surface of the fixture; mounting a film composed of a non-crosslinked silicone pressure sensitive adhesive directly over the ETFE film; mounting an array of interconnected solar cells directly over the adhesive film. An uncured supporting film composed of a composite material is mounted directly on the back side of the solar cells; and the film of composite material is co-cured so that the array of interconnected solar cells is bonded to the supporting film. The bonded and cured film of composite material and an array of interconnected solar cells with the ETFE film is then removed from the assembly fixture.

Abstract: High thermal conductivity sintered metallic networks are provided for enhancing the transverse thermal conductivity of fiber reinforced polymeric materials. The approach establishes sintered metallic networks in both the intratow and interlaminar regions of a FRP part after appropriate thermal processing Dispersing metallic nanoparticles into a fluxing polymeric resin, and optionally mixing in low and high melting point metallic particles, can establish continuous metallurgical networks through the thickness of a FRP laminate. The fluxing polymeric resin has the dual benefit of reducing native oxides on the metallic fillers to aid the sintering reactions, and also to tailor the rheological properties to yield usable material embodiments with limited impact on material density. The high intrinsic thermal conductivity of the metallic networks yields a FRP part with enhanced transverse thermal conductivity.

Abstract: A thermally conductive adhesive composition includes a powder of a high melting point metal or metal alloy, a powder of a low melting point metal or metal alloy, and a polymerizable fluxing polymer matrix composition having a polyepoxide polymer resin and a low-melting solid or liquid acid-anhydride and a polymer diluent or diluents with carbon carbon double bonds and/or functional hydroxyl groups. The ratio by weight of the low melting point powder to high melting point powder ranges from about 0.50 to about 0.80, and may range from about 0.64 to about 0.75, and may be 0.665. Heretofore unpredicted substantially higher thermal conductivity improvements in performance have been found using these ratios of low melting point powder to high melting point powder.

Abstract: A thermally conductive adhesive composition includes a powder of a high melting point metal or metal alloy, a powder of a low melting point metal or metal alloy, and a polymerizable fluxing polymer matrix composition having a polyepoxide polymer resin and a low-melting solid or liquid acid-anhydride and a polymer diluent or diluents with carbon carbon double bonds and/or functional hydroxyl groups. The ratio by weight of the low melting point powder to high melting point powder ranges from about 0.50 to about 0.80, and may range from about 0.64 to about 0.75, and may be 0.665. Heretofore unpredicted substantially higher thermal conductivity improvements in performance have been found using these ratios of low melting point powder to high melting point powder.

Abstract: Nanoparticles of amorphous aluminum oxynitride or silicon oxynitride having a very high aspect ratio are used to fill polymeric materials to provide products that have an extremely low WVTR/OTR. Such products are particularly effective for incorporation into organic light-emitting devices or the like which are susceptible to degradation from moisture and/or oxygen. Pressure sensitive and/or thermosetting adhesives filled with such particles create excellent sealants. Polymeric sheets or films made from resin in which these nanoparticles are dispersed, or intimately associated with, before extrusion exhibit very low WVTR/OTR.